Particle Size
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Product
COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
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ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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Product
SMARC® Short Size Module with Intel® Atom™ Processor E3800 Series System-on-Chip
LEC-BTS
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- Single, dual or quad-core Intel® Atom™ Processor E3800 Series System-on-Chip- Up to 4 GB DDR3L at 1066/1333 MHz (non-ECC)- HDMI and LVDS- GbE, camera interface- 1x SATA 3Gb/s, 1x USB 3.0, 3x USB 2.0, max. 12x GPIO- Extreme Rugged™ operating temperature: -40°C to +85°C
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Product
SMARC Short Size Module with Intel® 6th Gen. Atom® x6000 Processors (formerly codename: Elkhart Lake)
LEC-EL
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The ADLINK LEC-EL is a SMARC module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high speed interfaces. LEC-EL modules support up 8GB LPDDR4 memory, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Silicon Charged Particle Radiation Detectors
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ORTEC introduced the first silicon surface barrier detectors for charged particle spectroscopy in the early 1960’s. Since then, ORTEC has expanded the product line with more than ten different options to choose from.
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Product
Chassis Rugged Slide Rail Size 5
CAE016383
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Securely locked in extended position. The chassis/cabinet mounted slide rails are ultra rugged and hold significantly more weight and can withstand shock and vibration in harsh environments.
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Product
Particle Impact Noise Detector
BW-LPD-D4000
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FREQUENCY: SINE WAVE 27Hz TO 265HzACCELERATION: 0 TO 20G PEAKSHAKER: 100 FORCE LBS 3/4" IN STROKE 75 IN PER/SEC VELOCITYAMPLIFIER: 250 WATTS MINIMUMD.U.T. WEIGHT: 300 GRAMS PRACTICAL LIMIT @ 20G
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Product
Qseven® Standard Size Module with Intel Atom® E3900, Pentium® N4200 and Celeron® N3350 Processor (codename: Apollo Lake)
Q7-AL
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The Q7-AL Computer-On-Module (COM) combines the QSeven® 2.1 standard with the Intel (“Apollo Lake”) Atom® E-series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high pin/area density requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Small size non-steady-state probe for thermal conductivity measurement
TP08
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Hukseflux Thermal Sensors B.V.
TP08 is a probe that offers the possibility to perform a practical and fast measurement of the thermal conductivity (or thermal resistivity) of the medium in which it is inserted at a high accuracy level. It works in compliance with the ASTM D 5334-00, D 5930-97 and IEEE 442-1981 standards. The TP08 is a small version of type TP02, made for situations where the length of the TP02 poses a problem. The standard TP08 probe has proven its suitability for soils, thermal backfill materials, sediments, foodstuff, powders, sludges, paints, glues and various other materials.
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Product
COM Express® Basic Size Type 6 Module with Hexacore Mobile 9th Gen Intel® Xeon®, Core™, Pentium® and Celeron® Processors
Express-CFR
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The Express-CFR is COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 9th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake Refresh-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
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ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
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Product
Rugged COM-HPC Server Type Size E Reference Development Platform Based On Ampere® Altra® SoC
Ampere Altra Developer Rugged
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The rugged 4U rackmount server platform provides a cloud-native environment for embedded edge development. It can host the SOAFEE (Scalable Open Architecture for Embedded Edge) providing a cloud-native environment for embedded edge development and is compatible with Autoware Foundation's Autoware Open AD Kit. It supports the open source EDKII as bootloader with UEFI, so customers can just download a stock AArch64 (arm64) ISO such as Ubuntu and install it through booting a live ISO directly on the target. The same convenience we have become used to by using x86 / amd64 target systems.
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Product
Pocket Sized Dial Thermometer w/ 5 Inch Stem
T220
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UEi Test & Measurement Instruments
Farenheit scalel thermometer with 1 inch dial and 5 inch stem with a 0˚ to 220˚F range
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Product
Surface Area & Pore Size Distribution
BELSORP
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These instruments are used to evaluate the specific surface area and pore size distribution of various solid materials such as powders, fibers, membranes, substrates and molds by gas adsorption and mercury intrusion.
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Product
COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
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The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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Product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
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ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Chassis Slide Rail Size 3
CAE014621
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Securely locked in extended position. The chassis/cabinet mounted slide rails are ultra rugged and hold significantly more weight and can withstand shock and vibration in harsh environments.
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Product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
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The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
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Product
Pocket Sized Dial Thermometer w/ 5 Inch Stem
T160/3
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UEi Test & Measurement Instruments
Farenheit scale thermometer with 1 3/4 inch dial and 5 inch stem with a -40˚ to 160˚F range
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
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The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
Aerodynamic Particle Sizer (APS)
3321
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The Aerodynamic Particle Sizer® 3321 (APS™ spectrometer) provides high-resolution, real-time aerodynamic measurements of particles from 0.5 to 20 microns. These unique particle sizers also measures light-scattering intensity in the equivalent optical size range of 0.37 to 20 microns. By providing paired data for each particle, the APS spectrometer opens up exciting new possibilities for those interested in studying the makeup of an aerosol.
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Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
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ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
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The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
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The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
Magnetic Particle Liquid Checker
S-2A / S-2B
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Magnetic particle liquid checker S-2 series is a test bar which can directly check the quality of magnetic particle liquid immediately. Magnetic particle liquid checker S-2A type has a sensor at the head of straight test bar.
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Product
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
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The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
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- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Product
SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
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- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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Product
SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
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ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
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Product
COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
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ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
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Product
PXI-6115, 4 AI (12-Bit, 10 MS/s/ch), Buffer Size 16MS, 2 AO, 8 DIO, PXI Multifunction I/O Module
778194-01
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4 AI (12-Bit, 10 MS/s/ch), 2 AO, 8 DIO, PXI Multifunction I/O Module - The PXI‑6115 is a simultaneous sampling, multifunction DAQ device. It offers analog I/O, digital I/O, two 24‑bit counters, and digital triggering. It is ideal for a variety of applications, such as stimulus/response applications where synchronization among analog input, analog output, and digital I/O is required, 42 V automotive applications, radar, sonar, and ultrasound. The included NI‑DAQmx driver and configuration utility simplify configuration and measurements.
