SODIMM
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Product
SODIMM DDR4
SQR-SD4N
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Original IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C. 3years longevity, Fixed BOM, Lifetime warranty.
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Product
Industrial Grade SODIMM DDR5 4800/5600
SQR-SD5I
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Data Transfer Rate: 4800/5600 MT/s, Capacity : 8GB/16GB/32GB. Original Samsung/Hynix IC adopted, Independent Power Management IC build-in.
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Product
Industrial Grade SODIMM DDR4 3200
SQR-SD4I
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30u” Golden Finger, Wide Temp range: -40oC~85oC. Tier one original chip adopt, lifetime warranty, DRAM Software Monitoring.
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Product
DDR3 SODIMM
SQR-HS3I
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Original Samsung/Micron IC chips adapted, Heatsink attached. Data transfer rate: 1600 MT/s, Operating temperature: -40 °C ~ 85 °C, 3years longevity, Fixed BOM, Lifetime warranty.
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Product
Memory Tester
SP3000
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CST is proud to offer a portable stand alone and affordable memory tester, combining DIMM and SODIMM testing capability all on the same universal base unit with optional easy plug-on test adapters.
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Product
3.5" Embedded SBC With AMD LX800, Dual LANs, 4 COM, 4 USB 2.0 And VGA/LVDS/TTL
SBC84622
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The SBC84622 supports an onboard low power AMD LX800 500 MHz processor with the AMD Geode CS5536 chipset. The flexible display function is supported by integrated graphics controller which allows users to configure both CRT and LVDS LCD or CRT and TTL LCD as simultaneous mode. Onboard one DDR SODIMM supports up to 1GB of system memory. Having such compact design with fanless operation, the SBC84622 can be applied in widely embedded and automation applications such as industrial automation, automation control, telecommunication, and process control.
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Product
9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 Processor-Based Embedded Fanless Computer
MXE-5600 Series
Industrial Computer
- 9th Gen Intel® Xeon®, Core™ i7/i3 and 8th Gen Intel® Core™ i5 BGA processor and Mobile Intel® CM246 Chipset- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++, HDMI, 2x GbE, 6x COM, 8-ch DI, 8-ch DO, TPM2.0- 2x USB 3.1 Gen2, 2x USB 3.1 Gen1. 4x USB 2.0- Rich storage: 2x 2.5" SATA 6 Gb/s, CFast, M.2 2280
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Product
Medical Computer Equipped With MXM Graphics Module Supporting NVIDIA Quadro® GPU With 8th/9th Generation Intel® Core™ I7/i5/i3 In LGA1151 Socket. Compliant With IEC 60601-1/IEC 60601-1-2
MLB-3000
Industrial Computer
- Medical grade computer compliant with IEC 60601-1:2005 + A1:2012 + A2:2020 (3.2 edition) / IEC 60601-1-2:2014 + A1:2020 (4.1 edition)- ADLINK MXM Graphics module support (Type A/B, up to 120W)- 8th/9th Gen Intel® Core™ i7/i5/i3, Celeron® processor- Dual SODIMMs for up to 64GB DDR4 non-ECC memory (dependent on CPU)- DisplayPort (2 from CPU, 4 from MXM)- 1x M.2 E key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 B key supporting 2242 or 2280 for SATA storage module- Reliable Molex type 12V DC-in connector- 1x Intel® i219-LM and 3x Intel® i210-AT
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Product
Intel® Pentium N4200, Celeron N3350 & Atom™ E3950, 3.5" MI/O SBC
PCM-9366
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Intel® Pentium N4200, Celeron N3350 & Atom™ E39501 x DDR3L-1866/1600 SODIMM, up to 8GBDirectX11, OpenGL3.2, OpenCL1.2, multi-display: VGA+LVDS/eDP+ HDMI/ DP*Support 9-36V wide range power input2 GbE, rich I/O: 4COM, SATA, USB3.0, SMBus/I2C, 2 8bit GPIO, 2 CANBUS, M.2 key E, full-size mSATASupports iManager, SUSI APIs, WISE-DeviceOn and Edge AI Suite
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Product
Pico-ITX SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, HDMI/LVDS And LAN
PICO312
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The PICO312 is a palm-sized fanless pico-ITX motherboard built with the latest 14 nm Intel® Pentium® processor N4200 or Celeron® processor N3350 (codename: Apollo Lake SoC). One 204-pin DDR3L-1867 SO-DIMM socket supports system memory up to 8GB. The tiny 2.5” pico-ITX embedded board features Intel® Gen9 graphics engine bringing a true high definition visual experience with dual display configurations through one LVDS and HDMI. In addition, it was designed for special needs of fanless operation under temperature from -20°C to +70°C. The PICO312 features a full-sized PCI Express Mini Card slot in support of mSATA and a pair of expansion connectors with additional signals including one PCIe x1 lane, one LPC, one DDI, four USB 3.0 ports, one SMBus and one HD audio, giving this SBC high expandability to meet all requirements.
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Product
Edge AI Inference System
AIR-310
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Edge AI inference system powered by 12th/13th/14th Gen Intel® Core™ processors with MXM GPU support. Support Intel ® 12th/13th/14th Gen. Core™ i3/i5/i7/i9 processor up to 65W. DDR5 SO-DIMM memory support up to 64 GB.
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Product
Intel® Processor N Series And Atom® X Series Expandable, Cost-Efficient Modular Industrial Computers
MXC-330
Industrial Computer
Intel® latest ADL-N cost-performance embedded Fanless system, DDR5 SO-DIMM, various IO interface for different industrial applications, including Isolation COM port & DIO, 4x GbE LAN, M.2 expansion slot for general application.
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Product
Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, 4 PoE, 4 USB 3.0, And Real-time Vision I/O
IPS960-511-PoE
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Featuring a multi-core CPU, IP40-rated rugged design, camera communication interfaces, real-time vision-specific I/O with microsecond-scale and LED lighting control, the IPS960-511-PoE provides an all-in-one solution that addresses the needs across various machine vision platforms and automatic inspection cases. The IPS960-511-PoE is powered by the LGA1151 socket the 7th & 6th generation Intel® Core™ (codename: Kaby Lake/Skylake) and Celeron® processors (up to 65W) with the Intel® H110 chipset. The intelligent vision system comes with dual DDR4-2133/2400 un-buffered SO-DIMM sockets for up to 32GB of system memory as well as supports rich camera interfaces for connecting industrial cameras, including four IEEE802.3at PoE LAN ports and four USB 3.0 ports. Its vision I/O integrates a full range of isolated I/O interfaces and real-time controls essential to machine vision applications, including trigger input, LED lighting controller, camera trigger, as well as an encoder input for conveyor tracking. The IPS960-511-PoE also supports lighting dimming control to identify object characteristics for different inspection. Two easy-swappable 2.5" HDDs are available for extensive storage needs.
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Product
Value Family 6th Generation Intel® Core™ i7/i5/i3 Processor-Based Expandable Fanless Embedded Computer
MVP-6100 Series
Industrial Computer
- 9th Gen Intel® Xeon®/Core™ i7/i5/i3 & 8th Gen Celeron® LGA processor- Dual SODIMMs for up to 32GB DDR4 non-ECC/ ECC memory- Rich I/O: 2x DP++/ DVI/ VGA/ 3x GbE/ 4x COM/ 8-ch DI/ 8-ch DO/TPM2.0- 2x USB 3.1 Gen2 + 1x USB 3.1 Gen1 + 3x USB 2.0- Rich storage: up to 4x 2.5" SATA, CFast, M.2 2280
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Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
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The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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Product
FPGA DSP Board
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Renice has developed part of the FPGA evaluation board, which can be used as high-speed signal processing board, wireless communication board and image processing board. By default, it’s equipped with Altera FPGA (StratixIV), high-speed ADC/DAC, USB Controller and SODIMM Connector.
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Product
Digital Signage Player With 8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 3 HDMI 2.0, 4 USB And GbE LAN
DSP500-523
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*8th gen Intel® Core™ i7/i5/i3 & Pentium® processor (Coffee Lake)*2 DDR4-2400 SO-DIMM for up to 32GB of memory*3 HDMI 2.0*4 USB 3.1 and 1 GbE LAN*1 M.2 Key E 2230 for Wi-Fi/BT*1 M.2 Key B 3042 for 4G LTE*1 M.2 Key M 2280 for storage
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Product
Fanless Embedded System With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 4-CH PoE And MXM 3.1 Type A
eBOX671-521-FL
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The eBOX671-521-FL is a GPU computing embedded system that comes with 4-CH PoE and MXM 3.1 Type A slot for applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things. The outstanding eBOX671-521-FL with enhanced GPU computing performance is powered by the 9th/8th gen Intel® Core™ i7/i5/i3 processor with up to six-core, Intel® Pentium® processor, or Intel® Celeron® processor and comes with Intel® Q370 or optional Intel® C246 chipset. The fanless embedded GPU-based system is equipped with dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display. Furthermore, this Intel® Coffee Lake-based embedded box PC is specially designed with four Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports with a total power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors. It comes in great expansion possibilities, including one internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots. For storage, it has two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature. Besides, we have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.
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Product
Flex Socket Test Module
JT 2127/Flex Socket Test Module
Test Module
The JT 2127/Flex STM memory socket tester is a family of hardware adapters specifically designed for the testing of of PCB-mounted DIMM & SODIMM sockets using a JTAG/boundary-scan controller and supporting software. The testing of memory sockets has always been troublesome for test and production engineers using JTAG/boundary-scan systems. Even when it is possible to create memory writes/reads from a boundary-scan compliant access device on the UUT (Unit Under Test), the initialization process may fail leaving you with little diagnostics information. What’s more it can still be uncertain whether fault lays with the DIMM module itself or the socket. Using the new JT 2127-Flex system from JTAG Technologies you get pin-point diagnostics from a known-good test interface so you can be certain that your socket is soldered correctly.
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Product
COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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Product
DDR4 MSO Probes
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The DDR4 DIIM and SO-DIMM Mixed Signal Interposers connect Address, Command and Control signals of a DDR4 bus to the Keysight V-Series Oscilloscopes with the MSO option. These interposers also provide accessibility to DDR4 signals for convenient analog probing. The user can then easily observe both the digital and analog representation of the DDR4 Address, Command and Control bus. Solder down N5541A analog probes purchased separately from Keysight Technologies.
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Product
3.5" Embedded SBC With AMD G-Series APU, AMD A55E, LVDS/VGA, Dual LANs, Audio, And PC/104
CAPA112
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The CAPA112 is a fanless 3.5-inch embedded board with PC/104 for ISA bus expansion. The embedded board is powered by either an AMD Embedded G-Series APU dual core T40E at 1.0 GHz or single core T16R at 615 MHz, paired with the A55E FCH. One DDR3-1066 SO-DIMM on board implements up to 4GB of system memory. Integrated with Radeon™ HD 6250 graphics controller with DirectX 11 support, the super compact 3.5-inch embedded platform delivers unprecedented high definition visual experience. Moreover, it offers -40XC to +70XC (-40XF to +158XF) wide temperature range operation and only requires +12V DC power input into work. The CAPA112 is ideal for applications requiring a power-optimized, rich-graphics and easy integration platform, such as medical imaging, digital signage, kiosks/POI, thin clients and gaming machines.
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Product
3.5” Embedded SBC With Intel® Pentium® N4200 & Celeron® Processor N3350, EDP, 2 HDMI, 2 GbE LANs And Audio
CAPA315
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The CAPA315 is powered by the Intel® Pentium® processor N4200 or Celeron® processor N3350 (codename: Apollo Lake). It comes with various I/O connectors and flexible expansion features within its 146 x 104 mm dimensions. The CAPA315 also has an extended operating temperature range of -20°C to 70°C to withstand the rigors of day-to-day operation. The 3.5-inch CAPA315 has one 204-pin DDR3L-1867 SO-DIMM for up to 8GB system memory. Furthermore, it comes with one RS-232/422/485, three RS-232, two USB 2.0, four USB 3.0, 8-channel digital I/O, HD Codec audio and dual Gigabit LANs with Intel® i211AT Ethernet controller. For storage requirements, it has one SATA-600 and one mSATA. Moreover, the low power embedded platform runs on +12VDC power, supporting auto power-on. For connectivity, this embedded board has a PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections. To ensure reliable operation across platforms, the 3.5-in embedded board also supports watchdog timer, hardware monitoring functions and Trusted Platform Module 1.2 (TPM 1.2).
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Product
DDR1 SODIMM
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small-form-factor RAM module designed for laptops and compact systems from the early 2000s. It features a 200-pin connector, operates on 2.5 volts, and supports speeds up to 400 MHz (PC-3200). It is not compatible with modern DDR4 or DDR5 slots, offering significantly lower capacity and speed.
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Product
Mini-ITX SBC With Intel® Celeron® Processor N3350 & Pentium® Processor N4200, VGA, HDMI, LVDS, USB 3.0, PCI Express Mini Card Slot, M.2, And HD Audio
MANO310
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*Intel® Celeron® N3350 & Pentium® N4200 (optional)*2 DDR3L SO-DIMM for up to 8GB of memory*1 PCI Express Mini Card slot and PCIe x1*4 USB 3.0 and 2 USB 2.0*1 SATA-600, 1 M.2 and 1 SDXC slot*6 COM supported*12 to 24 VDC*VGA, HDMI and LVDS with triple-view supported
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Product
ATX Motherboard With LGA1151 Socket 7th/6th Gen Intel® Core™ Processor, Intel® Q170, USB 3.0, SATA 3.0, Dual LAN, VGA, DisplayPort, HDMI And MSATA
IMB500
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The IMB500 is powered by the 6th generation Intel® Core™, Pentium® and Celeron® processors (formally codename: Skylake) in the LGA1151 socket with Intel® Q170 chipset. The IMB500 supports four 288-pin DDR4-2400/2133/1866 SO-DIMM sockets with a memory capacity of 64GB to enhance overall system performance. Designed especially for customization and flexibility, the industrial-grade ATX motherboard comes with rich expandability options including one PCIe x16 slot, two PCIe x4 slots, four PCI slots, one PCI Express Mini Card and SIM slot. Furthermore, the embedded board features triple-display capability through DisplayPort, HDMI and VGA interfaces. With these strong capabilities and features, the IMB500 is excellent for industrial automation, advanced communication, gaming, industrial and automation applications.
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Product
Pico-ITX SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350, LVDS And LAN
PICO313
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The PICO313 features the Intel® Pentium® processor N4200 or Celeron® processor N3350, aim at the entry-level market. It runs fanless, supporting +12VDC power input, slim I/O and extended temperature range. The Pico-ITX motherboard has one 204-pin DDR3L-1867 SO-DIMM socket with up to 8 GB memory. One full-size PCI Express Mini Card slot with support of mSATA and one half-size PCI Express Mini Card slot are available on the rear side of the board. Additionally, a pair of expansion connectors provides signals for one PCIe lane, one LPC, one DDI, four USB 3.0 ports, one SMBus, and one HD audio to meet different communications needs.
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Product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
Box PC
- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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Product
COM Express Type 6 Compact Module With 8th Gen Intel® Core™ & Celeron® Processor
CEM521
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The CEM521 is powered by the latest 8th generation Intel® Core™ i7/i5/i3 processor or Intel® Celeron® processor 4305UE (codename: Whiskey Lake-U). It is suitable for harsh operating conditions with an extended operating temperature range of -40°C to +85°C (-40°F to +185°F). The 4K-ready system on module was designed for graphics-intensive Industrial IoT applications including industrial control system, medical imaging, digital signage, gaming machines, military, and networking. The palm-sized CEM521 is packed with a variety of rich features including low power consumption, industrial temperature support and high graphic processing capability. The COM Express Type 6 compact module supports two DDR4-2400 SO-DIMM sockets for up to 64GB of system memory. The power-efficient CEM521 is also integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for excellent graphics performance with a resolution of up to 4K (4096 x 2160 @ 30 Hz). It offers three independent display support through one LVDS, one VGA and one DDI ports for HDMI/DisplayPort.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processor, With Support For MXM GPU Module With Embedded NVIDIA RTX GPU And Thunderbolt™ 4 Port
MLB-3100 with NVIDIA MXM GPU
Industrial Computer
- ADLINK MXM graphics module support (type A/B, up to 120W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller
