Teledyne DALSA
DALSA Corporation is an international high performance semiconductor and electronics company that designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized wafer foundry services.
- 519 886 6000
- 519 886 8023
- sales.americas@dalsa.com
- 605 McMurray Road
Suite 142
Waterloo, Ontario N2V 2E9
Canada
Categories
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product
Xineos Large Area Detectors
As a leader in CMOS innovation, Teledyne DALSA developed the Xineos to deliver three times more sensitivity and five times more signal-to-noise performance than other standard technologies at equal X-ray dose conditions. CMOS image detectors offer numerous advantages including the ability to record smaller image details with higher resolutions – allowing for the diagnostics of medical anomalies at earlier stages, and significantly increasing the probability of early intervention, patient recovery, and reduced treatment costs.
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Xtium Frame Grabber Family
The Xtium series delivers higher bandwidth to sustain Camera Link 80-Bit modes over longer cable distances and supports a wide variety of area and line scan color and monochrome cameras, all in a compact, single slot solution.
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Industrial X-Ray
Teledyne DALSA offers powerful, innovative CCD and CMOS X-Ray detectors combining industry-leading performance with cutting-edge features for industrial and scientific applications such as NDT (non destructive testing) in evaluation, troubleshooting, research, and quality control.
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Area Scan Camera
Genie Nano-CXP
Introducing Genie Nano-CXP, a camera designed for full-throttle performance. Genie Nano-CXP builds on Nano's proven, industry leading reputation and leverages a CoaXPress 6Gbps interface to deliver the maximum throughput from leading edge high resolution CMOS image sensors.
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Large-Area CMOS X-Ray Detector
Rad-icon
Teledyne DALSA’s Rad-icon product family of large-area digital x-ray cameras offers users a high-speed, high-performance x-ray imaging detector with a fast, reliable PC interface (either GigE or CameraLink) for easy integration.
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Vision System
GEVA 400
The GEVA 400 system offers excellent cost savings for multi-camera vision applications, such as final inspection of large assemblies. The four Power-over-Ethernet (PoE) compliant Gigabit camera ports are compatible with a wide range of Genie Nano GigE cameras. Adding cameras is easy with commercially available network technologies, allowing for large configurations at much lower system costs. The GEVA 400 features the latest Intel® quad-core ATOM™ architecture, and offers low power consumption and solid performance for a wide range of machine vision applications
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3D Profile Sensor
Z-Trak2
Z-Trak™2 is a new family of 3D profile sensors built on Teledyne Imaging’s 3D image sensor technology, ushering in a new era of 5GigE 3D profile sensors for high-speed, in-line 3D applications.
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Area Scan Camera
Genie Nano-CL
Introducing Genie Nano, a CMOS area scan camera that redefines low cost performance. Genie Nano starts with industry leading CMOS sensors and adds proprietary camera technology for breakthrough speed, a robust build quality for wide operating temperature, and an unmatched feature set--all at an incredible price.
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Complete Vision System
BOA2
Introducing BOA2: a complete vision system in one smart camera. Featuring our highest smart camera resolution yet, BOA2 combines lighting, image capture, processing, and easy-to-use embedded vision software into a convenient single device with a variety of I/O and mounting options.
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Xtium2 Frame Grabber Family
The Xtium2 series leverages the PCIe Gen3 x8 platform to deliver high- speed image transfers to host memory without CPU overhead. Featuring Camera Link HS® interface standards, supports Active Optic Cable and SFP+ modules, CoaXpress® 12, and Camera Link®.
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Vision Sensor
BOA Spot
Introducing BOA Spot: simple, affordable, and reliable performance for quality inspection. No matter what you create on your production line, BOA Spot can help you improve quality, reduce scrap, and increase throughput. It has never been so easy for you to expand your automation with vision.
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Vision Software
These “all-in-one” software products have been deployed in thousands of installations around the globe, providing advanced tools, design flexibility and system versatility to suit diverse application needs across all industries. Built to run on our smart camera and multi-camera vision systems, our easy-to-use iNspect and Sherlock design platforms save you time and reduce vision development costs without compromising system performance or reliability.
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Xcelera Frame Grabber Family
The Xcelera Series leverages the PCI Express (PCIe) platform to bring traditional image acquisition and processing technology to new levels of performance and flexibility. This unified and scalable platform currently supports high-performance Camera Link™ cameras.
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CCD Foundry Services
Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.





































































