Thermal
The radiation of heat.
See Also: Energy, Chemical, Electrical, Nuclear, Electromagnetic, Thermal Shock, Thermal Test, Infrared
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Product
Battery Starting & Charging System Analyze
12-2415
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*Shown with optional 12-2416 barcode scanner*Graphical Hand-Held Tester with Thermal Printer and USB Port*Tests 12V Flooded, AGM, Gel Cell, & EFB Batteries from 100 to 2000CCA*Graphical/Symbol Based LCD display*Tests 12/24V charging and electrical systems*Stores last 70 test series with or without power*Carrying case, printing software and USB cables included*Built-in thermal printer with thermal paper (611305)*Field-Replaceable Cables (900165)
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Product
3.5" Embedded SBC With Intel® Atom® Processor E3845/E3827, LVDS/VGA/HDMI, Dual LANs, Audio And ZIO
CAPA840
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The CAPA840, a fanless 3.5-inch embedded single board computer, is based on the latest generation of Intel® Atom® processor E3845 or E3827 featuring 1.91/1.75GHz clock speed. Two DDR3L SO-DIMM slots support system memory up to 8 GB. Moreover, the fanless embedded board delivers better level of processing and graphics performance than previous generation Intel® Atom™ SBCs, while consuming less power. In addition to rich onboard I/Os, the CAPA840 adopts an ZIO connector on the rear-side that integrates PCIe x1, USB, LPC and SMbus expansion. With excellent thermal design, the 3.5” embedded board is able to run fanless and works smooth between -20°C to 70°C environments.
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Environmental Test Systems
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Manufactured products can be exposed to both thermal and mechanical stresses.These should not be considered separately, as the effects may be linked.IMV can supply vibration-test systems combined with climatic chambers to provide complete vibration, temperature and humidity environmental testing.These systems can be custom-designed to meet your application.
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CTE Tester
CTE-360
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The CTE-360 measures thermal expansion coefficients on wide range of materials over a temperature range of -20°C to 100°C. Although intended primarily for the study of materials used in electronic packaging applications, it can be used on virtually any solid, gel, paste, or viscous liquid over this temperature range.
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Electronics
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Electromagnetic, Signal Integrity, Thermal and Electro-Mechanical Simulation Solutions. The use of Ansys Electronics solution suite minimizes the testing costs, ensures regulatory compliance, improves reliability and drastically reduces your product development time. All this while helping you build the best-in-class and cutting-edge products. Leverage the simulation capability from Ansys to solve the most critical aspects of your designs
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Sensors Test Cells
Integrated MEMS
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The best technical performance, cost optimization, one-shot factory integration.A single unit integrates the modules for the handling, contacting and complete testing of MEMS devices, including the physical stimulus for functional test, and the tri-temp thermal conditioning.
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Product
IEC60884 Fig38 Thermal Compression Test Device For Plug Testing
IEC60884 fig38
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Shenzhen Chuangxin Instruments Co., Ltd.
IEC60884 fig38 thermal compression test device for plug testingUsed to evaluate the pressure resistance of electrical accessories and wall mounted mounting boxes under heatStandard: GB2099.1-2008 Articles 24.19 and 25.4 and Figure 38, IEC60884-1 Figure 38, etc.
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1000 Amp Clamp with IR Thermometer
FLIR CM78
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The FLIR CM78 is a True RMS industrial clamp meter for the electrician who works on high-powered equipment and temperature systems and needs a safe, capable combination tool. An integrated IR thermometer provides fast non-contact measurements on panels, conduits, and motors. FLIR Tools Mobile connects the FLIR CM78 to your compatible smartphones and tablets via Bluetooth®, and METERLiNK® technology wirelessly integrates electrical readings on your infrared image with FLIR thermal cameras.
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Portable Hardness Tester with Printer
PHT-3500
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State of the art, digital tester is designed to test the hardness of large hard metal parts. Loaded with useful functions and a built in mini-printer the PHT-3500 is clearly the industry leader for fast accurate hardness testing with advanced USB output and thermal printing capabilities.
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Building Inspection Kit
MR160-KIT2
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Troubleshoot moisture and building problems wherever you go with the FLIR MR160-KIT2. This kit features the MR160, a moisture meter with IGM™ to quickly target problem areas, as well as the C2, a full-featured, pocket-sized thermal camera designed for a wide range of building and electrical applications. The MR160’s integrated pinless sensor and external pin probe provide the flexibility to take either intrusive or non-intrusive measurements. The kit also includes the MR06 wall cavity probe for even greater functionality.
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Product
instrumentation microphone
josephson c550h
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A precision omnidirectional measurement microphone by Josephson Engineering that is thermally conditioned for stability and manufactured in California. These mics are individually calibrated and matched for sensitivity at the Josephson facility. The nose diameter fits nominal ½” calibrators perfectly. This is an excellent product and a great value for an instrumentation microphone and is supplied with a mounting clip and vinyl pouch.
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Temperature Measurement IR Sensors & Detectors
ST60 TO-18
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A single-channel silicon-based thermopile provides lowest cost solutions in a small active area of 0.61mm x 0.61mm in a small TO-18 package. Time constant of 18ms with Nitrogen encapsulation gas. Delivers a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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Product
Semiconductor
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With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Torque Instrument
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DTR is a microprocessor based digital indicator, totally autonomousand with input for strain gauge based torque transducers.A ≤±0,02% accuracy makes it possible to be used use in qualitysystems as first or second line sample, periodically calibrated by aSIT center. Measuring system consists of a particularly long-termstable analogue section, of a carrier frequency amplifier whichminimises thermal drifts and of a 16 bits A/D converter whichensures 65.000 internal divisions.
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Product
192 X 1 Or 96 X 2 cPCI Low Thermal Relay Scanner Module
DP-cPCI-4032
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DP-cPCI-4032, is a hot swappable high density 192x1 or 96x2 relay scanner module. DP-cPCI-4032 is implemented as a 6U cPCI module.The 96 channel scanner is divided into six banks of 16x2 scanner. The banks are isolated from each other using tree switches. Six tree switches are used, one tree switch for each bank. A common tree switch is used to group all the six banks. Depending on the application requirement, it can be configured as 96 x 2 or 192 x 1 scanner. For short circuit protection, resistors are provided for all the common terminals.
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Product
Thermal needle system thermal resistivity / conductivity measurement
MTN01
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Hukseflux Thermal Sensors B.V.
The MTN01 Multi-purpose Thermal Needle System allows performing fast measurements of the thermal resistivity or conductivity of soils. It is specifically designed to be reasonably robust, as well as accurate. It is therefore suitable for laboratory as well as field- measurements of soil thermal properties. The sensor is a Non-Steady-State Probe (NSSP), TP07, which is mounted on the Insertion Tool, IT02. The system is operated using a hand-held Control and Readout Unit CRU01.
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Product
IR FPA sensors
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IR FPA sensors are the most important modules of thermal imagers. Design of sensor electronics (camera core) is a crucial part of designing of new thermal imager. Knowledge of precise parameters of IR FPA sensor is needed by both professionals involved in both IR FPA technology/thermal imagers technology because parameters of IR FPA sensors determine performance limits of thermal imagers. Therefore test equipment that enable measurement of IR FPA sensors is a vital tool for development of both IR FPA technology/thermal imagers technology. It is commonly known that data sheets provided by manufacturers of IR FPA sensors (both cooled or non-cooled) provide too little details for electronics designers. Sometimes the provided data is not accurate enough and better sensor performance can be achieved using modified control signals. Therefore design teams loose sometimes years to develop electronic camera core optimized for a specific IR FPA sensor. When the type of the IR FPA sensor is changed the whole process is to be repeated. In this situation an universal, flexible camera core that would accept IR FPA sensors from different manufacturers and to carry out semi-automatic determination of optimal signal controls for a specific IR FPA sensor would be highly desirable.
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Product
Infrared Calibrators
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Electronic Development Labs, Inc.
Designed to test, verify, and calibrate infrared thermometers, pyrometers, and thermal imagers for accuracy.
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Product
Temperature, Velocity & Pressure Measurement
ATVS-NxT
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Advanced Thermal Solutions, Inc.
The ATVS-NxTTM hot wire anemometer is a fully-portable scanner that provides rapid and highly precise of temperature and air velocity measurements for thermally characterizing electronic packages.
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Product
Thermal Profiler
V-M.O.L.E.®
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The V-M.O.L.E. is a full-featured compact thermal profiler that belies its sophistication in an easy-to-use 3-channel Mini-thermocouple configuration. Ideal for VERIFICATION of PCB profile performance, 3 channels give you Hot, Cold and Sensitive component data for verifying the correct oven settings.
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Product
MAX31855 T-Type Thermocouple Arduino Shield
SEN-30004-T03
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Four channel MAX31855 digital thermocouple Arduino Shield. Two versions of this shield are avaliable for each thermocouple type: either 'Ch 0-3' (CS pins use Uno/Mega IO pins 7-10) or 'Ch 4-7' (CS pins use Uno/Mega IO pins 3-6), with the only difference being which set of zero-ohm resistors are populated on the board. This allows use of other SPI devices that may be 'hard coded' to specific digital pins on the Arduino, or simply stacking one of each type together to get a total of eight thermocouple channels on one Arduino.Each order comes with one board and a set of four female, long extension, headers that can be soldered to the board. If stacking two of these modules on top of each other, please order both a Ch 0-3 and a Ch 4-7 board, as well as an additional set of headers for stacking. We're working on sourcing even longer headers, but the ones currently available are not long enough to stack as-is (they need to be double-stacked).The MAX31855T supports a measured temperature range of -270C-400C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or MegaNote: we also offer a universal version of this board in a smaller for factor, the SEN-30003-T.FeaturesType-specific, miniature-sized vertical thermocouple connectors (vertical flat blades, see pics)Measures four (4) thermocouple channels, full extended range.Boards are stackable. Up to 8 thermocouple channels may be connected to an Arduino.14-bit SPI interfacePlugs directly into an Arduino Uno or Mega form factor with built-in voltage level translation on-board.Standard Arduino female headers required for easy configuration, one set included with order (1-6x1, 2-8x1, 1-10x1 0.1" female stackable headers), not soldered on.Detects shorts to GND or VccDetects open thermocoupleOther versions available (K, J, and T stocked). Contact Customer Service to place a custom order.Mounting holes for 4-40 sized screwsConnections are spaced for 0.1" pin headerDesigned, manufactured, tested and shipped from the USA The MAX31855T supports a measured temperature range of -270C-400C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or Mega
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Product
MAX31855 J-Type Thermocouple Arduino Shield
SEN-30004-J47
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Four channel MAX31855 digital thermocouple Arduino Shield. Two versions of this shield are avaliable for each thermocouple type: either 'Ch 0-3' (CS pins use Uno/Mega IO pins 7-10) or 'Ch 4-7' (CS pins use Uno/Mega IO pins 3-6), with the only difference being which set of zero-ohm resistors are populated on the board. This allows use of other SPI devices that may be 'hard coded' to specific digital pins on the Arduino, or simply stacking one of each type together to get a total of eight thermocouple channels on one Arduino. The MAX31855J supports a measured temperature range of -210C-1200C with known thermal characteristics and output resolution of 0.25C. Included thermocouple connectors are type-specific to provide proper material continuity as close to the IC as possible. The SEN-30004 is interfaced via 3 or 4-wire SPI and a high-speed level shifter is included to allow the board to plug directly into an Arduino Uno or Mega
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Product
Thermal Camera for Drones
FLIR Vue Pro
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Designed for professional use, FLIR Vue Pro is more than a thermal camera, it is a thermal measurement instrument and data recorder that adds tremendous value to your sUAS operations and services.
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Product
Coaxial Test Contactor
ICON
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The ICON™ test contactor designed specifically for maintaining the native impedance of the device-under-test (DUT) through the contactor to the test system, maximizing high frequency power transfer by minimizing signal reflections (Return Loss).The metal body is a Faraday shield/cage, which reduces cross talk (electromagnetic radiation) the primary cause of signal jitter. Along with this, the aluminum body blocks both static and non-static external electric fields (random noise). Featuring exceptional DC and RF performance and excellent thermal management.
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Systems Integration for Circuit Card Assembly
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Teledyne Advanced Electronic Solutions integrates CCAs and other sub-assemblies, cables and fabricated parts into system modules shipped directly to customers for integration into their products.- Box Build: custom built to order system solutions- High complexity box assemblies and subsystems- High frequency RF box assemblies and subsystems- Full functional RF testing up to 26 GHz (K band)- Multi-level systems integration – build and test modules and CCAs and integrate into higher level assemblies- Custom cell design for customer subsystems- Special bonding processes including thermal management and vibration- Robust torque and FOD control programs- System level testing including functional, vibration and thermal- Complex harness fabrication and integration- Fiber-Optic and RF waveguide integration and testing- Large system capacity in excess of 200 lbs.- Configure to order – Integrate different options, firmware, configurations, etc across a single order as required
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Battery Monitoring Systems
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Actively managing your reserve power batteries delivers numerous benefits, such as enhanced reliability, extended service, elimination of undercharge and overcharge, preventing unexpected battery failure, and avoiding thermal runaways.
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Temperature Measurement IR Sensors & Detectors
ST60 TO-5
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A single-channel silicon-based thermopile provides lowest cost solutions in a small active area of 0.61mm x 0.61mm in a TO-5 package. Time constant of 18ms with Nitrogen encapsulation gas. Delivers a very low Temperature Coefficient of Responsivity of -0.04%/C. This detector has a very short thermal shock response to ambient temperature change.
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Product
Heating Microscope
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Heating microscopy is a non-contact technique that, based upon an advanced image analysis of a specimen subjected to a thermal treatment reproducing industrial firing conditions, identifies several characteristic shapes and related temperatures key to the optimization of manufacturing processes in ceramics, metals, and alloys.
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Product
Single LRU HD EO/IR Imaging System
Star SAFIRE® 380-HD
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The Star SAFIRE® 380-HD provides superior image stabilization, ultra-long range imaging performance, and true metadata embedded in the digital video. Featuring internal navigation for precise targeting, a MWIR thermal imager, optional HD color and low-light cameras, and multiple laser payload options, the system is fully hardened for military fixed-wing and helicopter operations. It can operate continuously in all conditions — even while sitting on the tarmac with no airflow.
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Thermal Test Vehicles
TTV
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Thermal Engineering Associates, Inc.
Using the TTC-1002 Thermal Test Chip as a basis, TEA offers TTVs in flip-chip, bare die, BGA packages for a variety of thermal simulation, reliability, qualification, heat sink characterization, and TIM characterization activities. Selective unused balls are sequentially connected together for daisy-chain applications.
