Probe Cards
semiconductor bond pad and signal terminals interchangeable electro-mechano Interface to tester.
See Also: Cards, Extender Cards, POST Cards, Test Cards, Probe Card Interfaces, Wafer, Test Probes
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Product
Mems-Based Probe Cards
MEMSFlex
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Nidec SV Probe proprietary MEMSFlex™ Probes are a perfect complement to our probe card technologies, ideal for many advanced testing applications including Flip Chip, WLCSP, Solder Bump, CuPillar and Pad. Featuring a fine 3D MEMS coil spring and electro-formed Ni-pipe, these probes are manufactured using a continuous, automated, manufacturing process, we can support a wide array of custom pin pitches within a short cycle. Other features include:
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Product
Vertical Probe Cards
B3
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The patent-pending B3™ structure requires a minimum number of parts and can handle up to 300 probes. This vertical technology can provide: • Increased Uptime • Extended Probe Lifetime • Reduced Maintenance • Lower Cost of TestThe B3™ is an ideal solution for testing small pads and the low force probes minimize scrub. Planarity also remains stable over time increasing probe card life. Contact your sales representative to learn more about our B3™ probe cards.
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Product
Probe Cards
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These cards are compatible with WLCSP and can be customized according to pin positions. They can be used for a pitch of up to 180 μm. We are developing a product for a pitch of 150 μm, to be compatible with narrower pitches.
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Product
Probe Cards
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PICOPROBE® PROBE CARDS by GGB Industries, Inc., allows for more chip design flexibility because each probe card is custom configured to your circuit for testing wafers on either manual or automatic probe stations. Probe cards with complex layouts consisting of numerous DC contacts and multiple microwave probes with operating frequencies of 40, 50, 67, or 110 GHz can be custom fabricated quickly and inexpensively.
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Product
Cantilever Probe Cards
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Cantilever Probe Cards are based on the approved epoxy ring design. The probe-needles are precisely arranged the required pattern to ensure proper contact on the pads.
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Product
Probe Cards
Direct Dock
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Direct dock style wafer probing allows for a higher bandwidth, increased pin density and testing more devices in parallel. Direct dock probe cards also support the growing movement of traditional final test to wafer probe which allows for known good die (KGD) and reduced cost of ownership.
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Product
Probe Cards
Minitile™ with Advanced Cantilever™ technology and WedgeTile™
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Each probe is designed for wide temperature ranges and so the probe expansion characteristics are closely matched to the wafer’s expansion characteristics. This allows the user to take a fast measurement while a system is in a settling or thermal stabilization mode and helps compensate for wafer expansion.
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Product
Probe Cards
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Probe cards are the key in measuring reliability in the ever-evolving testing of semiconductor integrated circuits, which are becoming faster, more compact, and more efficient. We provide a variety of probe cards tailored to customer needs and test environments, always at the highest level of quality.
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Product
Production Parametric Probe Card
VC20TM Fab
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*Maximum channel count: 48*Tester platforms: Keysight 4062, 4072, 4080, Keithley S600, S530, Rack and Stack configurations.*Minimum Pad Size: 30ux30u (tunable scrub)*Contact Resistance: less than 1 ohm*Temperature range: -65C to 200C*Leakage: Less than 5 femto Amps per volt. If you require faster settling time*Repairable*Lifetime Performance: Production customers are experiencing 10M+ million touchdowns on Aluminum and Copper pads. Few to no rebuilds due to pobe wear
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Product
Probe Card
VC20E Series
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The 20mm VC20 is a highly adaptable probe card solution for a wide variety of tests including Modeling & Characterization, Wafer Level Reliability or Parametric Test. It can be easily combined with different interfaces to create modular probe cards supporting Keithley, Keysight or other custom tester platforms. Probes can be configured in either single or dual layer.
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Product
Probe Card
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Japan Electronic Materials Corp.
The probe card is a tool for testing semiconductors used at "Wafer Test" to check quality of IC or LSI in the first process of semiconductor manufacturing. The probe card is expendable.
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Product
Cryogenic 4K Probe Cards
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Over the last 20 years the Celadon Engineering team has developed an expertise in cryogenic materials which has resulted in a solid reputation in the industry for producing extremely stable cryogenic on-wafer probe cards as well as DUT probing solutions. These Cryogenic probe cards have all the benefits of Celadon’s Crash Resistant™ probe technology but with the ability to probe as cold as humanly possible. Celadon’s cryogenic solutions vary from standard VersaTile™ footprints which interface to positioners to innovate custom PCB based designs to allow for flexibility when testing at these very cold temperatures. Lakeshore cryogenic wire is used in standard DC solutions for high density cable-out designs to support high pin count applications. During the development process, Celadon works closely with the cryogenic prober vendor to ensure the integrated solution is optimized for current and future testing needs.
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Product
PCIe Carrier For PMC And PrPMC
PCI104
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The PCI104 is a PCIe carrier for PCI Mezzanine Cards (PMC) or Processor PCI Mezzanine Cards (PrPMC). The PCI104 carrier allows simplified testing of PMC/PrPMCs and their associated PMC I/O Modules (PIMs) by using a PC environment during board development or deployment. The PCI104 can also reduce the costs of manufacturing PMC/PrPMCs by allowing manufacturers to use off-the-shelf PCs for functional testing. The PCI104 converts the PCIe x4 edge connection to PCI-X via a PCIe to PCI-X bridge. The trace lengths to the PMC/PrPMCare kept to a minimum so the PMC/PrPMC can run with a133MHz PCI-X clock speed. The J4 connector of the installed PMC/PrPMC is routed to a 96-pin DIN connector per theVITA-35 specification. The PCIe to PCI-X bridge can run in either transparent or non-transparent mode and can also operate in forward or reverse mode. The PCI104 has a fan mounted on the board to cool the PMC/PrPMC. The fan can easily be removed for testing and probing of hosted card.
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Product
LED Probes for testing
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Advanced Probing Systems, Inc.
Probe Needles are used for the fabrication of most probe cards, however there exist applications for which these materials may not be appropriate, e.g., hubrid device and gold pad probing.
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Product
Multi-Test Resistivity Measurement System
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Sheet resistance mapping of thin films with a collinear 4-point probe, Temperature co-efficient of resistance (TCR) of thin films with collinear 4-point probe, Precision temperature co-efficient of resistance (TCR) with 2-point Kelvin probes and precision surface temperature probe, resistor testing with 2-point Kelvin probes,Precision resistor testing with a Kelvin probe card, temperature co-efficient of resistance resistor test (TCR), and Standard TCR test of multiple resistors with Kelvin probes or a probe card.
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Product
Probe Card Solutions
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Advanced engineering solutions are required to meet increasing challenges for wafer test, driven by today’s rapid technology acceleration. Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.
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Product
Wafer Probe Loadboards/PIB
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DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Product
Probe Card
VC43™/VC43EAF™
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VC43™/VC43EAF™ probe cards offer a larger format version of the popular VC20. In addition to saving time, another advantage of the modularity is the ability to leave the interface in place and simply install the VC43™ topside using Celadon’s twist and lock insertion tool which minimizes the possibility of triboelectric or interconnect issues that can occur during typical probe card changes. The VC43™ can be used for production parametric test, modeling, characterization, and wafer level reliability testing. Cards can be configured up to 104 probes in either single or dual layer with near vertical probes to minimize scrub lengths on pads allowing the VC43s to probe pads as small as 30 microns.
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Product
Cost-Effective ATE System
PRO RACK ATE
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Qmax Test Technologies Pvt. Ltd.
Pro-Rack is a cost effective ATE System, which comes with Modular Structure provision option to improvise and enhance much instrumentation based on the user’s requirements. Basically it is designed to cater to the needs of PCB test and repair depots, keeping in mind the changing PCB technology and the challenges in testing them off-line. It can provide complete PCB test and diagnostic functions for any kind of PCB including the latest very high density complex PCBs with high pin count PQFP, FPGA VLSI chips. AC /DC parametric tests enables testing of the DC parametric of device pins on the edge connector for input bias current, Fan out capacity ,Tri-state leakage currents, AC parametric measurements such as Input / Output Propagation delay Rise time / Fall time to further enhance fault coverage. Pro-Rack is designed with VPC Mass Interconnect adapter with 16 bit fixture ID interface to the UUT through simple clips and probes or through card edge or through a bed of nail test fixture.
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Product
High-Speed Trimming System
LSR-3230
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* no fixture or probe cards on top side * 2, 4, and 6 wire test capability * touch screen operation * high performance DC electrical tester * high throughput - low running cost
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Product
Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
CMOS Image Sensor
CIS
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CMOS Image Sensors (CIS) allow multiple camera functions in mobile devices, automobiles and security systems. Nidec SV Probe provides both standard and advanced versions of our CIS cards employing a wide variety of materials ensuring a durable cost-saving solution that can meet the fine pitch and multi-dut challenges of these devices. Other features and benefits include: • Proprietary AC™ Alloy Probes • Reduced Damage Under the Pad • High Frequency Capability • Better Alignment StabilityOur advanced CIS card, the Multiplexer™, is offered specifically for high density and high parallel applications. The Multiplexer™ is built with cantilever needles held into place on one side and shorter AC™ probes on the other which leads to a more stable electrical characterization over other CIS probe card options.Contact your Nidec SV Probe Representative so we can help you find the right CIS product for your testing needs.
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Product
Probecard testers
MANAGER
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Today more complex probe cards are being used. More pins,higher density and larger array requires a new approach inprobe card analysis. With the soaring cost of new generationprobe cards, repair of defective cards becomes an necessity.BE Precision Technology offers all capabilities with the newMANAGER V. Future proof, up to 450 mm full wafer contactprobe cards can be analyzed with up to 88.000 test channels.High-end materials are used to stand extra tough requirements—such as 500 mm diameter diamante viewing window,ultra stiff carbon flip-table, high power Z–stage to generate 600Kg of contact force
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Product
Probe Cards
Ceramic Blades
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SV TCL offers a variety of ceramic blades and blade probe cards. We have patented ceramic microstrip blade probes available in low leakage and low capacitance for optimal signal transference, while SV TCL's blade cards are ideal for parametric and RF testing.
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Product
Osprey Probe Card
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The Osprey probe card is MPI’s solution to demand for ever finer pitch. It is designed for smaller Al pad, and is ideal for tiny pitch application with peripheral and full array pattern. With precise alignment and better planarity control, Osprey can reach higher productivity by multi-DUT design. The forming wire (FW) type needle produced with MPI’s own micro fabrication process not only delivers high-quality performance but also allows easy needle replacement and shortens maintaining cycle time.
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Product
Full Wafer Test System
FOX-1P
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Enables High Throughput, Single Touchdown, Full Wafer Production Testing. Capable of simultaneously testing up to 16,000 die in a single wafer touchdown. Resource configurable up to 16,384 " Universal Channels " - each programmable as anI/O, Clock, Pin Parametric Measurement Unit ( PPMU ) or Device Power Supply ( DPS ). Software-enabled per site flexibility to support small and large device pin count test needs. Comprehensive functional and parametric test capabilities Deep functional pattern data and capture memory optimized for BIST/DFT testing. Per channel PMU for per site parametric testing Individual channel over-current protection to protect wafers and probe cards. Configured for high volume production. Compatible with industry standard probers and probe cards. Available as an integrated test cell with prober, probe cards and 16,384 channel probe I/F. Configurable as a single or dual system integrated test cell.
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Product
Probe Card
VC20E Lab
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*20 millimeter ceramic probe card*Optimized for DC parametric test, modeling and characterization, and single site WLR*Can be quickly installed using an interface tool into various interfaces and takes minimal storage space on the test floor*Effective operating temperature range from -65° to 200° C*Leakage as low as 5fA/V. If you require faster settling time, click here*Can be configured with up to 48 probes
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Product
Production Wafer Level Burn-in
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TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Product
Multisite Probe Card
T300 ButtonTile™
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The Celadon T300™ probe cards are designed for long-term, multi-site, high-density wafer level reliability or burn-in tests up to 400°C. In today’s economic environment, conventional reliability data is needed quickly while eliminating the cost, electrical stress, and delay of parts packaging while maintaining a wafer performance map.
