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Product
cPSB 2.16 Compact Packet Switch 16 Slot, 14 node, 2F
107PS22616-4157R
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CompactPCI CPSB 2.16 6U 16 slot,14 node, 2 fabric, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
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Product
PXIe Chassis: 10-slot, 3U, 24 GB/s, Gen 3
M9010A
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The M9010A PXIe 10-slot Gen 3 chassis delivers flexibility, compatibility, and performance in a smaller form-factor ideal for bench-top applications. With 8 PXIe hybrid slots, it gives the system designer flexibility to mix and match the number and location of PXIe and hybrid-compatible modules. The maximum performance, PCIe switch fabric can operate up to Gen 3 providing up to 24 GB/s of system data bandwidth. The new cooling design provides exceptional per-slot cooling while at the same time producing much less fan noise than the typical PXI chassis. It is also designed for easy maintenance and has features for combining multiple chassis together or integrating with other non-PXI instrumentation.
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Product
88-lane, 44-port, PCI Express
PEX89088
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The new PCIe Gen 5.0 (32 GT/s) PEX89000 series builds on the longevity of the Broadcom series of switches, now spanning 13 families. The PEX89000 family allows customers to build systems from simple PCIe connectivity inside the box to high-performance, low-latency, scalable, cost-effective PCIe fabrics for composable hyper-scale compute systems supporting ML/AI and Server/Storage applications.
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Product
Magnetism Detector DET
432
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The MAC Magnetism Detector is widely used by steel suppliers and fabricators to determine residual magnetism in iron and steel objects.
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Product
Fixed Attenuator Pads
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SemiGen RF/microwave fixed attenuator pads feature precise resistor films and superior metalization resulting in superior performance and consistency. Our advanced thin-film technology allows our parts to have full side wraps for SMT installation and a complete grounding backside for ease in attachment, as no ground bonding is requried. Top side contacts for the input and output make these ideal for standard RF/microwave assembly techniques. They are available as MIL PRF 38534 “H” & “K” space screened units. Custom values are easy to fabricate and design allowing users to design in a specific value of choice.
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Product
Portable Manual Probing Station
Model W4.0 x L6.5
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This portable manual probing station is designed for a versatile, comfortable, and accurate operation on up to 4.0” wafers or 4.0” X 6.5” printed circuit board assemblies. This turn-key, manually operated probing station, model W4.0 x L6.5, is part of the D-COAX commitment to the test and measurement and PCB fabrication industries.
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Product
Phase Array Ultrasonic Testing
PAUT
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Sensor Networks, Inc. (SNI) is a Pennsylvania-based technology company specializing in the design and fabrication of industrial ultrasonic transducers and tooling for demanding in-situ test and inspection applications. Engineered for precision, ease of use, and maximum durability, our offerings include Phased Array ultrasonic transducers, fixtures, couplant-delivery systems, qualification/calibration standards, procedure development, personnel training and instrumentation.
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Product
Rubbing Fastness Tester
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Sataton Instruments Technology CO., Ltd
Rubbing fastness tester/Crockmeter is professional designed for determining the resistance of the color of textiles of all kinds, including textile floor coverings and other pile fabrics, to rubbing off and staining other materials in dry or wet conditions. Rubbing fastness tester can also be used to determine the color fastness to rubbing of ink, printing, dyeing, etc. There are two modes of manual and automatic for different requirements.
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Product
Thickness Measurement
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Thickness Tester is a high precision mechanical contact method thickness tester, which can be used to thickness measurement of films, sheeting, paper, corrugated paperboard, textiles, non-woven fabrics, and solid insulation materials, etc.
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Product
High Performance Computing
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We have a strong and wide-reaching industry reputation and participates in many industry organizations including the Open Fabrics Alliance (OFA), the Ethernet Alliance, and the InfiniBand Trade Association (IBTA).
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Product
Flying Probe Electrical Testers
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Gardien has been present in the PCB industry since the advent of the personal computer. In our beginning Mania, the company that pioneered some of the first electrical grid testers used by PCB fabricators. We still produce class leading equipment to this day, such as our line of Gardien Flying Probe Testers and our Acceler8 Scanning System.
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Product
MRM(Mask)
MRM Series
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- Fully automated system that can produce masks by automating the mask production process such as fabric supply, molding, cutting, and bonding.
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Product
3rd Gen MicroTCA Carrier Hub (MCH), Double Module, 40/10GbE/PCIe/FPGA/SRIO
UTC006
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The VadaTech UTC006 is a double module, MTCA.4 format, MCH with front-panel fabric expansion and RTM support (PCIe optiononly). Fabric options include PCIe Gen3, 10/40GbE, Xilinx Virtex-7 FPGA, Cross Bar Switch (CBS), and SRIO.
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Product
Precision SOT-23 FGA™ Voltage References
X60003
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The X60003 FGA™ voltage references is a very high precision analog voltage reference fabricated in Renesas' proprietary Floating Gate Analog technology, which achieves superior levels of performance when compared to conventional band gap, buried zener or XFET™ technologies.
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Product
VPX / OpenVPX Chassis
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VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments.
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Product
RF Power Transistors
Silicon MOSFET
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Macom Technology Solutions Holdings Inc.
At MACOM we offer a broad range of silicon bipolar transistor products designed for applications ranging from DC to 3.5 GHz. Our silicon bipolar transistors are ideal for civil avionics, communications, networks, radar, and industrial, scientific, and medical applications. Our all-gold metallization fabrication processes ensure high performance and long term reliability for ground and space applications.
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Product
Terahertz imaging cameras
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The detectors are fabricated with a GaAs high-mobility heterostructure in the standard semiconductor cycle using conventional optical lithography. The imaging sensor is manufactured on a single wafer. That process ensures high homogeneity and reproducibility of the plasmonic detector parameters (pixel-to-pixel deviation responsivity is within a 20- percent range). Each detector unit has a room-temperature responsivity up to 50 kV/W with read-out circuitry and noise-equivalent power of 1 nW/\sqrt{\rm{Hz}} in the frequency range 10 GHz — 1 THz. The detection mechanism is based on excitation of plasma oscillations in a two-dimensional electron system with subsequent rectification. The rectification takes place on special defects made in the electron system.
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Product
Course Length Tester
TF124
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TESTEX Testing Equipment Systems Ltd.
Course Length Tester, to determine the accurate length of a complete course of knitted fabric. When the yarn is attached to the clamp and wound round the pulleys, the length indicated on the ruler by the weighted clamp is added to that indicated on the appropriate location in use to give the total length of yarn.
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Product
NVMe-oF
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NVMe/oF adoption is rapidly increasing and full NVMe specification conformance over Ethernet networks or Fibre Channel fabrics requires the ability to validate transactions over all transports.
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Product
PCB Design and Assembly
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Innovative Circuits Engineering, inc
Turnkey services for Printed Circuit Boards: Design, Fabrication, Assembly and Testing
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Product
4-Channel 200 MHz A/D with DDC, Kintex UltraScale FPGA - XMC
Model 71861
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Four 200 MHz 16-bit A/Ds- Four multiband DDCs (digital downconverters)- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
FTB Ecosystem
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Imagine test tools that actually help you deliver services with speed and quality. Imagine if you could institutionalize operational efficiencies, eliminate silos and make every component of your deployment, turn-up and monitoring part of one tightly woven fabric.
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Product
Bundesmann Rain Tester
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Sataton Instruments Technology CO., Ltd
Bundesmann rain tester which is also called as Bundesmann water repellency tester can provide artificial rainfall to simulate the process of rain under natural environment. The tester is designed to determine the water repellency of fabrics by the bundesmann rain shower method. It can provide water repellency performance of tested materials under a certain rainfall in a certain time.
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Product
Inductor Products
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Macom Technology Solutions Holdings Inc.
They provide uniformity, durability and repeatability in circuit fabrication. The coils are polyimide coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged and reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermocompression bonding.
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Product
Switch Fabric Modules
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Switched fabrics provide the interprocess communication backbone for OpenVPX systems - and these modules enable you to achieve the maximum benefit.
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Product
Geo / Cryogenic / NDE Instrumentation
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Tristan designs and fabricates custom magnetometer systems to study the magnetic properties of samples. SQUID systems are extremely sensitive instruments designed to detect small electromagnetic signals. By combining SQUID electronics with various special purpose probes and auxiliary electronics, laboratory systems having a variety of capabilities are made available. - See more at: http://www.tristantech.com/#sthash.JlYDZcjM.dpuf
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Product
Automated Monitoring of Airborne Molecular Contamination
AMC-Monitor T-1000
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The all-in-one analyzer for FOUP, fab and clean-room environment AMC monitoring in the semiconductor industry. The AMC-Monitor is a modular and flexible platform for airborne molecular contaminations (AMC) monitoring in semiconductor applications such as: FOUP analysis with a focus on VOC and condensables incl. full integration with Pfeiffer Vacuum APA 302 pod analyzer. Clean-room monitoring in fabrication plants.
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Product
Shielded and Unshielded Cable
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Teledyne Marine Cable Solutions
Shielding Types• Braided I Served I Spiral• Foil & Hybrid• Vapor Barriers• Copper & Alloys• Conductive & Static Dissipative Tapes• Conductive Fabrics• Tensile Members• RFI & EMI Tapes & Braids (Serveor Interwoven)• Utilizing Flat & Round Copper• Stainless Steel• Bronze• Aramid Fibers & Textile, amongothersConstruction• Multi-conductor, shielded pairs, pairs with steel tubed fiber or copper conductors with fiber optics, coaxial conductors & aramid strength fibers
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Product
Textile Tensile Testing Machine
TF002
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TESTEX Testing Equipment Systems Ltd.
Textile Tensile Testing Machine, to determine the physical and mechanical performance of tension, tearing, compression, bursting, rapture, flexibility, shear and peel and seam slippage. Especially designed to test a wide range of yarn, fabric, leather, with a huge assortment of specimen grips and software available, it can also be used for strength test of rubber, plastic, metal, wire, paper, packaging, and other materials
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Product
Semiconductor
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Engineered ceramics are used in the semiconductor industry because of their excellent material properties. Ultra-pure ceramics are often used in the whole cycle of semiconductor manufacturing including Semiconductor Wafer & Wafer Processing, Semiconductor Fabrication (Front End), and Semiconductor Packaging (Back End).
