Teledyne DALSA
DALSA Corporation is an international high performance semiconductor and electronics company that designs, develops, manufactures and markets digital imaging products and solutions, in addition to providing specialized wafer foundry services.
- 519 886 6000
- 519 886 8023
- sales.americas@dalsa.com
- 605 McMurray Road
Suite 142
Waterloo, Ontario N2V 2E9
Canada
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Product
Xineos Large Area Detectors
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As a leader in CMOS innovation, Teledyne DALSA developed the Xineos to deliver three times more sensitivity and five times more signal-to-noise performance than other standard technologies at equal X-ray dose conditions. CMOS image detectors offer numerous advantages including the ability to record smaller image details with higher resolutions – allowing for the diagnostics of medical anomalies at earlier stages, and significantly increasing the probability of early intervention, patient recovery, and reduced treatment costs.
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Product
Compact Uncooled LWIR Cores
MicroCalibir
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The latest advances in the integration of our in-house 12 μm microbolometer pixel technology with a deep-ADC ROIC circuit have resulted in the development of the small and lightweight MicroCalibir™. This compact, low-power uncooled thermal camera platform features the smallest VGA IR core module on the market making it ideal for OEM drones, handhelds, helmet-mounted and vehicular integration products.
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Product
Line Scan Camera
Piranha4
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The Piranha4 cameras offer advanced features such as sub-pixel spatial correction, areas of interest (up to 4 at a time) to reduce data processing and simplify cabling, as well as dual-line area mode to double line rate, HDR mode, shading and lens correction. The Piranha4 is built for the real world with features to ease system integration. The advanced GenICam compliant user interface makes it easy to set up and control camera parameters such as exposure control, FFC, white balance, gain, test patterns, diagnostics and more.
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Product
Vision Systems
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Our GEVA vision systems offer the performance and flexibility to inspect multiple parts, assemblies or surfaces at the same time. These systems are equipped with multi-core processors, high-speed camera ports and versatile I/O options to match your application and factory integration requirements.
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Product
Xtium2 Frame Grabber Family
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The Xtium2 series leverages the PCIe Gen3 x8 platform to deliver high- speed image transfers to host memory without CPU overhead. Featuring Camera Link HS® interface standards, supports Active Optic Cable and SFP+ modules, CoaXpress® 12, and Camera Link®.
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Product
Smart Vision System
VICORE
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This versatile system offers excellent performance for inspection applications using traditional 2D imaging, thermal imaging, 3D imaging or a combination thereof. Its small, book style format consumes minimal cabinet space and provides convenient, front-accessible connections for cameras, I/O and system components. This includes a dedicated industrial Ethernet port that offers efficient communication with complementary factory devices using Ethernet/IP or Profinet.
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Product
Cameras
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Teledyne DALSA offers powerful, innovative CCD and CMOS cameras combining industry-leading performance with cutting-edge feature sets and value
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Product
Mixed-Signal Design
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Teledyne DALSA’s mixed-signal group, formerly known as Axiom IC, delivers high-performance, high-quality data-converter designs and IP blocks for the industrial, professional, scientific, imaging and audio markets. Based in the Kennispark business and science park in Enschede, The Netherlands, the group works in close cooperation with the University of Twente and supports PhD students and trainees to stay involved in the newest CMOS design methodologies and technologies.
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Product
Xineos Scanning
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Teledyne DALSA's leadership in CMOS innovation lets our Xineos scanning products deliver three times more sensitivity and five times more signal-to-noise performance than other standard technologies at equal X-ray dose conditions. CMOS image detectors offer numerous advantages including the ability to record smaller image details with higher resolutions – allowing for the diagnostics of medical anomalies at earlier stages, and significantly increasing the probability of early intervention, patient recovery, and reduced treatment costs.
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Product
Area Scan Camera
Genie Nano-CL
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Introducing Genie Nano, a CMOS area scan camera that redefines low cost performance. Genie Nano starts with industry leading CMOS sensors and adds proprietary camera technology for breakthrough speed, a robust build quality for wide operating temperature, and an unmatched feature set--all at an incredible price.
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Product
Scanning X-Ray Detectors
Shad-o-Scan
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Shad-o-Scan is a family of scanning X-ray detectors specifically designed for the challenging requirements of high-performance industrial and scientific X-ray applications. Industry-leading TDI CCD performance enables the ultimate sensitivity and highest resolution in the industry, and ensures long detector lifetime in even the harshest radiation environments.
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Product
CL+ PX8 Full Frame Grabber
Xcelera-CL+ PX8 Full
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The X64 Xcelera-CL+ PX8 Full has been built within Teledyne DALSA’s Trigger-to-Image Reliability technology framework. Trigger-to-Image Reliability leverages Teledyne DALSA’s hardware and software innovations to control, monitor and correct the image acquisition process from the time that an external trigger event occurs to the moment the data is sent to the host, providing traceability when errors do occur and permitting recovery from those errors.
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Product
CCD Foundry Services
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Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
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Product
Xcelera Frame Grabber
Xtium-CLHS PX8
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Building on the field proven capability of Teledyne DALSA’s Xcelera frame grabber series, the Xtium™-CLHS PX8 is based on AIA’s CameraLink HS standard and uses PCI Express™ Gen 2.0 expansion bus to deliver high speed image acquisition and image transfer to the host memory. Xtium-CLHS uses industry standard CX4 cable to delivery up to 2.1 GB/s of image acquisition over a single cable to go beyond 15m and host transfer speeds of up to 3.2GB/sec - all in a compact, half-length, single slot solution.
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Product
Line Scan Camera
Linea SWIR
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Teledyne DALSA’s short-wave infrared (SWIR) GigE line scan camera features a cutting-edge InGaAs sensor in a compact package for a wide variety of machine vision applications.This high speed, high resolution camera is the first product in DALSA’s SWIR family. Linea SWIR features a cutting-edge InGaAs sensor in a compact package that is suitable for a wide variety of applications. With exceptional responsivity and low noise, this camera allows customers to see their products like never before. Linea SWIR is available as a 1k resolution camera with highly responsive 12.5 µm pixels, or a 512 resolution camera with larger 25 µm pixels





































































