Failure Analysis
examination of faults, determine root cause and recommend corrective actions.
See Also: Crush, Performance Testing, Investigation
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Product
Network Surveillance System
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The network backbone contains a wealth of information that can be monitored and collected to support diagnostic, troubleshooting, and fraud prevention activities. Surveillance of network characteristics is becoming more important than ever before. Few important aspects of network surveillance include, Performance Monitoring, Security, Fraud Prevention, Physical Layer monitoring, Billing Verification, Remote Protocol Analysis, Failure Prediction, Traffic Engineering, Call Quality Monitoring and Troubleshooting.
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Product
Atomic Force Microscope
NX-Hivac
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Park NX-Hivac allows failure analysis engineers to improve the sensitivity of their measurements through high vacuum Scanning Spreading Resistance Microscopy (SSRM). Because high vacuum scanning offers greater accuracy, better repeatability, and less tip and sample damage than ambient or dry N2 conditions, users can measure a wide range of dope concentration and signal response in failure analysis applications.
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Material Analysis Laboratory
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Trialon’s world class Material Analysis Laboratory consists of state-of-the-art equipment and experienced staff. Our specialty is to determine failure analysis of design, material, process and root cause in both current and future products across multiple industries.
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Product
Root Cause Failure Analysis
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Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Materials And Chemical Analysis
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Anderson Materials Evaluation, Inc.
Materials characterization, failure analysis, quality control, and materials and process development services are offered. Our analytical techniques allow us to assess elemental and chemical material composition, thermal properties, coating thickness, electrochemical properties, surface chemistry, surface wetting, corrosion rates and pitting potentials, contamination and degradation problems, metallography, fractography, phase transitions, static coefficient of friction, adhesive bonding strength and causes of adhesive bonding failures, surface tension and surface energy, tensile and compressive strength, bend deflection, lapshear strength, elasticity properties, UV and visible light absorption and reflection, density and porosity, and many other material properties integral to improving your products.
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Product
Resistive AC Load Bank
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AC load bank testing offers you whole solutions of predictive failure analysis for UPS(uninterrupted power supply), generator, transformers, PV system, inverter etc, to validate the condition and output of such power systems comprehensively. Integrated AC & DC load bank could be made in one unit or separately with different load voltages as per your need for different applications.
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Product
Internal Vapor Analyzer
IVA® MODEL 210S
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The IVA® system is specifically designed for the quantitative analysis of low molecular weight gases contained in hermetic packages, cavities and other enclosures. The Model 210s concept integrates automated hardware with easy-to-use icon-driven software. Its design permits routine quality control, failure analysis and research level testing operation as a turn-key analytical system.
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Scanning Electron Microscope w/ EDX Laboratory
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Trialon has the equipment and experienced staff to operate this highly technical piece of laboratory equipment. Our state-of-the-art materials analysis lab located in Auburn Hills, MI is managed by a Ph.D with over 20 years of hands-on experience in root cause failure analysis of design, material and process for current and future products.
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Product
Scanning Electron Microscope (SEM)
Prisma E
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Prisma E scanning electron microscope (SEM) combines a wide array of imaging and analytical modalities with new advanced automation to offer the most complete solution of any instrument in its class. It is ideal for industrial R&D, quality control, and failure analysis applications that require high resolution, sample flexibility and an easy-to-use operator interface. Prisma E succeeds the highly successful Quanta SEM.
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Failure Analysis – Materials
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Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Product
PWB Interconnect Stress Test
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PWB Interconnect Solutions Inc.
Services to test the reliability of Printed Circuit Boards. PCBs).Coupon Inspection and Electrical Prescreen. Coupon Testing. Failure Location via I/R Photo Imagery. Failure Analysis.
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Plasma Profiling TOFMS
PP-TOFMS
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Plasma Profiling TOFMS addresses the needs of materials scientists across a wide range of application areas. PP-TOFMS provides fast elemental depth distribution of any inorganic material. The speed and ease of use of PP-TOFMS permit to reduce optimization time of growth processes as many research scientists strive to reduce the time from discovery to applications of new materials.The simultaneous full coverage of TOFMS available for each point of depth permits the detection of non suspected contamination. This is key for failure analysis and optimization of thin film processes that tend to no longer be based on ultra-high grade methods (i.e. ink jet printing…).
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Product
High-resolution, Portable AXI System
AXI X1# Series
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The X1# is a high-resolution, low-footprint and portable AXI system. It is a dedicated platform for FATP and advanced failure analysis applications in connection with smart devices.
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Data Reduction
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Data reduction systems with or without time history recording to throughput disc are frequently used in critical aerospace testing applications where complete measurements of a high number of channels are required for post-test and possible failure analysis. The m+p VibControl data reduction system configurations are tailored to the specific needs of high-performance measurement applications requiring hundreds or thousands of input channels.
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Product
MPI Automated Probe Systems
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MPI Advanced Semiconductor Test
MPI’s 200 mm and 300 mm automated probe systems are dedicated and designed to address current and future requirements for all facets of Device Characterization for Modeling and Technology/Process Development, Failure Analysis, Design Verification, IC engineering, Wafer Level Reliability as well as special requirements for MEMS, High Power, RF and mmW device testing.
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Product
Acoustic Microscope
AMI D9650Z
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The D9650Z incorporates the latest C-SAM technology with enhanced features to accommodate the testing of Power Modules as well as performing standard C-SAM operations. This new system configuration is optimized for inspection of heatsink bond integrity, thickness of bond layer and wire bond welds. Powered by our Sonolytics software platform with PolyGate technology, the D9650Z is ideal for failure analysis, process development and QC screening in low-volume production environments.
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Product
FTIR Spectrometers
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FTIR spectroscopy is used to quickly and definitively identify compounds such as compounded plastics, blends, fillers, paints, rubbers, coatings, resins, and adhesives. It can be applied across all phases of the product lifecycle including design, manufacture, and failure analysis.
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Real-time X-ray Inspection System
JewelBox 70T™
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The JewelBox-70T delivers superior image quality with excellent resolution and sensitivity for laboratory and failure analysis applications. The system’s 10-micron MicroTech™ x-ray source provides magnification from 7X to 2000X, with resolution of 100 line pairs/mm.
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Product
Microelectronic Services
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Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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Product
Inspection Microscope
Z-NIR
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The McBain Z-NIR Near Infrared Inspection System is best-in-class for wafer-to-wafer and die-to-die alignment measurement and verification. This unique tool has been sold into many industries with various applications including sub-surface wafer and die inspection for cracks and bond integrity, MEMS, wafer bonding, 3-D chip stacking, failure analysis, process development, tool verification, part characterization, environmental testing and more.
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Product
Standard Electromagnetic Vibrator
KD-9363-EM
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King Design Industrial Co., Ltd.
The purpose of vibration testing is to make a series of controllable vibration simulation in lab, no matter generated by natural or man-made vibration environment; such as waves, tidal flaps, wind, earthquake or rain and so on. It is to test if the product is capable of sustaining the vibration environment exerted from transporting or usage along its effective life cycle; and certify the standard of design & functional requirement of product. The value of vibration testing is to confirm the reliability of products and effectively screen out the bad products in factory; avoiding damages occurred at arrival; and to assess the failure analysis on the non-performing products; expecting to reach a high standard, high-reliability products. The vibration test stresses on the continuity and fatigue; and contributes to the understanding of product’s status under vibration circumstance in a normal environment; and avoids the product’s unpredictable damage caused under certain vibrating frequency for a long time.
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Product
ISDD Tool Suite
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The Integrated System Diagnostic Design or ISDD Tool Suite provides a start to finish solution for meeting all the diagnostic needs of system design. The ISDD design process is centered around functional modeling of systems which is used to develop the diagnostics and failure analysis necessary to fully support good system design. This includes: *Analysis of Fault Detection and Fault Isolation.*Analysis of critical failures and their impact upon safety.*Detecting and reducing false alarms caused by diagnostics.*The impact of prognostics upon fault detection/fault isolation and mitigation of critical failures.*Development of vehicle health management and troubleshooting diagnostics
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FEA Software
Helius PFA
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Helius PFA software provides powerful tools for enhanced FEA (finite element analysis) of composite structures, including progressive failure analysis.
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Product
X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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Product
Shake Table Testing
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Response Dynamics Vibration Engineering, Inc.
Shake table testing is often used in prototype analysis, failure analysis, shipping vibration testing and vibration sensitivity testing. We know what boundary conditions are vital for effective testing, how and where to instrument the system, how to deal with for off axis excitation (often not accounted for), and make the most efficient use of testing time. Let us have a look at your system and any specified vibration criteria before the shake test is designed. We can interpret the criteria, make sure it is applied appropriately, and make recommendations that will save valuable time and expense.
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Analytical Probe Station with Laser Cutting System
LCS- 4000 Series
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The LCS-4000 Probe Station with Integrated Laser Cutting System gives the user maximum flexibility in semiconductor diagnostic cutting, failure analysis, trimming, marking and topside layer removal. All of these functions can be performed on a microscopic level, all on this one system which provides a high level of performance that is remarkably easy to use.
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Thermal Image Analysis Software
Thermalyze
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Thermalyze software provides a stable platform from which to perform sophisticated temperature analysis and failure analysis testing. Tools such as Emissivity Tables allow you to perform true temperature mapping on the surface with varying emissivity. Lock-in thermography tests enable you to detect heating below 0.001°C.
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Electronics Failure Analysis System
Sentris
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Due to the continued decrease in integrated circuit feature size and supply voltages, detecting and locating the miniscule amount of heat generated by failure sites has become increasingly difficult. Sentris pinpoints low-level infrared thermal emissions from IC faults such as short circuits and leakage current.
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Failure Analysis
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A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Analytical Techniques
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Anderson Materials Evaluation, Inc.
Our numerous analytical techniques, we tackle a wide range of materials challenges and commonly combines several analytical techniques to fully address complex and multi-dimensional materials issues. Our materials analysis laboratory provides XPS surface analysis, thermal analysis (TGA, DSC, TMA), FTIR infrared spectroscopy, UV-Vis spectrophotometry and reflectivity measurements, gas chromatography – mass spectroscopy (GC-MS), SEM/EDX, optical microscopy, mechanical testing, electrochemistry and corrosion analyses, residual gas mass spectroscopy, contact angle measurements, surface contamination measurements, adhesive bonding failure analysis, facility testing for silicone contamination, mechanical testing, metallography and fractography, density and porosity measurements, volatile organic component testing, friction, and other analytical capabilities. We continue to upgrade and expand our arsenal of analytical techniques and custom analytical methods to support our customers’ needs.
