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Product
2.5” Pico-ITX (MI/O-Ultra) Single Board Computers
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Advantech's 2.5" Pico-ITX (MI/O-Ultra) single board computer (SBC) measure 100 x 72 mm and feature REAR I/O, fanless operation, small form factor(SFF), compact and ultra slim design, extended temperature range, and low power consumption.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
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- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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ETX Module with Intel Atom® Processor E3800 Series SoC (formerly codename: Bay Trail)
ETX-BT
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The ETX-BT is based on the latest Intel Atom® processor E3800 SoC series, adopting the latest 22nm process technology with 3-D Tri-Gate transistors featuring significant improvements in computational performance and energy efficiency. The E3800 SOC series integrates processor and GPU cores and all I/O on a single chip. Processor performance is scalable from a single-core Intel Atom® processor E3815 at 1.4GHz to a quad-core Intel Atom® processor E3845 at 1.9GHz. Two quad-core Intel® Celeron® processors, based on the same microarchitecture, are also available.
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Product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
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ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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Product
COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
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ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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Product
Intel® Celeron J1900 & Atom E3825/E3845, 3.5" MI/O-Compact SBC, DDR3L, VGA, HDMI/DP, 48-Bit LVDS/eDP, 2GbE, Mini PCIe, MSATA, IManager, MIOe
MIO-5251
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Intel® Celeron J1900 & Atom™ E3825/E3845, DDR3L-1066/1333MHz SODIMM up to 8GBDirectX11, OpenGL3.2, OpenCL1.2, multi-display: VGA+LVDS/eDP+ HDMI/ DP*Flexible design using integrated multiple I/O: MIOe to approach vertical applications & keep domain knowhow2 Intel i210 GbE, rich I/O: 4COM, SATA, USB3.0, SMBus/I2C, GPIO full-size Mini PCIe w/ SIM holder, full-size mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
Computer On Modules
COM Express Basic
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COM Express Basic is the latest COM 125mm x 95mm form-factor, including Intel core i, Intel 6th Generation and Intel Atom processor. Because of wide range of processors, Intel core i, Intel 6th Generation and Intel Atom processors, COM Express can provides not only high-speed interfaces like HDMI/DisplayPort, PCI Express, SATA and USB 3.0 for volume data transportation, but also LVDS, PCI, and IDE for legacy applications.
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Product
PCI Express® Bus to 3U PXI Express™ Chassis Expansion Kit
PCIe-PXIe-8565
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Includes PCIe-8560 peripheral card, PXIe-8565 3U system module, and ACL-EXPRESS cable in 1, 3, or 7 meter lengthsCompliant with PXI-5 PXI Express hardware specification Rev.1.0 and PCI Express Base Specifications Rev. 1.0a250 MB/s maximum system throughput
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Product
Intel® Core™ I3-N305 Processor, Intel® Processor N-Series, And Intel Atom® Processor X7000E Series Pico-ITX SBC
MIO-2364
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Intel® Core™ i3-N305, N-series N97, and x7000E Series x7211EDDR5-4800 up to 16GBDual independent display: LVDS + HDMIGbE (optional PoE/PD, 802.3at), 4 USB, COM, SMBus/I2CExpansion: M.2 E-Key, M.2 B-KeySupports iManager & Software APIs, WISE-DeviceOn
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Product
SMARC® 2.1 Short Size Module With NXP I.MX95
LEC-IMX95
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ADLINK LEC-IMX95, based on the powerful NXP i.MX95 (6x Arm Cortex-A55 + 1x Arm Cortex-M7 + 1x Arm Cortex-M33) processor with an integrated ISP and eIQ Neutron Neural Processing Unit (NPU) operating at up to 2 TOPS., is the latest SMARC revision 2.1 compliant module. It combines power-efficient high-performance compute, immersive Arm® Mali™-powered 3D graphics, innovative NXP NPU accelerator for machine learning, and high-speed data processing with safety and security features.
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Product
COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
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ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
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Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3102 with Intel MXM GPU
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- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
Value Family 9th Gen Intel® Core™ i7/i5/i3® Processor-Based Embedded GPU/AI Platforms
MVP-5100-MXM Series
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- 9th Gen Intel® Core™ i7/i5/i3 LGA processor- Dual SODIMMs sockets for up to 32GB DDR4- Abundant I/O: Up to 4x additional DP 1.4 from MXM, 2x DP++, DVI, VGA, 3x GbE, 3x COM, TPM2.0- 3x USB 3.1 Gen 1, 3x USB 2.0- Rich storage options: 2x 2.5" SATA, M.2 2280
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Product
Computer-On-Module
SMARC
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SMARC form factor is the only computer-on-module form factor that truly is capable of supporting both ARM and x86 designs. With 314-pins on a high speed MXM3 connector, SMARC can fully cover both typical x86 interfaces as well as typical ARM type low level signals. Using ARM SoCs opens the possibility to leverage the product ecosystem of familiar devices such as tablet computers and smart phones. Alternative low power SoCs and CPUs, such as tablet oriented x86 devices and other RISC CPUs may be used as well.
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Product
4x 3U OpenVPX MOSA Mission Computer
SIU34-MCVARM-01
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SIU34-MCVARM-01 is a Modular Open Systems Approach (MOSA) DO-178C & DO-254 Certifiable Mission Computers (MC) with low power high performance OpenVPX Xilinx UltraScale+ SBC with Quad Core ARM Cortex -A53, 8 GB DDR4 SDRAM, 32 GB SATA Flash, 2 x 10/100/1000Base-T Ethernet, USB 3.0, FIPS-140-3 Level 3 Cyber Security, and Single Event Upset support.
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Product
COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
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The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
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- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Product
SMARC Short Size Module with NXP i.MX 8M Plus
LEC-IMX8MP
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ADLINK LEC-IMX8MP, based on the powerful NXP i.MX8M Plus (quad core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU) operating at up to 2.3 TOPS., is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. Additionally, it supports dual Image Signal Processors and two camera inputs for an effective Vision System. The LEC-IMX8MP is suited for applications such as smart home, building, city and industry 4.0.
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Product
COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
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The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Product
3U OpenVPX Power PC SBC
68PPC2
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NAI’s 68PPC2 is a 3U OpenVPX, NXP® , QorIQ® T2080 quad-core processor, PowerPC-based, Single Board Computer (SBC) that can be configured with up to two intelligent function modules. Ideally suited for rugged defense, commercial aerospace, and industrial applications, the 68PPC2 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems.
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Product
PXIe-8399, Gen 3, x16, 2-Port PXI Remote Control Module
784180-01
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PXIe, Gen 3, x16, 2-Port PXI Remote Control Module—The PXIe-8399 enables control of a PXI Express chassis from an external host, such as a desktop PC, rackmount controller, or a separate master chassis. Using a Gen 3 x16 PCI Express link, the PXIe-8399 provides up to 16 GB/s of data transfer between the chassis and host over a copper cable connection. An additional port allows daisy-chaining for multi-chassis configurations.
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Product
Intel® Processor N Series And Atom® X Series Expandable, Cost-Efficient Modular Industrial Computers
MXC-330
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Intel® latest ADL-N cost-performance embedded Fanless system, DDR5 SO-DIMM, various IO interface for different industrial applications, including Isolation COM port & DIO, 4x GbE LAN, M.2 expansion slot for general application.
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Product
COM Express® Type 6 Reference Carrier Board in ATX Form Factor
Express-BASE6
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The Express-BASE6 is an ATX size COM Express Type 6 reference carrier board. Together with the COM Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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Product
Extreme Rugged PC/104-Plus Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM2-BT2
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The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Product
SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
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- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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Product
SMARC Short Size Module with NXP i.MX 8M
LEC-iMX8M
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- Quad Arm® Cortex®-A53 and Cortex-M4- Cryptographic co-processor for end-to-end IOT security- Full 4K UltraHD resolution HDMI 2.0a and dual channel LVDS- Two MIPI-CSI-2 camera inputs- 2x GbE LAN (optional TSN support), USB 3.0/2.0 and OTG- Standard or rugged support: 0°C to 60°C or -40°C to 85°C- 15 year product availability
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Product
3U OpenVPX™ Rugged, Cybersecure & Anti-Tamper Single Board Computer
68ARM2
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The 68ARM2 is a 3U OpenVPX Zynq® UltraScale+™ Quad-core ARM® Cortex™-A53 MPCore™ based Single Board Computer that can be configured with up to three NAI Smart I/O and communications function modules. Ideally suited for rugged Mil-Aero applications, the 68ARM2 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.
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Product
ARM Computer
SYS-398Q-2G-0
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WINSYSTEMS’ SYS-398Q is an enclosed embedded computer system offering high-performance multimedia graphics and a rich industrial I/O mix. The NXP® i.MX6Q processor's integrated power management provides excellent power efficiency and allows operation from -40° to +85°C without active cooling. It is designed for demanding graphical applications in security, transportation, medical, and digital signage.
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Product
Intel® Core™ I3-N305 Processor And Intel® Processor N-Series 3.5" SBC
MIO-5154
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Intel® Core™ i3-N305, N-series N97 and N50Single Channel DDR5-4800 up to 16GB3 independent display: LVDS + HDMI + DPDual GbE, 6 USB, 6 COM, SMBus/I2CExpansion: M.2 E-Key 2230, M.2 B-Key 2280 & 3052Supports iManager & Software APIs, WISE-DeviceOnSupport Windows 11 IoT Enterprise LTSC
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Product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
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The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
