Tokyo Seimitsu Co., Ltd.
Manufactures and sells semiconductor manufacturing equipment and measuring instruments.
- 042-642-1701
- 042-642-1798
- 2968-2, Ishikawa-machi
Hachioji-shi, Hachioji-shi 192-8515
Japan
Categories
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product
Laser Interferometers
Measurements of the length displacement or yawing and pitching, measurements of rotation angles, measurements of overshoots during vibrations or when stopped and of uneven speed, etc. can be handled. Length measuring instruments can be used for a variety of purposes, including precise inspection of heavy duty equipment.
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product
Precision ACCRETECH Dicing Tools
Precision ACCRETECH Dicing Tools for precision cutting are derived from our unique development technology as well as our diverse application technology. We offer products that can cut a variety of materials, cover diverse cutting applications and satisfy today's requirement of "high quality & low cost".
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For Grinder And Lathe
We offer an abundant lineup such as the PULCOM series for in-process and post-process measurements, and the SBS products for the grinding wheel’s automatic balance system.
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Coordinate Measuring Machines
Tokyo Seimitsu is the pioneer that developed “Japan’s first coordinate measuring machine.” We respond to every need with a varied lineup to which we have added Carl Zeiss products linked to our products.
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Air Micrometers
As the pioneer of air micrometers and electric micrometers in Japan, we respond to a variety of needs for high precision production line measurements.
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CMP
CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials.
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Surface Texture And Contour Measuring Instruments/Systems
We provide high performance, easy-to-use systems from highly efficient hybrid types that can measure the surface roughness and the contour in one trace, to portable types that can be used even on the production site.
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High Rigid Grinder
High-rigidity grinder is the device to grind the hard and brittle materials such as sapphire and Sic substrates that are considered to be hard-to-cut materials.
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X-ray CT System
The surface and the internal parts, in one measurement. We provide “Dimensional X-ray CT System” that does not only observe the interior of the workpiece, but that can also perform high precision, contactless measurements.
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Auxiliary Equipment For Dicing Machines
We have a lineup of package singulation machines, automatic cleaning systems, chillers, etc. that support the dicing process.
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Wafer Demounting And Cleaning Machines
Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
Children
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Tosei Engineering Corp.
Repair and technical services for measurement testing equipment, precision equipment, industrial tools, jigs, gauges and electrical equipment. Sale of system products and provision of related repair and technical services. Manufacture and sale of automation and labor saving devices for industrial processes such as measurement, automated measurement, automated assembly, and automated sorting. Manufacture and sales of semiconductor manufacturing equipment. Provision of comprehensive services in all the foregoing areas.
