3D
three dimensions.
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Product
Precise 3D Profilometry
µscan
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Using the NanoFocus µscan technology, you can measure up to 100 times faster than with conventional probe systems. Various µscan sensors are available for the different application areas. The optical profilometers of the µscan series are suitable for the fast scanning of surface profiles with precision in the low nanometer range.
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Product
MAGNETIC FIELD CAMERA SEN-3D-CAM
SENCAM
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Introducing the **SENCAM – MAGNETIC FIELD CAMERA SEN-3D-CAM**, the world's first true 3D magnetic field camera designed for unparalleled precision and speed. Engineered with the cutting-edge Senis proprietary 3D Hall technology, this remarkable camera captures all three magnetic field components—Bx, By, and Bz—simultaneously. The compact, lightweight design allows it to easily fit into tight workspaces, making it the ideal choice for applications in magnetic systems development, quality assurance, and production line inspections. With a world-class spatial resolution of 100 µm and a sensitive volume of just 27µm x 9µm x 4µm at each pixel, users can expect highly accurate representations of magnetic fields, even in complex scenarios where field gradients are significant.SENCAM operates at an impressive image acquisition rate of up to 7 images per second, allowing for real-time tracking and analysis of magnetic fields. The camera boasts 16,000 pixels across its imaging surface, solidifying its status as a leader in high-speed magnetic imaging technology. Coupled with USB-C connectivity, data transmission is streamlined for immediate analysis and visualization. Additionally, with the optional Senis 2D Vision Commander Software, users can perform advanced magnetic image analyses, enabling sophisticated interpretation of magnetic data. Whether used in laboratories or industrial settings, the SENCAM is transforming the landscape of magnetic field measurement.
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Product
COM Express Type 10 Mini Module With Intel® Pentium® & Celeron® N3000 Series Processors
CEM300
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The CEM300, a COM Express® Type 10 module, supports Intel® Pentium® N3710 and Celeron® N3160/N3060 quad-core/dual-core processors (codename: Braswell) with support for 4 GB DDR3L memory onboard. Integrated with Intel® Gen 8 graphics, the COM Express® Type 10 computer-on-module provides excellent graphic performance including support for DirectX 11.1, OpenGL 4.2, and 3D features and resolution up to 4K (3840 x 2160 @ 30 Hz). The ultra-small mini module comes with 4 to 6 watts low power consumption, and provides wide range voltage power input of 4.75V to 20V for harsh industrial environments. The Axiomtek CEM300 is ideal for IoT-connected industrial controls, medical imaging, retail equipment, MMK (Multi Media Kiosk), industrial gateway, automation and POS terminals related applications.
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Product
In-Line Vision & Rejection
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Customizable 3D, full color, 360-degree Product Quality Inspection Solution that integrates seamlessly into existing production lines to measure multiple quality parameters at speeds of up to 100 objects per second. For advanced process control, each system is equipped with a conveyor, cameras selected for your specific application, and a choice of rejection options.
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Product
Industrial AI Camera
CAM-5530-G
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3D stereo GMSL2 camera with RGB 1MP global shutter and depth 1MP global shutter. Baseline: 95mm. Depth range: 0.1m~20m+. Works indoors/outdoors.
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Product
ATX Motherboard With LGA1151 Socket 9th/8th Gen Intel® Core™
IMB521R
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The IMB521R is powered by the LGA1151 socket 9th and 8th generation Intel® Core™ i7/i5/i3 (code name: Coffee Lake Refresh), Intel® Pentium® or Intel® Celeron® processor with the Intel® C246 chipset. The industrial motherboard is designed with rich functionality and offer high processing powers, multiple expansion interfaces, security feature, and stunning graphical performance to deliver true customer value and quick deployment in a broad range of high-performance applications such as industrial automation, gaming, AI-related server, self-service kiosks, medical, and digital signage. It features one PCIe x16 slot, four PCIe x4 slots, one PCIe x1 slot and one PCI slot for future expansions such as motion control cards, frame grabber cards or data acquisition cards. It also has two USB 3.1 Gen2 and four USB 3.1 Gen1 ports for faster data transfer. In addition, the industrial-grade ATX motherboard is integrated with the Intel® HD Graphics to deliver stunning 4K resolution, as well as fast 3D and video playback for graphics-intensive applications. It support three independent displays with DisplayPort++, DVI-D, HDMI, and VGA.
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Product
Raman Imaging & High Resolution Spectrometer
LabRAM Odyssey
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Special 50 years anniversary series: true confocal Raman microscope enabling the most detailed images and analyses to be obtained with speed and confidence. Ideally suited for both micro and macro measurements, it offers advanced confocal imaging capabilities in 2D and 3D. With guaranteed high performance and intuitive simplicity, the LabRAM Odyssey™ is the ultimate instrument for Raman spectroscopy, widely used for standard Raman analysis, PhotoLuminescence (PL), Tip Enhanced Raman Spectroscopy (TERS) and other hybrid methods.
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Product
The Ranger Series
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The Ranger Series is designed for the most demanding mapping applications, no compromises made. With a 1350 meter laser range, this system produces photorealistic 3D point clouds of very large regions. The Ranger is a true universal payload in that it’s designed for manned and unmanned aircraft as well as ground vehicles.
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Product
Measurement Software
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Revolutionary, industry-standard, easy-to-use 3D measurement software and CAD modules.
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Product
Laser Scanners
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RTC360ScannersDelivering outstanding range, speed and highest quality 3D data, Leica Geosystems laser scanners are the perfect partner for any tasks in 3D laser scanning.
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Product
Non-contact Ultra-High Range Sheet Resistance Measurement System
CRN-100
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*Ultra-High range sheet resistance measurement for 10E+9 ~ 10E+15 ohm/sq without contacting*Mapping program software;*1. Arranged in a multipoint pattern measurement is programmed*2. 2-D & 3-D mapping software*Easy operation by Windows 7 system software*Measurement data base link with Excel via CSV format file*Unaffected by contact resistance
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Product
Fiber End-Face Inspection Interferometer
CLEAVEMETER 3D
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The CLEAVEMETER 3D™ is a non-contact interferometer designed for inspecting the end-faces of cleaved or polished optical fibers with cladding diameters of 125 µm to 1200 µm. It gives immediate and precise information on important end-face properties such as flatness, perpendicularity, hackles and dust. Based on the NYFORS CLEAVEMETER 3D™ design, in addition to producing sharp fringe patterns it also generates three-dimensional images of the cleaved fiber end.
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Product
X-ray Microscopy
ZEISS Xradia Versa
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Extremely versatile ZEISS Xradia Versa 3D X-ray microscopes (XRM) provide superior 3D image quality and data for a wide range of materials and working environments. Xradia Versa XRM feature dual-stage magnification based on synchrotron-caliber optics and revolutionary RaaD™ (Resolution at a Distance) technology for high resolution even at large working distances, a vast improvement over traditional micro-computed tomography. Non-destructive imaging preserves and extends the use of your valuable sample, enabling 4D and in situ studies.
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Product
Wafer Sorter and Inspection
SolarWIS Platform
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Eliminating the opportunity for problematic wafers to enter cell manufacturing lines greatly improves output and yield. ASM AE’s wafer sorter features 3D area inspection capability to inspect wafer thickness, total thickness variation (TTV), saw marks, as well as wafer bow and warpage. SolarWIS also includes modules that can inspect for stain, geometry, micro-cracks, edge chips, resistivity, P or N conductivity and lifetime.
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Product
Mems-Based Probe Cards
MEMSFlex
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Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Product
Enhanced Vision Systems
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Elbit Systems of America’s Degraded Visual Environment (DVE) solution uses intuitive 3D grid symbology along with a helmet tracker to provide critical helicopter/tilt-rotor cues during brownout operations. This system, which is an upgrade to the head-up display installed on many military helicopters, removes weight or drag penalties by eliminating nose-mounted sensors. The helmet tracker provides numerous ancillary benefits such as depicting the other pilot’s Line of Sight (LOS) for improved crew coordination, as well as providing the ability to slew weapons or optical payloads to the pilot’s LOS, hands-free and heads-up.
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Product
3D CT Micro-Tomography And High Resolution Digital Radioscopy
DeskTom
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Compact system with no maintenance. 5 motion axis. Small footprint.
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Product
Dual HDMI Input Expansion Card
FMC-HDMI
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Sundance Multiprocessor Technology Ltd.
The FMC-HDMI extends FMC-compatible FPGA systems with two HDMI Type A input ports. It’s extremely useful for image or video processing applications. One of the ports features a fully-fledged HDMI 1.4 receiver with CEC, HDCP, audio, and 3D TV support. The other port provides cable equalization and buffering for HDMI signals, leaving the decoding up to the user.
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Product
INnLline Metrology Automated & Robotized Solutions
Automation projects
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Bring automation to an existing manual inspection process. Integrate 3D measurements on the shop floor for better traceability. Increase part inspection throughput and reduce cycle times and costs.
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Product
3D Verification Station
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Omron’s 3D verification systems provide high-quality imagery to ensure the best results in post-solder inspection.
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Product
Functional Fixtures
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Joule''s strength is in the design and manufacture of functional test fixtures. Using 3D modeling software to create the fixtures allows us to actuate pneumatics, open and close overclamps, actuate side access units - all before a single part has been machined for the fixture.
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Product
Permanent Bonding Systems
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The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 1500 chambers. EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging. Industry-leading alignment accuracies of less than 100 nm and a high-volume-proven modular platform enables the combination of EVG’s wafer bonding technologies in various applications.
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Product
3D Bundle
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Cost effective bundle of eVision's 3D librariesIncludes Easy3D, Easy3DLaserLine, Easy3DObject and Easy3DMatch
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Product
Easy3DLaserLine
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Single and Dual Laser Line Extraction into a depth mapConvenient and powerful 3D calibration for laser triangulation setupsCompatible with the Coaxlink Quad 3D-LLE frame grabber
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Product
IP Cores
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logicBRICKS IP Cores by Xylon - for applications including compact multilayer video controller, versatile video input, multiview 3D transformation engine, image signal processing (isp) ulstraHD pipeline, high dynamic range pipeline, scalable 3d graphics accelerator, DDR3 SDRAM Memory Controller, slave hssl controller, HDR image signal processing framework, video design framework for multi-camera vision applications, and more
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Product
SMARC
ROM-5720
Computer-on-Module
Advantech ROM-5720 SMARC 2.0/2.1 Computer-on-Module is powered by NXP i.MX8M SOC which includes dual and quad-core Arm Cortex-A53 processors in combination with one Cortex-M4 real time processor and the Vivante GC7000 Lite 3D graphics engine. It provides USB3.0, two Gigabit Ethernet, two MIPI-CSI, PCI Express, and HDMI2.0 up to 4096 x 2160 at 60 Hz and MIPI-DSI for embedded applications. It's the ideal solution for transportation, infotainment, vending, Medical.
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Product
Automatic Vision Measuring Machine
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Sinowon Innovation Metrology Manufacture Ltd.
Moving bridge structure, measured workpiece is fixed;◆ Four-axis CNC fully auto close loop control, auto measurement;◆ “00” grade “JINANQING”marble base and pillar, stable and reliable;◆ Imported open type linear scale, resolution is 0.1um, high accuracy, great stability;◆ Imported P grade linear guide, precision grinding ball screw and AC servo motor, ensure accuracy stability of system position;◆ Imported high definition color industry camera, ensure clear observation and stable measurement requirement;◆ 6.5X continue auto zoom lens, precision auto zoom, only need to make pixel calibration once time;◆ Programmable 5-ring 8-division LED surface illumination, contour parallel LED illumination, can realize 256 grade brightness adjustment intelligently;◆ Equipped with imported touch probe, realize 3D measurement;◆ With proprietary fully auto measuring software iMeasuring 4.2, powerful function, simple operation;◆ Optional laser probe, it can also be customized according to customer request;◆ Optional FexQMS Measuring Data Analysis and Real-time monitoring software which enhance program control and reduce material
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Product
Profilometer
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NANOVEA Optical Profiler is a 3D, non-contact profilometer designed with Chromatic Confocal technology, which uses wavelengths of light to accurately determine physical height. The Optical Profilers NANOVEA offers include compact, stand-alone and portable profilometer models. High-speed sensors are available to scan large surface at high accuracy.
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Product
Scanning Probe Microscopy/Atomic Force Microscopy (SPM/AFM Analysis)
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Rocky Mountain Laboratories, Inc.
Scanning probe microscopy (SPM) refers to a family of measurement techniques that utilize a scanning probe. The most common measurement is Atomic Force Microscopy (AFM Analysis), which measures surface topography. Imaged areas can be from the nm scale to as large as 100 µm X 100 µm. Heights and depths of features can be measuredand many surface roughness parameters, e.g Ra, can be calculated. 3-D images can also be produced for dramatic data presentation. Magnetic and electrical response can also be measured with SPM.
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Product
PDS Wire Crane Monitoring System
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It shows a real time overview of the wire crane in navigation, profile, and 3D views; displaying the clamshell, pontoon/vessel, design depths and color-coded digital terrain model (DTM). The navigation view highlights the high and low spots and is updated in real time, registering the progress of the dredging work. The registration follows the shape of the clamshell, bucket or orange peel bucket and is visible immediately in all views. The system also shows the open/close status of the dredge tool. Up/down indicators show the operator the exact distance to the seafloor and design depth continuously. 3D design models allow the use of complex designs.
