Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Biofuels Testing and Inspection
Intertek delivers assurance, testing, inspection and certification services to refiners, producers, blenders, distributors, consumers and research institutes across the world.
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Lithium Battery Inspection Tester
C19
Fuzhou Fuguang Electronics Co., Ltd.
C19 series is a portable tester which can quickly inspect battery pack of two-wheel vehicles. It can realize quick inspection and selection of SOH data of battery pack and discharge-charge maintenance. Data can be transferred to the mobile phone APP through Bluetooth forming a statistics report and faulty cell warnings so that further maintenance solutions can be developed in time.
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Solder Paste Inspection
3D SPI
Checking all the relevant points in the production process is essential, especially in terms of analyzing the causes of defects, fixing them, and – most importantly – preventing them in the future. That’s why solder paste printing is of fundamental importance for manufacturing complex assemblies: If paste printing isn’t performed correctly, the defect can impact the subsequent assembly and the soldering process, resulting in a tilted component or a poor or missing solder joint.
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3D Inspection Service
The reference data may come in the form of a table, with values at specific points or features, a cad model, or 3d scan. 3D inspection services may require datum measurements, where the part to be inspected is located in a fixture that is specifically designed to orient the part by an ordered method. In some cases, the part may have features that are designed specifically to be referenced by datums, if no functional feature of the part provides a clear reference.
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Testing, Inspecting & Cleaning Kit
KI-TK033
850/1300 nm source & power meter, inspection microscope, cleaning materials. Interchangeable MPO, SC, LC connectors
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Defect Inspection Systems
Candela® defect inspection systems detect and classify a wide range of critical defects on compound semiconductor substrates (GaN, GaAs, InP, sapphire, SiC, etc.) and hard disk drives, with high sensitivity at production throughputs.
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Wafer Thickness, TTV, Bow and Warpage
ALTO-TTV FAMILY OFFERS THE SPEEDY MEASUREMENT OF WAFER GEOMETRY PARAMETER, MORE IMPORTANTLY, WE CAN AUTOMATE THE TOOL TO HANDLE FROM THIN WAFERS TO PERFORATED, WARPED, BUMPED, AND TAPE-FRAMED WAFERS. OPTIONAL SORTER AND SHIPPING JAR UNPACKING FUNCTION AVAILABLE.
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X-Ray Inspection System
MXI Quadra 5
Quadra™ 5 is the X-ray inspection system of choice for sub micron applications such as PCB and semiconductor package inspection, counterfeit component screening and finished goods quality control.
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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Anritsu DualX Inspection Systems
The new DualX inspection system from Anritsu offers unsurpassed detection of high-density foreign material, including small bone fragments. Built on Anritsu's groundbreaking, field-proven original model, the DualX gives you the best detection capability available in the industry, along with a significantly lower total cost of ownership (TCO).
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AOI/SPI Inspection Systems
Dou Yee Enterprises (S) Pte Ltd
Dou Yee Enterprises AOI/SPI Inspection Systems
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3D Inspection Software
Metrolog X4
Metrolog X4 architecture is designed not only to benefit from current computer and OS technologies (Windows 64-bit, and multiprocessor PCs) that significantly increase the performances and throughput of your Metrology software, but is also aimed at simplifying your day-to-day measurement work. Metrolog X4 is a perfect Point Cloud software able to analyze large data size. High Performances in Point Cloud analysis: Large Data file import (CAD files, Point clouds, ...)
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Tool, Inspection Depth Gauge, Mini Coax, ITA
910121157
Used to verify the depth setting of the center conductor of the ITA mini coax contacts.
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Inspection System for Die Casting
X-eye 7000BS
Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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GPR System for Concrete Inspection
StructureScan™ Mini
Geophysical Survey Systems, Inc.
The StructureScan Mini safely locates metallic and non-metallic targets within concrete structures up to a depth of 20 inches. The system incorporates an auto target feature that marks the detection of features of interest. This function also estimates the depth of targets and automatically adjusts the depth scale.
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Bulkflow X-Ray Inspection System
Designed to be integrated into line with optional reject stations, the Bulkflow X-ray System is perfect for loose and free flowing products. Offering a good detection levels on a wide range of contaminants including all metal, bone, glass and dense plastics.
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Wafer Prober
Precio octo
200mm wafer prober. The system adapts ultra-high speed indexing and high-speed wafer exchange functions to reduce test cost and improve overall equipment effectiveness (OEE) markedly enhancing productivity.
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Wafer Prober
Prexa MS
The latest fully automated 300mm wafer prober for memory devices. Featuring high rigidity and exceptional thermal control, the system enables full-wafer contact testing.
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Automated QC Inspection Solutions
R-Series
The Best Alternative to Traditional Coordinate Measuring Machine (CMM). The R-Series product line will help you eliminate bottlenecks at the traditional coordinate measuring machine. These new solutions, when added to the production line, will help increase productivity through quality control processes that require no human involvement.
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Vacuum Inspection
INDEC
INDEC vacuum test systems monitor a wide range of containers during the production process, including bottles, jars and cans, by measuring the cap panel concavity of their closures which is dependent on the vacuum inside. This non-contact inspection reliably identifies defective containers for automatic rejection.
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Wafer Probers
Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Paint Inspection Gauge
141
The Paint Inspection Gauge is ideal for use on metallic & non-metallic substrates such as wood, glass and plastics.Large easy grip handle - makes cutting thick or hard coatings easyInternal cutter storage compartmentx50 magnification microscope
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*Micro-fluoroscopic X-ray Inspection System
Cath-X
The Cath-X is a bench top system employing Glenbrook’s micro-fluoroscopy technology providing highly detailed x-ray video of the critical components of the needle device. The transparent, safely shielded, view chamber permits the operator to locate the critical areas of the needle for inspection. The x-ray image can be further magnified using the electro-optical zoom feature of the Cath-X.
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Deep Packet Inspection
FlowPro
FlowPro is inserted into areas of the network when visibility is needed. It uses a deep packet inspection (DPI) to compile a flow cache, and exports traffic and threat details reflecting 100% of all communications that pass by. FlowPro is a great complement to the Scrutinizer Incident Response System and ensures the security team has insight where they need it.
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Over-Line Vision Inspection System
Over-Line vision inspection systems utilize a compact sensor head mounted directly over an existing production line to scan every object that passes underneath, in any orientation and at any belt speed, in order to generate a continuous stream of critical QA data, such as size, shape and color attributes, and production metrics such as throughput, uptime and capacity.
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Highly Integrated Optical Inspection
BOA
BOA is a highly integrated optical inspection tool for controlling quality and increasing productivity. It comprises all the elements of an industrial machine vision system in a tiny smart camera style package.
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Borescopes & Inspection Cameras
Triplett Test Equipment & Tools
Is an inspection camera with a detachable wireless 3.5" color display. It features 4x digital zoom, water resistant 8mm camera with 3.5ft cable, and 4 adjustable white LEDs for illumination.The wireless display detaches from the handle for additional freedom in viewing, and internal magnets will conveniently mount it to steel surfaces. With the included Micro SD card you can save snapshots and live video. Saved files can be viewed on the LCD screen or downloaded to a computer via the USB port.
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Thickness and Flaw Inspection
OmniScan MX ECA/ECT
With thousands of units being used throughout the world, the OmniScan® MX is a field-proven, reliable instrument that is built to withstand harsh and demanding inspection conditions. Compact and lightweight, its two Li-ion batteries provide up to 6 hours of manual or semi-automated inspection time.
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Wireless Inspection Cameras
General offers three wireless inspection cameras whose probes can be disconnected from the grip and monitor. They are the DCS18HPART (with a 6mm/0.23 in. diameter articulating probe), the DCS1800HP (with a 5.5mm/0.22 in. diameter non-articulating probe), and the DCS500 (with a 9mm/0.35 in. diameter probe and a 5 in. diagonal color LCD). Wireless inspection cameras offer operating flexibility because the user can use both hands to manipulate the probe.
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Articulating Inspection Cameras
Articulating Inspection Cameras with probes whose tips can be precisely turned (articulated) by the user up to 150 in two directions. Articulation enables inspection of targets located off-axis (even "behind" the probe) or in a tight space without removing the probe. The Inspection Cameras currently offered include the DCS16HPART, its wireless cousin the DCS18HPART, and the DCS665-ART Articulating Inspection Cameras.





























