Particle Size
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Product
COM Express Mini Size Type 10 Module with Intel Atom® x6000 Processors (formerly codename: Elkhart Lake)
nanoX-EL
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The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE) as well as Intel® Pentium® and Celeron® N and J series processors (formerly Elkhart Lake) with integrated Intel® UHD graphics at a and high speed interfaces. nanoX-EL modules support LPDDR4 memory with in-band ECC up to 16GB, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
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ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
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The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Product
Magnetic Particle Flaw Detector
MT-1B
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MT-1B magnetic particle flaw detector adapts high-capacity lithium battery pack, converse DC to AC through variable-frequency, providing magnetic powder flaw detector with magnetic power supply. With low power consumption, it can continuous work more than four hour after charging. It especially suits for working in the wild and aerial area.
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Product
6U cPCI / PXI / PXIe 6021 Full Size Chassis
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The WIENER 6021 crate series can be outfitted with cPCI, PXI or PXIe backplanes to provide high performance chassis with highly reliable low-noise power supplies for these bus standards. Typical applications are data acquisition, beam line control and test instrumentation.
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Product
Break The Rules Of Power, Size And Cost In Your Connectivity And Acceleration Applications
ECP5 / ECP5-5G
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*Up to 3.2 Gbps SERDES rate with ECP5, and up to 5 Gbps with ECP5-5G*Up to 4 channels per device in dual channel blocks for higher granularity*Enhanced DSP blocks provide 2x resource improvement for symmetrical filters*Single event upset (SEU) mitigation support*Programmable IO support for LVCMOS 33/25/18/15/12, XGMII, LVTTL, LVDS, Bus-LVDS, 7:1 LVDS, LVPECL and MIPI D-PHY input/output interfaces
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Product
Aerodynamic Particle Sizer (APS)
3321
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The Aerodynamic Particle Sizer® 3321 (APS™ spectrometer) provides high-resolution, real-time aerodynamic measurements of particles from 0.5 to 20 microns. These unique particle sizers also measures light-scattering intensity in the equivalent optical size range of 0.37 to 20 microns. By providing paired data for each particle, the APS spectrometer opens up exciting new possibilities for those interested in studying the makeup of an aerosol.
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Product
SMARC® 2.1 Short Size Module With Intel® Core™ I3 Processors, Intel® Processors N Series And Intel® 7th Gen Atom® X7000E Processors
LEC-ALN
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The ADLINK LEC-ALN is a SMARC module that supports up to 8 cores Intel® Core™ i3 (i3-N305, i3-N300) Processors, Intel® Processors N Series (N97, N50) and Intel® Atom® x7000E (x7425E, x7213E, x7211E) Processors (formerly Alder Lake-N) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ALN modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
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ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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Product
Non-Destructive Particle Monitoring
PARTi
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PARTi provides a complete solution for non-destructive surface particle monitoring of consumables, parts and cleanroom apparel.
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Product
COM Express Rev. 3.1 Basic Size Type 6 Module with 13th Gen Intel® Core™ Mobile Processor
Express-RLP
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ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
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The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
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The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
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Product
Surface Area & Pore Size Distribution
BELSORP
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These instruments are used to evaluate the specific surface area and pore size distribution of various solid materials such as powders, fibers, membranes, substrates and molds by gas adsorption and mercury intrusion.
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Product
COM Express® Basic Size Type 6 Module with Up to Hexacore 8th Gen Intel Core™ 8000 Series and Intel Xeon® Processors (formerly codename: Coffee Lake-H)
Express-CF/CFE
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The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3800 Series SoC or Celeron Processors (formerly Bay Trail)
nanoX-BT
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The nanoX-BT is a COM Express COM.0 R2.1 Type 10 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).
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Product
Particle Analyzers
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Teilch Particle Analyzers have proven significant advantages when compared to competitors’ solutions. Innovations in light source, flow control, analog and digital signal processing, components integration and software allow Teilch to provide a state of the art system for precision particle analysis.
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Product
Intelligent Double Sized H009 Interface Module for Excalibur 8000 Family of Carrier Boards
M8KH009
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The M8KH009 is an intelligent, double-sized, H009 interface module for the multimode, multiprotocol, EXC-8000 family of carrier boards. The M8KH009 provides a complete solution for developing and testing H009 interfaces and performing system simulation of the H009 bus, according to the standard H009 protocol. Each module of the M8KH009 contains 32K x 16 dualport RAM for Data Blocks, control registers, and Look-up tables. In addition, the module contains another 32K x 16 dual-port RAM for a Concurrent Monitor. All data blocks and control registers are memory mapped, and may be accessed in real-time. Each of the independent, dual-redundant M8KH009 modules may be programmed to operate in one of three modes of operation: Central Control Complex (CCC) mode with Concurrent Peripheral Unit operation (1–16 PUs), Peripheral Unit mode (Multiple – up to 16 PUs) and Bus Monitor mode. In addition, the module can simultaneously operate as an independent Internal Concurrent Monitor in CCC, Multiple PU or CCC/Concurrent PU modes.
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Product
Miniature Size - AC Operation
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Columbia Research Laboratories
The M Series of LVDT's designed by Columbia Research Labs are ideal for use on small, high-speed mechanisms and in sensitive low-displacement applications. Linear motions over the ranges of +/-0.003" to +/-0.150" are translated into precisely proportional voltage for measurement and control.
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Product
Timer Counter, Particle, 0 °C, 50 °C, 6, 0% to 100%, 5000, Concentration, Cumulative, Differential
72-10190
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Measure air particles, temperature (IR and air), with this affordable air quality tester for environmental and safety testing.
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Product
Magnetic Particle Inspection
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Is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
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The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
SMARC Short Size Module with NXP i.MX 8M Mini SoC
LEC-IMX8MM
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ADLINK LEC-IMX8MM, the first SMARC revision 2.1 compliant module offering superior power efficiency, is based on the low-power NXP i.MX 8M Mini processor (dual or quad core Arm Cortex-A53) with integrated Vivante GC NanoUltra graphics for improved processing capabilities. The LEC-IMX8MM is your ideal, cost-effective solution for various general-purpose edge and IoT applications.
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Product
Pocket Sized Celsius Scale Dial Thermometer w/ 5 Inch Stem
TC70
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UEi Test & Measurement Instruments
Celsius scale thermometer with a 1 inch dial and a 5 inch stem with a -40˚ to 70˚C range
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Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
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ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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Product
COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
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The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Product
Swing Mill with Soundproof Enclosure for Sample Sizes 2 - 100 Grams
Disc Grinder 8530
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Ring & Puck mill with sound-proof enclosure that accommodates sample sizes ranging from 2 - 100 grams. Ideal for pulverizing dry, brittle samples and slurry grinding. CE Approved.
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Product
COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
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The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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Product
COM Express Compact Size Type 6 Module Intel Atom® E3900 series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
cExpress-AL
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The cExpress-AL is a COM Express® COM.0 R3.0 Type 6 module supporting the Intel Atom® processor, Intel® Pentium® processor and Intel® Celeron® processor system-on-chip (SoC). The cExpress-AL is specifically designed for customers who need optimized processing and graphics performance with low power consumption in a long product life solution.
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Product
COM Express® Basic Size Type 2 Module with 6th Gen Intel Core™, Intel Xeon® and Intel Celeron® Processors (formerly codename: Sky Lake-H)
Express-SL2
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ADLINK announces a new COM Express Type 2 Computer-on-Module, based on the highly popular Intel® Core processors (formerly codenamed Skylake and Kaby Lake). The Express-SL2/KL2 supports all type 2 related legacy I/O and thereby allows customers to extend the production life of existing type 2 based systems for at least another 10 years.
