Ground Bond
Checks a ground circuit's ability to handle fault current in the event of insulation failure.
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Type 39 CompacFrame Development Platform, 1 - 4 Slot 3U VPX Power And Ground Backplane
39P01BWX6ZY2VCC0-Tx
Elma’s slimline CompacFrame is the next-generation platform designed to accelerate development and test of Plug-In Cards (PICs). The 3U card cage in the platform is tilted upward by 5º for easier card access and accommodates backplanes up to 4 slots.
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product
Post Wire and Die Bond Inspection Machine
IV-E1700
IV-E1700 is a post wire and die bond inspection machine that is known for having a proven, effective and patented 2D+3D Inspection system. This product is best used to weed out defects with data collection for process improvement and reports for SPC quality Control.
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Temporary Bonding andDebonding Systems
Increased demand for applications based on thin wafers and thin microelectronic-substrates result in the need for processing and handling of thin- and ultra-thin substrates during the manufacturing step. Thin substrates in the area of IC manufacturing (like memory, CMOS, 3D-TSV integration or ChipCard applications), power devices (e.g. IGBTs), compound semiconductors (e.g. for high brightness LEDs or RF-power amplifiers), as well as emerging technologies that also involve thin or flexible substrates (MEMS; RFID-tags, flexible displays, etc.) require reliable handling and support techniques in order to ensure safe processing.
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Resistance, Ground Testing, Battery And Power Quality
Our testing equipment works wherever you are, whenever you need it, with precision and reliability.
