Wafer Inspection
Inspection of integrated circuits in wafer form for contaminants, flatness, size, and roughness.
See Also: Wafer, Wafer Thickness, Wafer Failure Analysis, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Handlers
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Wide Range Film Inspection
790
For a wide range of coatings the easy-carry and easy to handle SPY Model 790 speeds inspection time with its built in Jeep meter and various other time saving and comfort features
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Packaged Food X-ray Inspection System
EPX100
Our revolutionary new x-ray system is so advanced it will not only improve your product safety and meet regulatory compliance but also will optimize and streamline your product inspection.
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Inspection & Alignment Services
As a leading provider of precision measurement services for power generation and turbo-machinery, API has the professional experience necessary to minimize the overall downtime of the outage or rebuild schedule. The ability to fully utilize API’s precision measurement capabilities, combined with experienced Service Engineers in the turbine alignment process, differentiates API for complex alignments.
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Fiber Optic Inspection Microscope
80760
The Miller 200x Microscope helps inspect fiber optic connectors quickly and easily. Its ergonomic design and built-in features make it ideal for field and lab use. The microscope features a pressure-activated on/off switch, focusing wheel, eyepiece, auxiliary white LED light source rated for 100,000 hours, adapter tip for inserting ferrule and battery compartment.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Ground Resistance Inspection Box
AllWin Instrument Science and Technology Co., Ltd.
Check the ground resistance tester each time prior to start work everyday morning and do some relevant records.
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WAFER MVM-SEM® E3300 Series
E3310
The E3310 is a WAFER MVM-SEM®* for next generation wafers, supporting 1Xnm node process development and volume production at the 22nm node and beyond. With its high-speed carrier system employing a dual arm vacuum robot, and low-vibration platform to improve measurement accuracy, the E3310 delivers high throughput and performance for wafer measurements. Its multi detector configuration and unique 3D measurement algorithm also enable stable, high-accuracy measurement of 3D transistor technologies such as FinFET. The E3310 makes a significant contribution to reducing process development turnaround time and improves productivity for next-generation devices.
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3D Solder Paste Inspection
aSPIre 3
Industry-leading measurement accuracy and inspection reliability- Perfect solution to eliminate shadow problems, base plane settings, and problems with projection direction- Full 3D foreign material inspection solution for the entire PCB- High productivity through the highest accuracy
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GENERAL INSPECTION MACHINE AFTER SOLDER MASK
DVI is a technology of automated optical inspection, which can inspect deep to the difference from semi-transparent layers or semi-reflective layers.
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Dimensional Inspection (3D Inspection)
The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Waterproof Inspection Cameras
waterproof inspection cameras have waterproof probes, General's DCS6XX wet/dry cameras, the DCS600A, DCS605, DCS660A, DCS665 & the DCS665-ART, go one step further because their grips and monitors are also waterproof. This feature, unique in the industry, allows users to inspect toilets and water and sewer lines carrying running water without worrying about dropping and "dunking" the instrument.
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Stand Alone Wafer Sorter
MicroSORT
The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Robotic Inspection Made Easy
i-Robot
The i-Robot technology is suitable for all industrial robots; it provides a production-ready metrology solution that is accurate, reliable and flexible. i-Robot is perfectly suited for all applications requiring flexibility and productivity while providing high metrological accuracy.
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Iris Power Robotic Inspection Vehicle
RIV800
The Iris Power RIV800 Robotic Inspection Vehicle and Camera System, allows a visual inspection of the generator stator and rotor, including checking the air vents for debris, with or without removing the rotor. The robotic inspection vehicle also provides an automated means of EL CID electromagnetic core imperfection detection testing and SWA stator wedge analyzer testing.
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Fixture and Software for Open/Leak Inspection
In addition to jigs and fixtures for probing conductors and electrode pads, NIDEC-READ provides specialized software for test point selection and log analysis.
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Ultrasonic Inspection System
PULD 40
The PULD-40 is a versatile and highly accurate ultrasonic inspection system designed to meet the needs of our customers.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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X-ray Inspection System
X-eye SF160 Series
High-performance Micro-focus Open Tube with 160kV is installed and fine defects of 1㎛ are detectable. High-resolution X-ray image can be gained with world best magnification by installing high-price Open Tube as standard.Dual CT function can be purchased adtionally, and exact location & size of defects can be detected and analyzed with this function.
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Inspection and Maintenance
Sensors' EMISSIONS INSPECTION ANALYZERS have a long-standing history for exceeding international standards with compact, portable, and cost-effective systems.
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Wafer Chucks
ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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End Face Inspection Microscopes
D SCOPE EFI – D SCOPE EFI-C – D SCOPE EFI-C LWD
The new D Scope EFI for MTP/MPO and multifibers field connectors is a cost effective microscope for inspecting fiber optic patchcords and cassettes.
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Furnace and Electrical Inspection Camera
FLIR GF309
The FLIR GF309 is designed for high temperature industrial furnace applications. These infrared cameras are ideal for monitoring all types of furnaces, heaters, and boilers, particularly in the chemical, petrochemical, and utility industries. Custom-built to see through flames, the FLIR GF309 also features a detachable heat shield designed to reflect heat away from the camera and camera operator, providing increased protection.
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Wafer and Cells PL System
HS-PL
Photoluminescence (PL) Imaging is a unique non-invasive inspection tool as it can be used in-line at many different steps of the cell manufacturing process. This facilitates the direct comparison of data obtained at one process step to data obtained at another. Additionally, PL imaging can be compared to electroluminescence (EL) imaging on finished cells using comparable equipment.
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BT Imagine New wafer Thickness System
IS-T1
Measurement Technique Laser Triangulation1-3 Laser Sensor SpotsLaser Spot Size Optimized for Accuracy and Precision.
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Solder Paste Inspection System
LaserVision SP3D Mini
The LaserVision SP3D Mini offers the same level of overall measurement capabilities as the VisionPro SP3D. Utilizing a lower cost microscope platform and the ability for customers to supply their own PC if needed, the SP3D Mini sets the "affordable" boundary on reliable, low cost SPI solutions.
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Surface Inspection Gauge for the Shop Floor
4D Inspec Surface Gauge
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Analog Ultrasonic Inspection System
ULTRAPROBE 100
The Ultraprobe senses high frequency sounds produced by operating equipment, leaks and electrical discharges. It electronically translates these signals by heterodyning them down into the audible range so that a user can hear these sounds through a headset and see them as intensity increments on the meter. Heterodyning works the same as a radio in that it accurately transforms the sounds so that they are easily recognized and understood.
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High-Accuracy Automated Optical Inspection Systems
Fully-automated and high-accuracy 3D inspection and measurement systems. High-power, long working distance optics and high-resolution digital camera are perfect for high-magnification applications. These are full-color systems capable of high-accuracy measurements, automated defect detection and color verification.
