Earth Bond
Checks a ground circuit's ability to handle fault current in the event of insulation failure.
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Product
Safety Test Panel for Geyser
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Electrical Safety is the most primary and essential product conformity requirement for any product that uses electricity. The clauses of safety testing of electrical products laid by worldwide agencies such as UL, CE, BIS, etc. are stringent. The products need to pass through tests such as the high voltage test, insulation resistance test, earth bond test, leakage current test and so on. And to conform to such tests, SCR Elektroniks have developed for the testing of Geyser. In addition to the conventional safety tests, test for performance is also included.
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Product
Earth Bond Test Set
EC-12
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The Earth bond test is a basic safety test prescribed in many standards to test samples for the integrity of earthing continuity throughout the sample.
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Product
Electrical Installation Testers
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Continuity tester for measuring the resistance of the protective earth conductors and earth bonds – an ohmmeter dedicated to electrical safety
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Product
Ground Earth Resistance Tester
2678X
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Shenzhen Chuangxin Instruments Co., Ltd.
Ground Earth Resistance Tester verifies the integrity (continuity) of the protective bonding of the equipment (Class I equipment) designed to secure safety through the basic insulation and protective earthing. It is also called earth (ground) bonding test. If the continuity of the protective bonding is confirmed, we can conclude that the equipment has the requirements for preventing electric shock even if the insulation between the primary circuit and the accessible conductive section fails and a fault current flows through the distribution system.
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Product
Self-testing Static Grounding Clamp
Bond-Rite CLAMP
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In many branches of the process industries, fires and explosions can result from electrostatic discharge in hazardous areas. Even relatively small sparks have sufficient energy to ignite many flammable vapours, gases and even airborne dusts. In situations, where this risk exists, static grounding (earthing) and bonding clamps are required wherever mobile or portable conductive plant items (such as drums and vessels etc) are used.
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Product
Safety Test Panel for Water Cooler
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Electrical Safety is the most primary and essential product conformity requirement for any product that uses electricity. The clauses of safety testing of electrical products laid by worldwide agencies such as UL, CE, BIS, etc. are stringent. The products need to pass through tests such as the high voltage test, insulation resistance test, earth bond test, leakage current test and so on. And to conform to such tests, SCR Elektroniks have developed for the testing of washing machines. In addition to the conventional safety tests, test for performance is also included.
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Product
Micro-ohmmeters
MMR-650
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Designed to measure very low resistances of both resistive and inductive types of objects, including amorphous core transformers. This product is made to be used in power plants, railways and maintenance companies, to measure welded and soldered connections, equipotential bondings, earthing conductors, contacts, bolted connections, windings of motors and power transformers and other resistive and inductive objects. MMR-650 can be also utilized on a production lines (eg. at the final production control stage). An innovative combination of a high-performance measuring device with a modern user interface and advanced data management system. Wireless data transmission, enhanced system of 2D codes and ability to print labels to identify test items, all contribute to bringing new quality of work and allow the user to perform a wide range of measurements.
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Product
Low Resistance Meter
MMR-640
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The MMR-640 meter is designed to measure very low resistance of resistive objects. This product is made to be used in power plants, railways and maintenance companies to measure resistance of:*breakers, contacts,*earthing conductors, equipotential bondings,*welded and soldered connections,*bolted connections,*and other resistive objects.
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Product
Bonding
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With our extensive experience in designing and manufacturing precision wafer bonding equipment, EVG is well recognized for setting industry standards in wafer bonding. EVG wafer bonding systems can be configured for R&D, pilot-line or high-volume production, and for any direct or interlayer-based bonding process, including sophisticated low-temperature covalent bonding. With this portfolio of technologies and equipment, EVG addresses markets for advanced packaging and 3D integration, MEMS, as well as advanced compound semiconductor and SOI substrates, holding the leading position and dominant market share.
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Product
Bond Tester
Sigma Lite
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Sigma lite is a low cost of ownership bond tester that grows with your company. It gives you a low-cost entry point without sacrificing performance to meet future demands.
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Product
Protective Bonding Testers
RMO-E Series
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The RMO-E instruments are designed and ideal for testing protective bonding (grounding) of equipment following the standard IEC 61010-1. Also, they can measure the resistance of high, middle and low voltage circuit breakers, high-current bus bar joints, cable splices, and welding joints. The instruments accurately measure not only in factory environments but also in high-induction fields and substations.Both models generate a true DC ripple-free (less than 1 %) current with automatically regulated test ramps. During a test, the protective bonding testers automatically generate increasing current before measuring and decreasing current after the measurement. Consequently, this significantly decreases magnetic transients and ensures great accuracy.These instruments can store up to 500 measurements in the internal memory and have a built-in thermal printer available as an option.DV Win software communicates with the RMO-E earth resistance meter via USB or RS232 interface. It allows a user to run the test remotely from PC, as well as to download test results, analyze and generate fully configurable test reports.The RMO-E series contains two models, RMO60E and RMO100E. The main difference between these two models is in the maximal test current:60 A DC for RMO60E100 A DC for RMO100E
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Product
Bonding Tester
PTR1102
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In wire bonding in semiconductor manufacturing, electrodes are joined using gold wires of several tens of microns. In order to measure the pull (tensile) strength and ball shear (shear) strength of this gold wire, this machine has load detection accuracy and fine positioning accuracy. In addition, for the measurement of high load areas such as die shear strength and solder joint strength, this machine supports measurement in high load areas while maintaining accuracy in low load areas by replacing the sensor part.
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Product
Multimode Bond Tester
BondMaster 600
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The BondMaster® 600 delivers a powerful combination of multiple mode bond testing software and highly advanced digital electronics, providing consistently crisp and high-quality signals. Whether you are inspecting honeycomb composite, metal-to-metal bonds, or laminate composite, the BondMaster 600 offers exceptional ease-of-use thanks to its direct-access keys and streamlined interface that features convenient presets for common applications.
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Product
Ground Bond Tester
260 Series
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Our 260 Series makes Ground Bond testing simple. We offer two models so that you can have a simple and easy-to-use Ground Bond tester that provides the output current you need to satisfy NRTL specifications. With an intuitive interface that allows you to set-up a test in seconds and practical security settings, our 260 Series can easily be deployed in both laboratory and production line environments.
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Product
Hybrid And Fusion Bonding Systems
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Hybrid bonding extends fusion bonding with embedded metal pads in the bond interface, allowing face-to-face connection of wafers. The main application for hybrid bonding is advanced 3D device stacking.
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Product
Resistance Wire Bonding
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Electronic Systems of Wisconsin, Inc.
ESW's Resistance Wire Bonding System comes equipped with the latest features the market has to offer. Our system is capable of bonding armatures, stators or coils. The on-screen display in our bonder makes it easy to read, track, and record your bonding data. If desired, ESW offers complete electrical testing of the part prior to the bonding sequence as well. This ensures only good parts that have been electrically tested are processed through bonding. It is our duty to make sure you never have to worry about losing important information again. Our Sales and Engineering staff will work closely with you to make sure that a bonding systems will meet your needs. See the slideshow below to see some of our Resistance Wire Bonding Testers.
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Product
Earth and Resistivity Testers
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Earth tester offering selective earth, soil resistivity, earth coupling and continuity measurements
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Product
Earth Ground Testers
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TES Electrical Electronic Corp.
Capable of measuring earth voltage. Data hold function. Auto power off function. The timer operates automatically about 10 minutes with the "test button switch are pressed to keep the tester power on.
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Product
Bond Testing
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Our complete line of bond testing (BT) flaw detectors provides unmatched capabilities for the location of discontinuities and other flaws in composite structures. We offer a wide range of measurement features and application-specific options for flaw detection.
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Product
AC Ground Bond Tester
448
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Our 448 model is a 4-in-1 tester with 500VA AC Hipot, DC Hipot, Insulation Resistance and Ground Bond testing capabilities. The 448 is capable of a 500VA AC Hipot output to comply with 100mA leakage current test compliance requirements. This tester features a simple design and easy-to-use interface, reducing setup time and increasing production-line throughput for your application.
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
Analog Earth Tester
FT3151
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Earthing or grounding of electrical equipment is essential to maintain safety, protecting lives, as well as prevent damage to equipment. • Three-electrode method, Two-electrode method (Simple Measurement) • Wide measurement range for 0 to 1150 Ω, based on EN standard •Switchable measurement frequency to reduce the effects of power supply harmonics • Dramatically faster setup: Comes with improved grounding rods and cord winders. CAT II 300 V
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Product
Earth Resistance Tester
G-TEST
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To check the condition of a grounding connection, an earthresistance tester is used to measure the residual ground voltage,resistance and resistivity (Wenner method).
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Product
Neutral Earthing
International Standards
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NERs may only be called upon to operate a few times in their service life, which may be 25 years or more. Reliability is imperative, and has been proved over many years in electric traction rolling stock and under conditions of severe vibration and extreme climate world-wide.
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Earth Resistance Testers
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Is a soil resistance measuring instrument. It is used for sizing and projecting grounding grids.
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Product
Bond Force Measurement And Calibration Systems
BFS-20
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Based on its design and easy handling it can be used also on other brands to measure the bond force.
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Product
Permanent Bonding Systems
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The introduction of EVG's wafer-bonding approach, which separates the bond alignment from the bonding step, immediately revolutionized the market. Utilizing high-contact forces under elevated temperatures and a controlled atmosphere, this novel approach is today's process standard, with EVG holding the dominant market share for both semi- and fully automated wafer bonders and a growing installed base of more than 1500 chambers. EVG's wafer bonders offer optimal total cost of ownership (TCO), as well as multiple design features to optimize bonding yield. Multiple modules for bond alignment are optimized for different market requirements in MEMS, 3D integration or advanced packaging. Industry-leading alignment accuracies of less than 100 nm and a high-volume-proven modular platform enables the combination of EVG’s wafer bonding technologies in various applications.
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Product
Digital LOOP/PSC/EARTH Tester
1824 LP
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Standard Electric Works Co., Ltd
● Microprocessor-controlled.● Measures Earth Resistance without the need for poles in the ground or external measuring wires.● Earth measurement uses the real earth current path and the current generated by the electric network, without the need for any disconnection.● The Earth Resistance displayed is exactly the earth resistance that the earth current will need to go through if an earth fault occurs. (you do not need to add all the bonding points and connection paths)● Displays voltage supply at the transformer(Line to Neutral), without loading the transformer.● Single one smart push button operation; ON, Scroll through results and menus.● Checks wiring integrity (LEDs).● Auto-off / Auto-ranging (software range).● Color-coded test leads.● Combined prospective short circuit current, loop, and earth tester.● Loop test for L-E and PSC between L-N.● Voltage test L-N.● Display can be customized for large orders.
