SoC
A complete computer "System on a Chip".
-
product
3D-IC Solution
Consumer demand for increased bandwidth and low power in smaller form factor has forced design teams to pursue design and manufacturing alternatives to single system-on-chip (SoC) approaches. Moving to advanced geometries like 20nm/14nm is a natural progression; however, it has its own cost, yield, manufacturing, and IP reuse challenges.
-
product
Extreme Rugged PC/104-Plus, PCI-104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM3-BT4
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
-
product
Verification IP's
SmartDV Technologies India Private Limited
We develop Verification Components, leveraging our rich experience in ASIC / SoC design verification and capabilities on high-level verification languages (HVLs). Our verification components are configurable, reusable plug-and-play verification solutions for standard interfaces based on HVL. We currently support SystemVerilog, Vera, SystemC, Specman E and Verilog. All our VIP''s are supported natively in SystemVerilog VMM, RVM, AVM, OVM, UVM, Verilog, SystemC, VERA, Specman E and non-standard verification env.
-
product
SMARC® Short Size Module with Intel Atom® E3900 Series, Pentium™ N4200 or Celeron™ N3350 Processor (codename: Apollo Lake)
LEC-AL
The LEC-AL Computer-On-Module (COM) combines the SMARC® 2.0 standard with the latest Intel Atom® E-Series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet- of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems. The LEC-AL module utilizes the latest Intel E-series and N-series SoCs, which are based on the Intel 64 Architecture, the new HD Graphics 500/505 engine, and a faster, 4-vector image processing unit. The SoCs are manufactured on Intel's industry-leading, tri-gate 14nm process, improving system performance by supporting more than 4 GB of both virtual and physical memory.
-
product
Intel Atom® Processor-Based Ultra Compact Embedded Platform
MXE-200 Series
ADLINK's new Matrix MXE-200 series Ultra Compact Embedded Platform, based on the Intel Atom® SoC processor E3845/E3826, With superior-class construction meeting a wide variety of specific industrial needs, the MXE-200 series offers the most reliable Ultra Compact Embedded Platform for use in harsh environments, compliant with industrial grade EMI/EMS (EN61000-6-4,61000-6-2), protecting customer assets and reducing TCO. Opposing conventional correlations between size and computing power, the MXE-200 series features large-scale performance in an ultra-compact package.
-
product
Microcontrollers
Frontgrade offers highly integrated, full-featured SPARC and Arm®-based Rad Hard microcontrollers ideal for system-on-chip (SoC) applications. These small footprint, low power devices are augmented with integrated analog front-end components making them ideal for mixed signal processing.
-
product
TySOM Embedded Prototyping Boards
TySOM™ is a family of embedded system prototyping boards. Depending on the board, one of three FPGAs will be at its heart: a Xilinx Zynq® UltraScale+™, a Xilinx Xilinx Zynq-7000 or a Microchip PolarFire SoC. The boards are compatible, through industry standard interfaces (FMC or BPX), with Aldec’s wide range daughter cards, making Aldec’s TySOM embedded prototyping boards ideal for the rapid development of applications that include automotive (and ADAS, in particular), artificial intelligence (AI), machine learning (ML), embedded vision, embedded-HPC (including edge-processing), IoT, IIoT and industrial automation.
-
product
Software
Easy to use and intuitive software is fundamental in order to analyze complex embedded software challenges. With the increase in use of multi-core SoCs, complex operating system environments, such as AUTOSAR, and the need for hypervisors, iSYSTEM aims to deliver a user interface that provides fast and clear results so that development decisions can be made quickly. Our offering can be broken down into a few core elements:
-
product
Gate-Level Design Optimization
After logic synthesis, STAR helps reaching power, performance and area (PPA) requirements for complex SoCs is becoming a real challenge. Large design netlists are restructured and optimized to reach aggressive PPA requirements, cost-effectively.
-
product
6U VME 1/10/40 GbE Switch
ComEth4070e
The ComEth 4070e is a cutting-edge 6U Layer 2/3 Ethernet switch for VME64x systems. Powered by the newest Marvell highly integrated system-on-chip (SoC) with programmable packet processors.
-
product
COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
-
product
Qseven V2.0 SoM With IMX6 Quad/DualLite 800 MHz (Industrial) SoC, 1GB RAM, 4GB EMMC, GbE LAN, Audio And CAN
Q7M120
*Qseven v2.0 (70 x 70 mm)*Ultra low power consumption Cortex™-A9*2 CAN*24-bit TTL signal*LVDS/HDMI 1080P*10/100/1000 Mbps Ethernet*Linux 3.0.35/Android 4.3*Audio
-
product
SMARC Module
LEC-MTK-I1200
The ADLINK LEC-MKT-I1200 is a SMARC module powered by the MediaTek MT8395 SoC with 4x Arm Cortex-A78 and 4x Cortex-A55 cores and up to 5 TOPS APU. The module incorporates a spate of IoT technologies, such as on-device artificial intelligence (AI) capabilities and support for up to 3 cameras, while delivering a low power envelope, making it the ideal solution for robotic and drone applications across various sectors, including consumer, enterprise, defense, industrial, logistics, and more.
-
product
COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
-
product
SMARC® Short Size Module with Intel® Pentium™ and Celeron™ Processor N3000 Series SoC (codename: Braswell)
LEC-BW
The LEC-BW Computer-On-Module (COM) combines the SMARC® 1.1 standard with the Intel® Pentium® and Celeron® N-series System-on-Chip (SoC), providing an ideal solution for low power consumption and high performance requirements. The module provides the high integration, high performance, low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients, digital signage, and in-vehicle infotainment systems.
-
product
Architecture P2020 Processor
VME-194B
Curtiss-Wright Defense Solutions
The VME-194B is the next generation of VME single board computer (SBC) from Curtiss-Wright Defense Solutions. It is targeted for applications with moderate processing requirements, low power and cost effectiveness. The VME-194 VME SBC is based on NXP's high performance QorIQ P2020 SOC multi-core processor.
-
product
SMARC
ROM-5420 B1
ROM-5420 SAMRC v1.1 Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be OS support ready. NXP i.MX6 supports 2D, 3D graphics acceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
-
product
QSeven
ROM-7420
ROM-7420 Qseven Module integrates an ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips with Linux. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
-
product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
-
product
I-Pi SMARC IoT Development Kit Based On Intel® 7th Gen Atom® X7433RE Quad-Core SoC
I-Pi SMARC Amston Lake
The I-Pi SMARC Amston Lake is a SMARC-based edge solution devkit powered by power-efficient Intel Atom x7433RE quad-core SoC with integrated Intel UHD graphics with 32 EUs, deep learning inference capabilities, industrial grade durability and comprehensive high-speed interfaces.
-
product
SMARC
ROM-7421
ROM-7421 Qseven Module integrates ARM Cortex-A9 NXP i.MX6 series ultra low power SoC and I/O solution chips to be Linux support ready. NXP i.MX6 supports 2D, 3D graphicsacceleration, full HD 1080P video decoding and an HD 1080p video encoding hardware engine.
-
product
Open Standard Module (OSM)
ROM-2860
Advantech ROM-2860 OSM 1.1 Computer-on-Module is powered by Qualcomm QCS6490/5430 SoC which includes up to Arm v8 Cortex® in combination with Andreo GPU 643 and Andreo VPU 633 graphics engine. It provides PCIe, USB 3.2, Giga Ethernet, MIPI-CSI, I2C, SPI, GPIO, PWM and eDP, DP, MIPI-DSI display for embedded applications.
-
product
Generates Test Cases on ICE
TrekSoC-Si
TrekSoC-Si automatically generates self-verifying C test cases to run on the embedded processors in SoCs in in-circuit emulation (ICE), FPGA prototyping, and production silicon. This verifies your chips more quickly and more thoroughly than hand-written diagnostics or running only production code on the processors. TrekSoC-Si's generated test cases target all aspects of full-SoC verification and work in a variety of different environments. TrekSoC-Si is a companion to TrekSoC, which generates test cases for simulation and acceleration. TrekSoC-Si extends the benefits of TrekSoC into hardware platforms.
-
product
SoC Verification
TrekSoC
TrekSoC automatically generates self-verifying C test cases to run on the embedded processors in SoCs. This verifies your chips more quickly and more thoroughly than an external testbench, hand-written C tests, or running only production code on the processors. TrekSoC's generated test cases target all aspects of full-SoC verification and work in a variety of different environments.
-
product
3U CompactPCI Quad-Core Intel Atom® Processor Blade
cPCI-3620
The ADLINK cPCI-3620 Series is a 3U CompactPCI® processor blade featuring a quad-core 4th generation Intel® Atom SOC and soldered DDR3L-1333 ECC memory up to 4GB.
-
product
Rugged PC Compatible
SYS-427X
WINSYSTEMS’ SYS-427X is a rugged, fanless industrial computer with the Intel® Apollo Lake-I SOC quad-core processor. Its compact size, low power, and extended operational temperature make it a great fit for rugged embedded systems in the industrial control, transportation, energy, and IIoT markets. In addition to the standard system configuration, three optional configurations are available, adding WiFi 6, CAN Bus, or both.
-
product
SoC Test System
V93000 SoC / Smart Scale
Advantest’s V93000 Smart Scale generation incorporates innovative per-pin testing capabilities. Each pin runs it own sequencer program for maximum flexibility and performance, for example in multisite applications. Full test processor control ensures time synchronization between all card types, like digital, Power, RF, mixed signal and so on. The user benefits are reduced test time, best repeatability and simplified program creation. The system design makes it easy to extend your configuration with new modules and instrumentation, as your test needs change.
-
product
Intel Atom® Processor-Based Embedded IoT Gateway Platform
MXE-200i Series
ADLINK's new Matrix MXE-200i series Embedded IoT Gateway Platform is based on the Intel Atom® SoC processor E3826 and has superior-class construction meeting a wide variety of specific industrial needs. Supporting Intel® IoT Gateway, with pre-loaded Wind RiverR IDP XT 2.0/3.1 enabling full IoT function, the MXE-200i series offers the most reliable Embedded IoT Gateway for use in harsh environments, compliant with industrial grade EMI/EMS (EN61000-6-4,61000-6-2), protecting customer assets and reducing TCO. Opposing conventional correlations between size and computing power, the MXE-200i series features large-scale performance in an ultra-compact package.
-
product
3U OpenVPX Module
VPX3-ZU1B
Sundance Multiprocessor Technology Ltd.
PanaTeQ’s VPX3-ZU1B is a 3U OpenVPX module based on the Zynq UltraScale+ MultiProcessor SoC device from Xilinx. This upgraded version provides a dual Ethernet 1000BaseT interfaces on the VPX P2 connector.
-
product
Test System
UltraFLEX
The UltraFLEX test system delivers the power and precision you need for complex SoC devices built for mobile applications, networking, storage or high-end processing. Choose UltraFLEX when your device mix and throughput goals demand the highest speed, precision, coverage and site count.
