LGA
IC packaging designed to fit on an array of sockets or SMT soldered.
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Product
Compact Fanless AMR/MMR Controller System With 12th/13th/14th Gen Intel® Core™ I CPU Socket (LGA 1700)
MIC-760
Controller
High-performance computing powered by Intel® 12th/13th/14th Gen Core™ i CPUFanless design ensures reliable operation in environments up to 60°CIsolated DIO, CANbus and Serial ports guarantee for industrial communicationContact 8KV/Air 15KV IV level ESD protection , ClassB for EMI design, best choice for industrial environment3 Ethernet and 4 USB3.2 (5Gbps) for Camera and Lidar connectionIndustrial WiFi design enables fast roaming at 36msCompact size ensures easy installation for AMR/MMRBuilt on Ubuntu 22.04 and Advantech Edge Linux, with ROS2 package readinessROS2 package enhances industrial automation capabilities including EtherCAT and Modbus node support
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Product
16.5W to 24.7W - Single Output
iCF Series
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*DOSA Compatible Footprint*2.4-5.5 Vdc, 4.5-14 Vdc Inputs*0.6-3.63 Vdc, 0.7-5.5 Vdc Outputs*Non-Isolated*Excellent Transient Response*LGA or EPC format*No external loop tuning components needed
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Product
LGA 3647-P0 Intel® Xeon® Scalable ATX Server Board with 6 DDR4, 5 PCIe x8 or 2 PCIe x16 and 1 PCIe x8, 8 SATA3.0, 6 USB3.0, Dual 10GbE, IPMI
ASMB-815
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- ATX server board with Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 768GB, support Intel Optane DC Persistent Memory- Five PCIe x8 or two PCIe x16 and 1 PCIe x8- Intel® X557-AT2 dual 10GbE ports- Eight SATA3.0 and one M.2 connectors (SATA / PCIe compatible)- 0 ~ 60 °C ambient operating temperature range
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Product
Microcomputer Module
SX-23BT
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The SX-32BT is a Bluetooth® 5.0 Low Energy compatible microcomputer module based on a 32-bit RX microcomputer, the "RX23W", from Renesas Electronics. Certified for North America, Europe, and Japan, the module's design also includes a PCB antenna. Furthermore, it adopts a 0.7mm pitch LGA package, ideal for OEM's looking to increase the efficiency of their manufacturing process while lowering the total BOM cost of their product.
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Product
Dual LGA 3647-P0 Intel® Xeon® Scalable Proprietary Server Board with 12 DDR4, 4 PCIe x16 + 1 PCIe x8+4 PCIe x4, 14 SATA3.0, 8 USB3.0, Dual 10GbE, IPMI
ASMB-975
Server Board
- Proprietary server board with dual Xeon® Scalable processors- DDR4 2933MHz RDIMM up to 1.5TB, support Intel Optane DC Persistent Memory- 14 SATA3.0 connectors (including two M.2 2242)- Four PCIe x16 slots (Gen3) for double-deck cards- Intel® X557-AT2 dual 10GbE ports- 0 ~ 40 °C ambient operating temperature range
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Fanless Embedded Computer (Code name: Skylake)
MVP-5000 Series
Industrial Computer
The MVP-5000 Series provides an optimal balance of price and performance in a compact construction. Incorporating 6th Generation IntelR Core? processors, the MVP-5000 features computing performance boosted by up to 30% over previous generation-processors. Integrating the front-mounted industrial I/O and fanless construction featured in ADLINK?s proven Matrix line, and rich LGA 1151 socket type CPU selection, the MVP-5000 Series is ideally suited to a wide variety of machine, factory, logistic automation, and general embedded applications.
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Product
Up Converters
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Macom Technology Solutions Holdings Inc.
MACOM's upconverters are widely used in point-to-point radio, broadband communications, and RADAR applications. Operating up to a frequency of 86 GHz, our upconverters feature an integrated image reject (balanced) mixer, LO buffer, and RF buffer. Some products also include LO multiplication and variable gain, all within a single chip. Available in die, or SMT lead-free QFN and LGA packages, our upconverters boast excellent performance with adjustable bias, high linearity and image rejection with low LO leakage
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Product
43.5W to 66W - Single Output
iBF Series
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*DOSA Compatible Footprint*2.4-5.5 Vdc, 4.5-14 Vdc Inputs*0.6-3.63 Vdc, 0.7-5.5 Vdc Outputs*Non-Isolated*Excellent Transient Response*LGA or EPC format*No external loop tuning components needed
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Product
Test Sockets
BGA/LGA
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There are a lot of options when it comes to bench test sockets. Save yourself and your lab time, money and frustration by working with Ardent for truly customized test socket solutions to meet your needs and do the job with high performance, reliability and quick turnaround that you need and deserve.
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Product
LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16x DDR4, 4 x PCIe x16, 10 x SATA3, 8 x USB 3.2 (Gen 1), Dual 10GbE, and IPMI
ASMB-976
Server Board
- LGA4189 proprietary server board with 3rd Gen Intel® Xeon® scalable processor- DDR4 3200 MHz RDIMM up to 2TB supports Intel® Optane™ Persistent Memory- 4 x PCIe x16 and 7 x PCIe x8- Intel® X550 dual 10GbE ports- Ten SATA3 and two M.2 connectors (SATA/PCIe compatible)- 0 ~ 40 °C ( 32 ~ 104 °F) ambient operating temperature range
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Product
LGA 4189 Intel® 3rd Gen Xeon® Scalable ATX Server Board with 8x DDR4, 3x PCIe x16, 8x SATA 3, 6x USB 3.2 (Gen1), Dual 10GbE, and IPMI
ASMB-816
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- LGA4189 ATX server board with 3rd Gen. Xeon® Scalable processor- DDR4 3200 MHz RDIMM up to 512 GB (8 DIMMs) supports Intel® Optane™ Persistent Memory- Features 3x PCIe x16, 1x PCIe x8, 2x PCIe x4, and 1x PCIe x1- Intel® X550 dual 10GbE ports- Eight SATA 3 and one M.2 connectors (SATA/PCIe compatible)- 0 ~ 60 °C/ 32 ~ 140 °F ambient operating temperature range
