Single Board Computers
Whole computer on one PCB.
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Product
COM-HPC Server Type Modules
Computer on Module
The COM-HPC specification currently defines two server modules. The largest of the server modules, Size E (200mm x 160mm), offers up to eight on-board DIMM sockets. The power input is a single 12-volt supply that can deliver up to 358 watts of power, and there are 64x lanes PCIe Gen5 in total.
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Product
COM Express Compact Size Type 6 Module with Up to Quadcore Intel® Core™ and Celeron® Processors
cExpress-WL
Computer on Module
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and up to 64GB memory capacity, offering edge computing applications uncompromising performance and responsiveness despite SWaP constraints. The cExpress-WL is suited for applications such as data acquisition and analysis, image processing, and 4K video transcoding and streaming at the edge.
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Product
6U CompactPCI Dual 64-bit PMC Slots Carrier Board
cPCI-8602
Carrier Board
- Supports two single-size 32,64-bit/33,66 MHz PMC sites in 4HP width- PICMG® 2.0 32,64-bit/33,66 MHz cPCI bus- PICMG® 2.1 Hot Swap Specification Compliant- 3.3V or 5V V(I/O) for cPCI bus and PMC sites- PLX® PCI-to PCI bridge PCI6154 for PCI bus- Power and HotSwap LED incidators on front panel
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Product
COM Express Compact Size Type 6 Module with AMD Ryzen™ Embedded V2000 APU (Zen 2 architecture)
cExpress-AR
Computer on Module
The cExpress-AR, featuring the new AMD Ryzen™ V2000 APU with its high performance integrated Radeon™ graphics, is the first Type 6 module on the market to support an octa-core (8-core) embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier embedded quad-core V1000 processors, the additional cores combined with AMD's Zen 2 architecture result in a more than two-fold performance increase and double the performance-per-watt efficiency.
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Product
COM Express Basic Size Type 7 Module with Intel® Xeon® D SoC and 4 SODIMMs
Express-BD74
Computer on Module
- 4 SO-DIMMs, up to 128GB dual channel DDR4 at 1866/2133/2400MHz ECC (dependent on SoC SKU)- Intel® Xeon® D SoC (up to 16 cores)- Two 10G Ethernet and NC-SI support- Up to 32 PCIe lanes (24x Gen3, 8x Gen2)- GbE, two SATA 6 Gb/s, four USB 3.0/2.0- Supports Smart Embedded Management Agent (SEMA®) functions
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Product
COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
Computer on Module
The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3000
Industrial Computer
- Medical grade computer compliant with IEC 60601-1:2005 + A1:2012 + A2:2020 (3.2 edition) / IEC 60601-1-2:2014 + A1:2020 (4.1 edition)- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
3U CompactPCI Serial M.2/U.2/SATA Storage Carrier
cPCI-A3H20
Carrier Board
- 1x NVMe M.2 and 1x NVMe U.2 drive slot- 1x optional SATA 6Gb/s M.2 drive slot shared space with NVMe U.2- Status LEDs on faceplate: drive activity, hot-swap status, user-configurable- Operating temperature: -40°C to +85°C with qualified modules- EN50155 compliant
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Product
Computer On Modules
ETX/XTX
Computer on Module
ETX / XTX CPU module eqiupped with Intel Atom has great I/O capacity and meets both ISA and PCI needs, while supporting the Computer On Module concept for plug-in CPU modules. Advantech is a founding member of the ETX Industrial Group (ETX-IG).
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Product
High Resolution Laser Axis Board
N1225A
Laser Board
The Keysight N1225A provides ultra-sensitive fiber optic receivers and high resolution distance measurements for high performance positioning systems using laser interferometry with VME bus systems. Multiple N1225A boards can be linked together for up to 31 axes of position measurement. Includes "oscilloscope like" data capture operated with standard web browsers.
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Product
COM Express Mini Size Type 10 Module with Intel Atom® E3900 Series, Pentium®, and Celeron® SoC (formerly Apollo Lake)
nanoX-AL
Computer on Module
The nanoX-AL is a COM Express® COM.0 R3.0 Type 10 module supporting Intel Atom® processor E3900 series system-on-chip (SoC). The nanoX-AL is specifically designed for customers who need optmized processing and graphics performance with low power consumption in a long product life solution.
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Product
SMARC Short Size Module with NXP i.MX 6 Multicore Arm® Cortex®-A9
LEC-iMX6R2
Computer on Module
- NXP SoC i.MX6 ARM Cortex A9 Solo, DualLite, Dual or Quad processor- Integrated 2D/3D graphics processors, 3D 1080p video processing, power management- Onboard DDR3L-1600 system memory from 512 MB to 2 GB- Supports up to 64 GB eMMC, 1x SD/MMC, 1x SATA 3Gb/s- Extreme Rugged operating temperature: -40°C to +85°C (optional)- 15 year product availability
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer
MVP-6000 Series
Industrial Computer
ADLINK's newly introduced MVP-6000 Series of fanless embedded computing platforms, incorporating the 6th Generation Intel® Core™ processor (Code name: Skylake), provides one PCIe Gen3 x16, one PCI slot, 1 mini PCIe slot and single-side access for I/O ports, optimizing easy maintenance in industrial automation environments. The series retains the robust design of all ADLINK MXC/MXE lines, at a new extremely cost-effective price point.
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Product
COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
Computer on Module
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Product
COM Express Type 6 Development Kit
COM Express Type 6 Starter Kit Plus
Computer on Module
The Type 6 Starter Kit Plus consists of a COM Express Type 6 module with ATX size Type 6 reference carrier board that offers one PCI Express x16 slot with proprietary pinout for DDI adapter card that convert DDI signal to DP or HDMI signal, one PCI Express graphics x16 slot, one PCI Express x4 slot, three PCI Express x1 slots, Serial ATA, VGA, LVDS, USB3.0/2.0, Gigabit LAN and Super I/O. All necessary cables are included.
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Product
XMC Mezzanine Processor
XMC-121
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Curtiss-Wright Defense Solutions
Designed for space-constrained size, weight and power (SWaP)-sensitive programs, the XMC-121 small form factor Intel Xeon x86 single board computer (SBC) offers extremely powerful x86 processing with a low power and small sized footprint.
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Product
DIN-Rail Wiring Terminal Board With CJC Circuit
PCLD-8710
Terminal Board
Low-cost screw-terminal with 68-pin SCSI-II connectorOnboard CJC (Cold Junction Compensation) circuits for direct thermocouple measurementReserved space for signal-conditioning circuits such as low-pass filter, voltage attenuator and current shuntIndustrial-grade screw-clamp terminal blocks for heavy-duty and reliable connectionsDIN-rail mounting case for easy mountingSupports PCI-1710U/UL, PCI-1710HGU, PCI-1711U/UL, PCI-1716/L
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Product
Quad QSFP28/QSFP+ FMC+ Module
FPGA Board
iWave’s QSFP28/QSFP+ 2×1 Stacked FMC+ HSPC Module is designed to meet VITA 57.4 FMC+ Standard. This FMC+ Module is supported by two stacked QSFP28/QSFP+ ports(Upto400G) with 4-Bit Silicon Labs programmable clock synthesizer (default = 156.25Mhz). A flexible reference clock for on the QSFP28/QSFP+ 2×1 Stacked FMC+ Module is fully programmable over the 0.16 to 710 MHz range through I2C. Each QSFP28/QSFP+ ports are directly connected to four multi-gigabit serial transceivers banks of Vita 57.4 compliant carrier Board.
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Product
SMARC Short Size Module with NXP i.MX 8M Plus
LEC-IMX8MP
Computer on Module
ADLINK LEC-IMX8MP, based on the powerful NXP i.MX8M Plus (quad core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU) operating at up to 2.3 TOPS., is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. Additionally, it supports dual Image Signal Processors and two camera inputs for an effective Vision System. The LEC-IMX8MP is suited for applications such as smart home, building, city and industry 4.0.
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Product
34945EXT Distribution Board, For Two 87104x/106x L7x0xx Multiport Or 87406B Matrix Switches
Y1151A
Distribution Board
The Y1150A-Y1155A distribution boards enable simple connections to the external switches. The distribution boards plug onto the 34945EXT and are used to route the power and control signals from the driver module to the switches using standard cables.
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Product
High-Resolution VMEbus Laser Axis Board
10897D
Laser Board
The 10897D High-resolution VMEbus laser axis board provides excellent resolution of up to 0.3 nm with a high resolution interferometer. The data age uncertainty is dramatically reduced allowing extremely accurate measurement and control of moving systems. The very high data rates accommodate high-bandwidth and high-performance closed-loop applications. Configured with appropriate lasers and optics components, the 10897D supplies unsurpassed positioning accuracy for dynamic measurement.
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Product
Computer-On-Module
Qseven®
Computer on Module
Qseven is an off-the-shelf, multi-vendor, computer-on-module that integrates all the core components of a common x86 PC and is mounted onto an application specific carrier board. A single ruggedized 230-pin MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven module.
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Product
PXI Express Optical FPGA Board
HSS-8324
FPGA Board
The Conduant HSS-8324 Optical FPGA board provides the user with a hardware platform that is able to sustain full-duplex high-bandwidth transfers through its 8-lane Gen3 PXI Express (PXIe) interface and its 24-lane optical interface. The PXIe interface provides a theoretical maximum throughput of 8GB/s (simultaneous in and out).
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
M/MA Module Carrier
VX405C
Carrier Board
The VX405C carrier provides the mechanical and electrical interfaces between the VXIbus and up to six (6) VITA 12-1996 standard M/MA-Modules. The carrier provides VXI register configuration and access to the M/MA-Module I/O space and memory (if present). Each M/MA-Module is controlled separately and appears as a different logical address in the VXI environment. Over 100 M/MA-Modules are available that can provide custom interfacing to the unit under test (UUT). Up to six (6) unique interfaces may be provided in a single VXI slot.
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Product
Digital Output Board
VME-2128A
Digital Output Board
VME-2128A 128-bit High-Voltage Digital Output Board with Built-in-Test
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Product
Digital Input Board
VME-1129
Digital Input Board
VME-1129 128-bit high voltage digital input board with Built-in-Test and input filter. This product complies with the VMEbus specification (ANSI/IEEE STD 1014-1987, IEC 821 and 297), with the following mnemonics: A24:A16: D32/D16/D08 (EO): Slave:39/3D: 29/2D Form Factor: 6U
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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
Computer on Module
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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Product
1U 19” Edge Computing Platform with Intel® Xeon® D Processor
MECS-6120
Edge Computing Platform
- 1x Intel® Xeon® D-17XX Series family processor- 3x DDR4-2666 RDIMM ECC REG up to 192GB- 2x 2.5” SATA bays and 2x M.2 M Key interfaces- 420mm depth 1U 19” rackmount form factor- Built-in Intel® QAT: SSL (20G), Compression (15G)- Intel® eASIC by card for FEC acceleration- EMC grade: Class B & Advanced chassis management, IPMI v2.0 compliant
