EMMC
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Product
eMMC
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These sockets are specifically designed for standard 153 & 169 Ball eMMC devices. Custom probing sockets also available.
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Product
SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK400 (Analyzer for UHS-II)
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SGDK400 is a UHS-II dedicated analyzer.
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Product
EMBEDDED MMC (EMMC)
SD 3.0 / eMMC 4.51 IP Family
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The eMMC Host IP is an RTL design in Verilog that implements an MMC / eMMC host controller in an ASIC or FPGA. The core includes RTL code, test scripts and a test environment for full simulation verifications. The Arasan MMC / eMMC Host IP Core has been widely used in different MMC applications by major semiconductor vendors with proven silicon.
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Product
Qseven V2.0 SoM Evaluation Kit With Quad/DualLite 800 MHz (Industrial) SoC, 1GB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M120-120-EVK
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*Ultra low power consumption Cortex™-A9*High flexibility Qseven v2.0 compliant design*2 CAN 2.0B*18/24-bit TTL LCD*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux3.0.35/Android4.3*Audio
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Product
IP Solution
eMMC 5.1
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Demand for mobile content capacity and bandwidth for video, pictures and music is ever increasing. To address this demand in the next generation of smartphones, tablets, and portable devices, the eMMC 5.1 Specification from JEDEC, improves the current HS400 speeds operating at 3.2Gbps, with "command queuing" making the data transfers highly efficient by offloading the software overhead into the controller. eMMC 5.1 further improves the reliability of operation by utilizing an "enhanced strobe" at the PHY layer. The eMMC5.1 is backward compatible with the existing eMMC 4.51 and eMMC 5.0 Devices.
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Product
SOM Module
TEO820-ZU2CG
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784EZU2, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
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Product
RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, LAN, DIO (2-in/2-out), 4 AI Channels (16-bit, 250 KS/s) And 2 PCIe Mini Card Slots
IRU152
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The IRU152 is powered by the low-power NXP i.MX 6 UltraLite processer. It can withstand an extended operating temperature range of -40°C to +70°C and up to 2G of vibration for operating in harsh environments. Furthermore, it supports NI LabVIEW to allow users to design graphical user interfaces for their measurement applications quickly and efficiently. In order to provide data collection and device control, the IRU152 comes with various I/O connectors, including four analog input (AI) channels, one isolated RS-232/422/485 port, one isolated LAN and one isolated DIO (2-in/2-out). The four analog input channels have differential input configuration and overvoltage protection of 55V DC. The maximum sampling rate of IRU152 is up to 250 kS/s with a 16-bit resolution for low-speed high-resolution sensor monitoring and signal measurements. Apart from the abovementioned features, the IRU152 comes in two PCI Express Mini Card slots and one SIM card slot for Wi-Fi, 3G/4G and LoRa connections. The DIN-rail embedded system is equipped with onboard 512MB DDR3 SDRAM; besides, they have an 8GB eMMC flash memory. The extremely low power industrial IoT gateway has passed the Heavy Industrial certification and FCC part 15 to ensure the excellent quality and highly reliable performance.
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Product
SMARC Short Size Module, Intel® Atom® X7000 Series (Amston Lake) Processors
LEC-ASL
Computer on Module
The ADLINK LEC-ASL is a SMARC module that supports 2/4/8 cores Intel® Atom® x7000RE (x7211RE, x7213RE, x7433RE, x7835RE) and x7000C (x7203C, x7405C, x7809C) Processors (formerly Amston Lake) with integrated Intel® UHD graphics and high-speed interfaces. LEC-ASL modules support up 16GB LPDDR5 memory, up to 256GB eMMC storage (build option) and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that run 24/7.
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Product
COM Express Type 10 Mini Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM311
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The CEM311 is designed to support the Intel® Pentium® N4200 quad-core and Celeron® N3350 dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the CEM311 with the support of DX12.0, OCL 2.0, OGL 4.3 delivers outstanding graphics computing, 4K resolutions and media performance. The rugged system on module supports a wide operating temperature range from -20°C to +70°C to ensure stable operation in harsh environments. The embedded platform offers onboard 4GB or 8GB of DDR3L memory and an optional eMMC flash up to 64GB. Overall, the CEM311 can be served as an excellent solution for graphics-intensive applications over the Industrial IoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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Product
QSeven
ROM-7720
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*NXP i.MX8 QuadMax 8-Core Processor with 2 Cortex-A72, 4 Cortex-A53 and 2 Cortex-M4F*Multi OS support in Ubuntu/Debian/Yocto Linux and Android*64-bit LPDDR4 4GB*4K h.265 decoder, HD h.264 encoder*Onboard eMMC Flash 16GB, boot selection from SPI/MMC/SD or SATA*3 USB 3.0 with OTG, Dual lane MIPI Camera*Yocto, Android, QNX OS support
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Product
Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, SPI, I2C, 2 LANs And DIO (2-in/1-out)
IFB125
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The IFB125 is powered by the low-power Freescale i.MX6UL processor in the ARM® Cortex™-A7 micro architecture. It supports extended operating temperature ranging from -40°C to 70°C, and can withstand vibration up to 5G. Its flexible wide voltage range 9V - 48V DC power input with a lockable terminal block type connector also enhances its reliability in harsh environments. To meet most of Industrial IoT needs, the IFB125 supports multiple communication interfaces for maximum flexibility, including LAN, serial, USB, and digital I/O ports. The Industrial IoT gateway has 256MB onboard memory that features data transfer rates of DDR3-1600, as well as 4GB eMMC flash memory onboard for storage. This embedded IoT gateway platform is equipped with one PCI Express Mini Card slot and one SIM card slot. Additionally, it supports DB9 connectors with both SPI and I2C function as communication protocols to suit for specific applications
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Product
SOM Module
TEO820-ZU4EV
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784EZU4, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)
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Product
SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
Computer on Module
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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Product
Pico-ITX
RSB-3410
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*NXP ARM Cortex-A9 i.MX6 Dual Lite 1 GHz high performance processor*Onboard DDR3 1 GB, 4 GB eMMC Flash*Supports OpenGL ES 2.0 and OpenVG 1.1 hardware accelerators, full HD 1080p video codecHDMI 1920x1080*Single Channel 18/24 bit LVDS*Dual mini-PCIe for WIFI/3G support*1 USB 2.0, 1 USB OTG client*Multiple OS support in Linux/Android
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Product
Zynq Ultrascale+ MPSoC (ZU19/17/11EG) 3U-VPX Plug-in Module
iW-RainboW-G35V®
FPGA Module
AMD Xilinx’s ZU19/17/11EG Zynq Ultrascale+ MPSoC64bit, 8GB PS DDR4 RAM with ECC (Upgradable)Dual 64 bit, 8GB PL DDR4 RAM (Upgradable)8GB eMMC Flash (Upgradable)3U VPX Connectors based on ANSI/VITA 46.30 (P0+P1A & P1B+P2A)8 Optical transceivers through MT Ferrule Connector (P2B) based on VITA66.4
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Product
SMARC V2.0 SoM Evaluation Kit With I.MX8M Quad/Dual 1.5 GHz/1.3 GHz (Industrial) SoC, 4GB Memory, 64GB EMMC, CAN, MIPI CSI/DSI, And HDMI 2.0
SCM180-180-EVK
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*Ultra-Low Power i.MX8M Dual/Quad A53 Core*Single M4 Core*HDMI 2.0a up to 4K*Dual Channel LVDS*MIPI CSI*10/100/1000 Mbps Ethernet*USB3.0, USB OTG*PCIe 2.0*CAN 2.0B*Audio
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Product
SMARC V1.0 SoM Evaluation Kit With Quad/DualLite 800 MHz (Industrial) SoC,1GB Memory, 4GB EMMC, Gigabit Ethernet, Audio, CAN, MIPI And PCAM
SCM120-120-EVK
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*Ultra low power consumption Cortex™-A9*2 CAN 2.0B*24-bit TTL LCD*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Open GL ES2.0*Linux3.0.35/Android 4.3*Audio
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Product
QSeven
ROM-7510
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*TI Sitara AM5728 Dual core cortex-A15 1.5GHz high performance processor*Onboard DDR3 memory 2 GB and eMMC Flash 8 GB*Support 1 LVDS, 1 HDMI, 1 USB2.0 OTG, 4 USB2.0 HOST, 1 USB3.0,2 UART, 1 CAN, 1 SATA, 2 I2C, 1 I2S, 2 PCIE 1 lane,*Operating temperature 0 ~ 60 °C / -40 ~ 85 °C*Supports Linux Yocto
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Product
Qseven Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
Q7M311
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The Q7M311 has adopted the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). The extremely small embedded module supports 4GB (or optionally up to 8GB) DDR3L memory onboard and 32GB eMMC flash memory (optional). With a seismic design and for industrial-grade temperatures, both the CPU and the DDR3L RAM are soldered to deliver reliable and excellent computing performance. With rich features embedded in all the components built in a small form factor, the industrial-grade computer-on-module is aimed for industrial IoT applications, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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Product
Robust Din-rail Fanless Embedded System With RISC-based (iMX-287) Processor 4 COM, 2 CAN Bus And DIO
rBOX610
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The rBOX610 din-rail fanless embedded system utilizes the low power RISC-based module (iMX-287) processor and is designed to withstand temperatures ranging from -40°C to +70°C for using in extreme operating environment and industrial automation applications. The rBOX610 box PC features 4 RS-232/422/485 serial ports, dual LANs, 4 digital input channels,4 digital output channels, 2 CAN bus and 1 eMMC onboard 4 GB & 1 x SDHC socket for storage expansion (easy to access) in a compact, IP40 protected, industrial-strength robust case. Two power paths input minimize the risk of data loss in the event of a single power failure. Its vertical din-rail form factor makes it easy to install the system in a small cabinet. Due to the RISC-based architecture, rBOX610 will not generate a lot of heat while being operated. The ready-to-run rBOX610 is specially designed for remote control/monitoring management applications like unmanned control room, industrial machine, automatic parking lot, traffic cabinet and more.
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Product
SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK320A (SD Host Tester)
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SGDK320A (SD Host Tester) is a product that has the functions of SD emulator (SD Emulator), host tester (Host Tester), SD analyzer (SD Analyzer), and eMMC analyzer (eMMC Analyzer). Supports SD Memory Card Physical Layer Specification Version 3.01. It covers the test contents of Test Specification Ver3.00 and Supplement Note. Supports SDR104 and eMMC ver4.41 (analyzer).
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Product
COM Express Type 10 Mini Module With Intel® Atom® X5 And X7 Processor
CEM310
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The CEM310, a COM Express Type 10 Mini module, supports Intel® Atom® x5 and x7 processors (codename: Apollo Lake) in a board size of 84mm x 55mm. It has 8GB of DDR3L onboard memory and an optional 64GB eMMC memory. The Intel® Atom®-based COM Express Type 10 Mini module comes with a variety of I/O and expansion options including four PCIe x1 lanes, one Gigabit LAN port with Intel® i210IT Ethernet controller, two USB 3.0, eight USB 2.0, two SATA-600, four digital I/O channels, HD Codec audio, one DDI, one LVDS, one LPC, one SPI, two serial TX/RX and one I2C to meet customer requirements. Aside from the rich I/O options, the CEM310 has a wide voltage input range of 4.75V to 20V to meet the varying voltage input requirements for automotive or transportation applications. In addition, it supports an extended operating temperature range from -20ºC to +70ºC or optional -40ºC to +85ºC to ensure stable and reliable operation in harsh environments. The CEM310 supports watchdog timer, hardware monitoring functions, SMBus as well as smart battery (optional).
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Product
SD Host Tester / SD / EMMC Analyzer / SD Card Tester
SGDK350A (SD card / eMMC tester)
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This product is compatible with SD Memory Card Physical Layer Specification Version 3.01. Supports UHS-I interfaces (SDR12,25,50,104,DDR50). There is a SpeedClass measurement mode that measures SpeedClass that supports SDXC, and a simple performance measurement mode that performs sequential / random access to any address. In addition, the SD card access library (for Visual Studio) is open to the public, and any command can be executed on the SD card in any pattern.
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Product
Digital Signage Player With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, DisplayPort++, HDMI, 2 GbE LAN And 4 USB
DSP300-318
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The DSP300-318 is powered by the onboard Intel® Pentium® processor N4200 and Celeron® processor N3350 (code name: Apollo Lake). It can deliver dazzling visual images and video advertising in 4K resolution. Measuring only 20 mm in thickness, the ultra slim DSP300-318 is sleek enough to fit in a small area behind signage displays and its fanless and cable free design enables easy installation without any environment limitation. The super slim DSP300-318 is designed to be fanless and cableless, which ensures solid reliability and easy maintenance. It supports HDMI and Dual-Mode DisplayPort (DP++) outputs with support for dual displays. The system also has one M.2 Key E 2230 for Wi-Fi and Bluetooth modules, one M.2 Key B 3042 for 4G LTE and one SIM card slots for 3.5G radio connectivity. Additionally, one M.2 Key M 2280 and one optional 64GB eMMC 5.0 are available for storage. The Intel® Apollo Lake-based DSP300-318 offers a cost-effective, compact yet powerful computing platform that allows plenty of digital signage solutions for advertising, brand promotion and digital menu board applications.
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Product
Qseven V1.2 SoM With I.MX287 454 MHz (Industrial) SoC, 128MB Memory, 4GB EMMC, Gigabit Ethernet, Audio And CAN
Q7M100
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*Ultra low power consumption ARM9*High flexibility Qseven v1.2 compliant design*2 CANBus 2.0B compliant ports*24-bit TTL LCD*Dual 10/100 Base-T Ethernet*Audio
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Product
Qseven V2.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio And CAN
Q7M120
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*Qseven v2.0 (70 x 70 mm)*Ultra low power consumption Cortex™-A9*2 CAN*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux 3.0.35/Android 4.3*Audio
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Product
COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor
CEM312
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The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
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Product
Universal Automated Programming System
4900
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The 4900 is powered by the newest BPM 9th generation technology, which delivers the fastest programming speeds in the industry for MCU’s, eMMC HS400, NAND, NOR and Serial Flash devices. BPM 9th generation technology produces 200 MHz signals, allowing each byte of data to transfer in up to 2.5 ns. Up to 9 times faster than competing programmers. 3D Vision option inspects BGA, CSP, QFP, TSOP, SOIC and J-Lead devices for coplanarity, bent lead, pitch, width, diameter, standoff and XY errors.
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Product
Rugged IP67-rated Fanless Edge System With NVIDIA® Jetson™ TX2, HDMI, GbE LAN, 1-CH PoE, USB 2.0 And 100 To 240 VAC Power Input
eBOX800-900-FL
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The Artificial Intelligence (AI) embedded system, eBOX800-900-FL, adopts a full IP67-rated extruded aluminum and heavy-duty steel case for dust protection and water resistance. Moreover, the AI embedded system comes with a wide operating temperature range of -30°C to 60°C (-22°F to +140°F) and a vibration endurance for up to 3Grms. The embedded system is powered by the NVIDIA Jetson™ TX2 module which has a powerful 64-bit ARM A57 processor and 256-core NVIDIA® Pascal GPU. It features M12 type I/O connectors and four N-jack waterproof antenna openings for operational stability in rugged environments. The eBOX800-900-FL is ideal for AI edge computing and deep learning applications, such as smart city, smart manufacturing, smart transportation, and much more. The eBOX800-900-FL has 8GB of LPDDR4 memory and 32GB eMMC onboard. It comes with a wide range of 100 to 240 VAC power input with 10kV surge protection. The rugged edge computer also features one M.2 SSD PCIe 2.0 x4 socket which supports high-performance NVM Express interface for extensive storage needs. Furthermore, the embedded box PC is equipped with a PoE port to support the applications that require the use of IP cameras or any PoE device, i.e., traffic flow monitoring, license plate recognition, vehicle recognition, machine vision.
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Product
OSM Size-L Module With NXP® I.MX8M Plus Series
OSM-IMX8MP
Computer on Module
The OSM-IMX8MP is an OSM R1.1 Size-L module featuring NXP® i.MX 8M Pluss series processor with 4-core Arm Cortex-A53 and M7, up to 8GB LPDDR4L memory and up to 128GB eMMC storage. With its in-SoC 2.3 TOPS NPU and Vivante GC7000UL graphics, the module is made for edge solutions needing on-device AI processing at ultra-low power.
