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The ARINC 818-3 IP core offers higher data rates and encoding for high-resolution real-time avionics video. ARINC818-3 standard provides 64B/66B schemes to support high-speed ARINC applications having data rates up to 28Gbps. Display emulation for testing, low latency guidelines, and fixing typographic errors to previous versions was new in this specification.
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IMB-M47-R680E
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Discover the pinnacle of industrial computing with our flagship IMB-M47-R680E ATX motherboard, tailored for the latest 14/13/12th Gen Intel® Core™ processors. Featuring the advanced Intel R680E chipset and integrated PCIe 5.0 technology, this motherboard accommodates up to seven high-speed PCIe slots, ensuring exceptional expandability and superior performance.
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Cooled Infrared Camera Cores and Detectors
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Cooled Infrared Camera Cores and Detectors by Lynred USA: HD Format, XGA Format, VGA Format, QVGA Format
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Compact Size Tower IPC with 12th / 13th Gen Intel® Core™ i CPU Socket (LGA 1700) and 250W PSU. Intel® 12th / 13th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with H610E chipset. Design for operator IPC and application with space limit, Dual USB 3.2 and dual USB 2.0 port on both front and rear side. Dual Independent Display (HDMI/ DP) 2 low profile Expansion slots (PCIe x16 and PCIe x4).
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Very high-performance Intel Hybrid Multi-core CPUs. CPUs up to i9 24 Core, Three independent monitors including 8k & HDR options. PCIe x16 graphics card slot.
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ASMB-787
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- LGA 1200 Intel® Xeon® W & 10th Gen. Core™ i9/i7/i5/i3 processors with W480E chipset- DDR4 2933/2666/2400 MHz ECC/Non-ECC UDIMM up to 128 GB- One PCIe x16 link (or two x8 link), two PCIe x4, and one PCIe x1 slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Five SATA 3 ports and six USB 3.2 ports- One M.2 2280/2242 (SATA / PCIe compatible)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
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PXI offers the optimal approach to validation and production testing. You can meet timing, synchronization, and throughput requirements across devices. PXI is a robust PC-based platform for measurement and automation systems, supported by software. PXI combines PCI electrical bus characteristics with CompactPCI's modular Eurocard packaging, and then adds special synchronization buses and important software functions.
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IP Core and FPGA Products
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Our FPGA offerings include development boards and IP cores for Altera FPGA devices. The IP cores include: I2C, PCIe, JPEG-LS, LVDS Camera Link and memory controllers.
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Industrial-grade true-flat touchscreen with IP66-rated front panelHigh-performance, fanless 13th gen Intel® Core™ processorsSlim Compact, fanless design with aluminum alloy enclosureSupports dual displays (1 x external DP), iDoor and PCI or PCIe1 x M.2 M Key 2242/2280 (SATA or NVME PCIe x 4) for storage, support SATA RAID 0,12 x 2500BASE-T Ethernet Supports Time-Sensitive Network(TSN) technologySupports VESA 100Support TPM2.0 hardware securitySupport iDoor, PCI or PCIe
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*CE, FCC certified; ISO 7637-2 compliant*LGA1151 7th/6th gen Intel® Core™ & Pentium® processors (up to 35W) with Intel® H110*Fanless and Wide operating temperatures from -40°C to +60°C*12/24 VDC power input, with power management (ACC ignition)*Single-sided I/O design for easy maintenance*Expansion capability for three PCI Express Mini Card slot and two internal SIM card slot
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MLB-3002
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- 2x PCIe Gen3 x4 expansion slot for Full Height Half Length add on card, each slot is 25W power budget and additional Molex 4 pin power cable (12V/1.5A and 5V/2A) support- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Intel® 12th/13th/14th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q670E chipsetFour DIMM sockets up to 128 GB DDR4 3200Triple display DP/HDMI/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2 Gen 2Advantech iBMC remote out-of-band power management solution on DeviceOnAWS (Amazon Web Service) IoT Greengrass qualifiedNote 1: Legacy platform is not supportedNote 2: dTPM 2.0 module is required to enable Intel vPro and TPM technologiesNote 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11
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Targeted at gaming customers and system integrators, AmITX-CF-G is a Mini-ITX board specially designed for Gaming. AmITX-CF-G features GLI compliance, easy and flexible configuration, security enhancements, and system resilience. The values of AmITX-CF-G include amplified visual impact, guaranteed system integrity, secure transactions with fast TTM and low TCO, and maximized system uptime. AmITX-CF-G can satisfy application function requirements and meet GLI certification which cannot be offered by other conventional Mini-ITX boards.
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For Loss- Frequency Range : 300Hz to 620KHz.- Impedance : 60 to 1000 ohms (40dB maximum).- Accuracy : ±1dB (upto 300KHz) ±2dB (300KHz to 620KHz).For Impedance- Frequency Range : 300Hz to 620KHz.- Impedance : 60 to 3000 ohms.- Accuracy : ±10% (upto 300KHz) ±20% (300KHz to 620KHz).
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- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
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Intel® Core™ Desktop Processors 12/13/14th Gen and Series 2Dual channel DDR5 5600MHz, max. 96GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen4 (16GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 LVDSRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 2 SATA12-24V DCin Power Input via ATX 8pin+5VSB pin headerWindows 11 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Thin design with 44.2mm in height.Support Intel® 8th Gen. Desktop Core i platform.Easy/ quick installation for additional peripherals.Support Wall/VESA/Rack mounting Kit.Lock type DC power jack.CE (No RED certification)Support SUSI, WISE-DeviceOn and Edge AI Suite.
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IP Cores & Software Tools
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Utilizes our Board Support Packages to get your hardware implementation underway as quickly as possible. The BSP gives you the control, flexibility and power to develop solutions for your most demanding digital signal processing applications.
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eBOX560-500-FL
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The eBOX560-500-FL is an Intel® Skylake-based fanless embedded system with compact size and full-featured I/O interface. To bring both excellent performance and ultra-low power consumption, the palm-sized embedded box PC is powered by the 6th generation Intel® Core™ i7-6600U or Celeron® 3955U processor (formally codename: Skylake). One 260-pin DDR4-2133 SO-DIMM socket with system memory up to 16 GB is available. The power efficient IP40 embedded system supports 12V DC input with screw-lock and features a user-friendly AT/ATX DIP switch. The compact eBOX560-500-FL is suitable for Industrial Internet of Things (IIoT) solutions, digital signage, retail equipment, smart factory automation, thin clients, industrial controller systems and many more.
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ASMB-586
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- LGA 1151 Intel® Xeon® E and 8th/9th generation Core™ i7/i5/i3 processors with C246 chipset- DDR4 ECC/Non-ECC 2666/2400/2133 MHz UDIMM up to 128GB- One PCIe x16, two PCIe x4 and one PCIe x1 slots- Triple displays - DVI-D, VGA and HDMI 2.0 ports- Eight SATA3 ports and six USB 3.1 ports- 0 ~ 60° C ambient operating temperature range
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SBC326, 3U OpenVPX 4th Generation Intel Core i7 Single Board Computer
SBC326
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The SBC326 Rugged Single Board Computer features the high performance, highly integrated 4th Generation Core i7 processor platform from Intel.
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COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
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ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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LGA 1700 Intel® 12th Gen. Core™ ATX Server Board with 4 x DDR5, 5 x PCIe(1 x Gen 5, 3 x Gen 4, 1x Gen 3), 7x USB3.2, 4xSATA3, Quad/Dual LANs, and IPMI
ASMB-788
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- LGA 1700 Intel® 12th Gen. Core™ i9/i7/i5/i3 processors with W680 chipset- DDR5 ECC/Non-ECC 4400/4000/3600 MHz UDIMM up to 128 GB- One PCIe x16 (Gen 5) and four PCIe x4 (3 x Gen 4 & 1 x Gen 3) slots- Triple displays - DVI-D, VGA, and HDMI 2.0 ports- Four SATA 3 ports and seven USB 3.2 ports- One M.2 2280 (PCIe x4)- Rackmount optimized placement with positive air flow design- 0 ~ 60 °C (32 ~ 140 °F) ambient operating temperature range
