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Product
DDR4 RUGGED DIMM
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A Rugged DIMM (Dual In-line Memory Module) is a specialized type of computer memory module designed to operate reliably in harsh, demanding environments that would cause standard commercial RAM to fail.
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Product
8GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U8GE32-SE
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8GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
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8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
SOM Module
TEO820-ZU4EV
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Sundance Multiprocessor Technology Ltd.
Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784EZU4, 784 Pin Packages4 x 5 cm form factorRugged for shock and high vibration2 x 512 MByte 32-Bit width DDR4 SDRAM2 x 32 MByte (2 x 256 MBit) SPI Boot Flash dual parallel4 GByte eMMC Memory (up to 64 GByte)
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Product
Virtex UltraScale+ 3U VPX Plug-In Module
iW-RainboW-G47V®
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AMD Xilinx’s VU13P, VU11P, VU9P, VU7P, VU5P Virtex Ultrascale+ FPGADual 64 bit, 4GB FPGA-DDR4 with ECC (Upgradable)31 channels of FPGA GTY transceivers up to 32.75Gbps1Dual ARM Cortex-A7 core processor of 1.2GHz speed32bit 2GB DDR4 for CPU with ECC128MB QSPI Flash & 256MB NOR Flash3U VPX Connector (P0+P1A & P1B+P2A)8 Optical transceivers through MT Ferrule Connector (P2B)
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Product
8-Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - QuartzXM
Model 6003
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- Unique QuartzXM eXpress Module enables deployment in custom form factors- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- Measuring only 2.5 by 4 inches- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- GTY connections for gigabit serial communication- Ruggedized and conduction-cooled versions available- Includes a complete suite of IP functions and example applications- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products
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Product
Multimedia Modular
DPX-M270
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Intel® 8th/9th Generation Core™-i7/i5/i3 CPUs 8,6,4,2 core. Two 260-pin SO-DIMM up to 32GB DDR4 2666 MHz SDRAM. Supports 3 display outputs (2x DP++, HDMI). PCIe x16 Gen 3.0 graphics card slot.
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Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
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DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
Fanless Embedded System With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 4-CH PoE And MXM 3.1 Type A
eBOX671-521-FL
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The eBOX671-521-FL is a GPU computing embedded system that comes with 4-CH PoE and MXM 3.1 Type A slot for applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things. The outstanding eBOX671-521-FL with enhanced GPU computing performance is powered by the 9th/8th gen Intel® Core™ i7/i5/i3 processor with up to six-core, Intel® Pentium® processor, or Intel® Celeron® processor and comes with Intel® Q370 or optional Intel® C246 chipset. The fanless embedded GPU-based system is equipped with dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display. Furthermore, this Intel® Coffee Lake-based embedded box PC is specially designed with four Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports with a total power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors. It comes in great expansion possibilities, including one internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots. For storage, it has two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature. Besides, we have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.
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Product
Computer With 8th Gen. Intel® Core™ I5 Processor, Built-In 8G DDR4 RAM And UL Class 1 Division 2
TPC-318WH
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Industrial-grade 18.5" WXGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i5-8365UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with PCAP touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Support TPM2.0 hardware security
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Product
16G R-DDR4-3200 1GX8 1.2V Samsung Chip -40~85C
AQD-D4U16R32-SEW
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Registered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, wide temperatures from -40° to 85°C.
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Product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
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- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
21.5" Fanless Panel PC With Intel® Celeron® J6412 Processor
PPC-321W EHL
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Industrial-grade 21.5" Full HD TFT LCD with 50K backlight lifetimeDurable true-flat touchscreen with projected capacitive touch controlIntel® Celeron® J6412 quad-core, 2.0 GHz, processorUp to 32 GB DDR4 SDRAM1 x RS-232, 1 x RS-232/422/485, 2 x USB 2.0, and 2 x USB 3.1Compact, fanless design with solid aluminum alloy enclosure and IP66-rated front panelSupports E-key for wireless moduleSupports expansion via M.2 slotSupports Windows Embedded Linux and Android OS
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Product
Registered DIMM DDR4 3200/2933/2666
SQR-RD4N
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100% Screening Test, Compatible with server platform, Original IC chip adopted, 30u” golden finger.
