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Computed Tomography
use of X-rays or ultrasound to scab abd cross section an object.
See Also: Tomography
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Industrial Computed Tomography
TomoScope® XS FOV
Coordinate measuring machine for three-dimensional measurement according to the principle of computed tomography, Fast measurement in the field of view of the detector without moving axes with high resolution and high power
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Industrial Computed Tomography
TomoScope® XL
Micro focus X-ray source up to 225 kV (option: 300 kV micro focus tube) Grater range of x-ray detectors Grater range of x-ray detectors
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Industrial Computed Tomography
TomoScope® S
In both design and construction, the measuring machine meets the legal requirements for a fully protective device according to x-ray device regulations. Additional safety features have been included over and above the legal requirements.
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Industrial Computed Tomography
TomoScope® XL NC
Coordinate measuring machine with x-ray tomography for the most stringent requirement with a small cone beam angle
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Computed Tomography and CT Scanner
When conventional x-ray images aren’t enough, a diagnosis for soft tissue conditions requires appropriate technology. Whether cross-sectional images are required or entire pictures of internal organs, CT exams and scanning are a vital part of a healthcare or imaging facility.
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Industrial Computed Tomography
TomoScope® L
High Accuracy Multisensor coordinate measuring machine for 3D measurements using the principle of Computed Tomography, in combination with additional sensors (tactile sensor systems, optical sensors)
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Micro-CT for material science
Micro computed tomography is X-ray imaging in 3D, by the same method used in hospital CT scans, but on a small scale with massively increased resolution. It really represents 3D microscopy, where very fine scale internal structure of objects is imaged non-destructively. Bruker microtomography is available in a range of easy-to-use desktop instruments, which generate 3D images of your sample’s morphology and internal microstructure with resolution down to the sub-micron level.
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Inline 3D-CT Automated X-ray Inspection Systems (3D-AXI)
3Xi Series
Saki's 3D-AXI (X-Ray) series adds significant inspection capability. The system utilizes Planar Computed Tomography (PCT) providing high precision CT imaging at high speed.
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CT-PORTABLE
Computed tomography (CT) has recently gained increasing importance as a non-destructive inspection method for industry. CT enables a quick visualization of a three-dimensional volume model of the external and internal structure of an object, which can also be interpreted by non-experts. So far, however, the acquisition costs and the relatively complicated operation often prevented a widespread introduction of computed tomography systems.
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CT-ALPHA
The CT-ALPHA system meets the most stringent demands in CT X-ray. With this Computed Tomography system, ProCon X-ray GmbH offers the highest possible flexibility for individual customer requirements.
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CT Inspection System
FF35 CT
The YXLON FF35 CT computed tomography system is designed to achieve extremely precise inspection results for a wide range of applications. Available in a single or dual tube configuration, it is perfect for very small to medium size parts inspection in the automotive, electronics, aviation, and material science industries.
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Micro-CT for Life Science
Micro computed tomography is X-ray imaging in 3D, by the same method used in hospital CT scans, but on a small scale with massively increased resolution. It really represents 3D microscopy, where very fine scale internal structure of objects is imaged non-destructively. Bruker microtomography is available in a range of easy-to-use desktop instruments, which generate 3D images of your sample’s morphology and internal microstructure with resolution down to the micron level.
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Industrial Computed Tomography
TomoScope® XS
Coordinate measuring machine for three-dimensional measurement utilizing computed tomographyFast measurement with high resolution via the next generation transmission tubeReduce measurement time by 90% with OnTheFly TechnologyLow operating costs as a result of the new monoblock designExtremely precise air bearing rotary axis for low measurement uncertaintyLow space requirement thanks to compact designLow weight allows for installation almost anywhereFast amortization through low acquisition costsStandard-compliant calibration for reliable and traceable measurement results, optionally with DAkkS certificateVersatile fields of application such as plastic, metal and multi-material componentsSoftware for 3D real-time reconstruction of workpiece geometries during tomography
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Medical Imaging
ams offers high-speed, low-noise and low-power sensing solutions that enable manufacturers of Computer Tomography (CT) equipment and digital X-Ray Flat Panel Detectors (FPD) to produce crystal clear images while exposing patients to low doses of radiation. We are taking our leading imaging sensing solutions and expertise forward to achieve an unprecedented level of image accuracy while enhancing convenience and safety for the user.
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Preclinical Imaging Modalities and Solutions
Bruker offers advanced preclinical imaging solutions for a broad spectrum of application fields, such as oncology, neurology, cardiology, inflammation, infectious diseases, cancer research, functional and anatomical neuroimaging, orthopedics, cardiac imaging and stroke models. Our range of techniques includes MRI (Magnetic Resonance Imaging) , PET (Positron Emission Tomography), SPECT (Single Photon Emission Computed Tomography) micro-CT (Micro Computed Tomography), optical imaging and magnetic particle (MPI) imaging.
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Industrial CT Scanning Services
Computed tomography (CT) is also referred to as industrial x ray and industrial imaging. It is an x-ray methodology yielding 3-dimensional (3D) results by placing an object on a rotational stage between an x-ray tube and x ray detector, rotating the object 360 degrees and capturing images at specific intervals—such as every degree or every half degree.
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MXI Computerized Tomography (CT) Option
The Nordson TEST & INSPECTION µCT inspection option provides Computerized Tomography (CT) functionality to compliment the 2D X-ray investigations on Nordson TEST & INSPECTION X-ray inspection systems. It uses the superior, sub-micron feature recognition 2D x-ray images, that Nordson TEST & INSPECTION X-ray systems always provide, to produce the best CT models for 3D sample analysis, virtual micro-sectioning and internal dimensional measurements. It reduces the number of time-consuming micro-section analyses needed and / or assists in identifying where micro-section preparation and investigation must concentrate. Available with a system order or as retro-fit to suit application and workflow needs.
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Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3002
- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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COM Express R3.1 Type 6 Compact Size Module With X7000RE And X7000C Intel® Atom® Processors (Amston Lake)
cExpress-ASL
The cExpress-ASL is a COM Express® COM.0 R3.1 Type 6 Compact size module featuring up to 8 core, 64-bit real-time-capable (with Intel TCC and TSN support) Intel® Atom™ x7000RE and x7000C processors (formerly “Amston Lake”). The cExpress-ASL combined with soldered-down memory and extreme temperature option, is specifically engineered for customers who need entry-level computing with real-time prowess, a balanced cost structure, and extended product life support for ruggedized edge solutions running 24/7.
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Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer
MXE-1500 Series
The successor to ADLINK's best-selling MXE-1300 Series, the MXE-1500 offers richer I/O interfaces, and more flexible I/O configurations in the same compact enclosure. Intel® Celeron®(Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays, altogether delivering an unequaled price/performance ratio and making the MXE-1500 an ideal choice for industrial automation applications and mass transit operators.
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Intel® Atom™ Processor E3845 Fanless Expandable Embedded Computer with PCI/PCIe Slots
MXC-2300
Featuring the latest Intel® Atom™ E3845 processor, the Matrix MXC-2300 series excels with minimal power consumption, exceptional 3D graphics, and powerful media acceleration, delivering a leading improvement in performance and cost-efficiency over any previous generation Atom-based system.
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COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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COM-HPC Server Type Size D Module with Intel® Xeon® D-2700 Processor (formerly codename: Ice Lake-D)
COM-HPC-sIDH
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices.
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SMARC Short Size Module with Intel® 6th Gen. Atom® x6000 Processors (formerly codename: Elkhart Lake)
LEC-EL
The ADLINK LEC-EL is a SMARC module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE) processors (formerly Elkhart Lake) with integrated Intel® UHD graphics and high speed interfaces. LEC-EL modules support up 8GB LPDDR4 memory, and are also available with rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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COM Express Basic Size Type 7 Module with Intel Atom® C3000 SoC
Express-DN7
The Express-DN7 is a COM Express® COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Atom® C3000 processor (formerly “Denverton-NS”) system-on-chip (SoC). 16 CPU cores with 31W TDP and integrated 10G Ethernet make the Express-DN7 especially suited for customers who need excellent computing performance with low power consumption, such as edge computing applications, in a long product life solution.
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Compact Modular Industrial Computers Based On 14/13/12 Gen Intel® Core™ Processors
MVP-5200 Series
The MVP-5200 Compact Modular Industrial Computers powered by 14/13/12th Gen Intel® Core™ i9/i7/i5/i3 and Celeron processors. Featuring Intel R680E chipset and supporting up to 65W, the computers can also incorporate GPU cards in a rugged package suitable for AI inferencing at the Edge, and can be used for but not limited to smart manufacturing, semiconductor equipment, and warehouse applications.
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COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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OSM R1.1 Size-L Module Based On MediaTek Genio 510 Series Processor
OSM-MTK510
The OSM-MTK510 is an OSM R1.1 Size-L module featuring the advanced MediaTek Genio 510 series processor. Equipped with a dual-core Arm Cortex-A78 and a quad-core Cortex-A55, it boasts an impressive MediaTek DLA+VPU AI engine capable of up to 3.2 TOPS, making it ideal for edge AI applications. This module excels in providing edge AI processing at ultra-low power consumption.
