Deposition
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Deposition Systems
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When a thin film requires the most stringent structural or compositional properties consistently across every layer, Veeco’s Ion Beam Deposition (IBD) technology is often the answer. Using a focused beam of ions to sputter material from a target, this physical vapor deposition technique builds dense, uniform films with standout adhesion and stability.
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Particle Deposition Systems
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MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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Dynamic Scale Deposition Loop System
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Dynamic Scale Deposition Loop fully automated systems includes hardware and software to measure and evaluate the performance of scale inhibitors under high pressure and high temperature conditions.
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Thin-film deposition
Plasma Source
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SPECS Surface Nano Analysis GmbH
Thin-film deposition covers any technique for depositing material onto a bulk or thin film substrate. Elemental alloy or compound films are produced by non-reactive or reactive (co-)deposition. Often functionalization or tailoring of device interfaces by predeposition or deposition assisting surface treatment with atoms or ions is necessary.
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In-Situ Metrology Etch
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In-situ metrology systems are attached to deposition systems on one or several viewports for monitoring the progression of the etch dept during the process in real time. No matter if the required stop depth lies within a layer or at an interface.
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ALD Research
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Veeco’s ALD Research page is a hub for the latest thinking in atomic layer deposition. It brings together experimental data, modeling insights and collaborative breakthroughs that help engineers stay ahead of the curve. Whether exploring new chemistries or solving complex process challenges, this resource is designed to inform, inspire and accelerate thin-film innovation.
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High Power Microwave Plasma Source
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The High Power Microwave Plasma Source can be combined with a 6kW microwave generator for a high concentration of radicals providing a high productivity manufacturing solution. The High Power Microwave Plasma source is capable of igniting in multiple process gases, over a wide operating range with performance benefits in current and emerging applications such as, high throughput photoresist removal, advanced surface cleaning and conditioning, as well as, advanced deposition applications at the atomic level.
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Long Term Test Kit
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When long term electro-chemical tests (>1000 hours) are run to monitor the cell degradation at the cathode for example, it is important to avoid any contaminant in the gas flow rate.Inconel 601 flange equipped with alumina housing and alumina tube to feed the gas to the electrode during long term test (>1000 h)Typical poisoning is coming from the chromium contained in the steel tubing. The volatile chromium species (Cr6+) will flow into the cathode (with the air) and thanks to the intake of electrons at the electrode, the chromium ion will transform to chromium oxide and be deposited at the cathode triple point. In such a case, the long term test kit is used. The Inconel 601 flange is equipped with an alumina housing (>96 % Al2O3) and the air (or other gas) is led through an alumina tube. The long term test kit is fully compatible with other functionalities proposed with the Open Flanges™ test Set-Up as the integrated steamer or the small pellet test kit. The long term test kit can be implemented on the fuel, on the air or on both sides.
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EpiStride SiC CVD System
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Veeco’s latest technology for the compound semiconductor market enables high-performance chemical vapor deposition of Silicon Carbide for both 6 and 8-inch wafer production. The platform enables a return to production in under 5 hours after routine cleaning maintenance. The EpiStride system’s high uptimes, short cycle times and overall stable performance lead to the lowest cost of ownership per wafer compared to competitive systems.
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PLD/PED Components
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Neocera offers a variety of components that can be fitted and combined into new or existing PLD and PED systems to provide improved functionality and enhanced capability. Components include:*Oxygen-compatible substrate heaters for epitaxial oxide film depositions..*Automated Target Carousels for preparing multilayer heterostructures.*Deposition chambers design specifically for PLD and PED systems.*Manual and automated laser window-change Accessories.*Pulsed Electron Deposition (PED) sources for laser transparent materials.*Ideal for retrofitting existing systems or construction of new systems.
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PED Systems
Pulsed Electron Deposition
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Is a process in which a pulsed (80-100 ns) high power electron beam (~1000 A, 15 kV) penetrates approximately 1 μm into the target resulting in a rapid evaporation of target material. The non-equilibrium heating of the target facilitates stoichiometric ablation of the target material. Under optimum conditions, the target stoichiometry is preserved in the deposited films. All solid state materials – metals, semiconductors and insulators, including those transparent to laser wavelengths in PLD – can be deposited as thin films with PED. By combining PLD and PED, the range of complex materials that can be prepared as thin films can be greatly enhanced.
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GHW Series 13.56 MHz, 1.25, 2.5, And 5.0 KW High-Reliability RF Plasma Generators
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The GHW Series RF power generators deliver maximum rated output powers of 1250, 2500 and 5000 Watts at a frequency of 13.56 MHz. The GHW generators offer field-proven reliability, exceptional stability, and unsurpassed repeatability for high uptime and process yield. They are ideally suited for Plasma Enhanced Chemical Vapor Deposition (PECVD), High Density Plasma CVD (HDPCVD), etching and other thin film applications during the manufacture of integrated circuits, flat panel displays, and data storage devices.
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High-grade type Gas Monitor for Chamber Cleaning End Point Monitoring
IR-400
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The IR-400 offers real-time monitoring of the chamber cleaning end point during the deposition process. By optimizing the cleaning process, the IR-400 reduces cleaning time and gas usage. This reduction in cleaning gas usage leads to a reduction in chamber damage and increases the life times of all the systems components.
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Gas and Vapor Delivery Systems
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In thin film deposition, high-quality results start with how process gases are delivered, as they help create the stable environment needed for consistency by controlling flow, pressure and composition to support processes like ALD, CVD, and PVD. Advanced semiconductor devices developed for the most advanced computing processes, such as AI and edge computing, need the ultra-high-purity environments of our gas and vapor deposition delivery systems.
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Custom Aluminum Nitride Ceramic Substrate
CAN1
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CAN1 Custom Aluminum Nitride Ceramic Substrate is a custom aluminum nitride ceramic substrate for sensor platforms, MEMS devices, thermal management studies, thin-film deposition, and electronic materials research. The substrate can be supplied for prototype development, coating trials, and small-batch R&D projects where stable ceramic material and custom dimensions are required.
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Copper Pillar Bump
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Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Electron Sources
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SPECS Surface Nano Analysis GmbH
To our customers in research and industry we offer a variety of sources for deposition, excitation and charge neutralization as well as analyzers and monochromators. Most of our sources originate from product lines which we have taken over from Leybold AG, Cologne, and from VSI GmbH. The X-ray monochromator Focus 500 and the UV monochromator TMM 302 are original developments by SPECS.Compliance with industry standards, a good price-performance ratio, stability, and longevity are the guidelines for our product development. We focus on standardized easy handling, user-friendliness, standardized software interfaces and safety.
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Pulsed-DC Systems
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Extend process innovation with Advanced Energy’s comprehensive pulsed-DC suite. Minimize arcing, enhance deposition rate, improve film flatness and packing density.
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Field Portable NIR Spectrometers For Mineral Identification And Analysis In Mining Exploration
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With Spectral Evolution field portable NIR spectrometers and EZ-ID mineral identification software, geologists can measure and identify minerals within seconds and cover more ground than by using traditional methods. They can identify different mineral phases, create mineral alteration maps and more accurately identify mineral pathfinders for vectoring to ore deposits. Spectral Evolution's field portable, battery-operated oreXpress, oreXplorer and oreXpert ultra-high resolution NIR spectrometers are designed for mineral identification in mining exploration. The oreXpress, oreXplorer and oreXpert provide quick payback with faster, more accurate mineral identification in exploration for gold, silver, diamonds, iron, nickel, copper, uranium, aluminum - in the field, core shack, or in the lab, and provide:
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Process Sense™ NDIR End Point Detector For Chamber Clean
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The Process Sense endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). It gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.
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Trace Moisture Analyzer
Model 8800P
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Teledyne Analytical Instruments
The 8800 series uses field proven aluminum oxide (Al2O3) sensing technology to accurately detect trace moisture on either a continuous or spot checking basis. All Al2O3 sensors share the same basic operating principle: the capacitance measured between the sensor’s aluminum core and gold film deposited on the oxide layer varies with the water content. The 8800 series moisture sensor employs unique Hyper Thin Film (HTF) technology, which offers three major structural improvements in Al2O3 sensor design. These structural changes, noted below, provide the user with increased sensitivity, greater stability and a quicker response time when compared to other conventional aluminum oxide sensors on the market today.
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Atomic Layer Deposition Systems
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Atomic Layer Deposition (ALD) is a powerful way to build ultra-thin, super-precise coatings, one atomic layer at a time. It’s especially useful and efficient when working with tiny, complex 3D structures, making it a go-to technique in advanced semiconductor manufacturing.
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Solder Past Inspection
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From the innovative Z-Check 3D through to the entry level Z-Check 100 the entire range has been designed to provide accurate pad specific measurement of solder paste deposits, adhesives and component placement. Amongst its other features the Z check software comes with the convenience of a full SPC package as standard.
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ALD Advantages
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Atomic Layer Deposition (ALD) stands out for one reason: control. The most significant advantages of thin film deposition via Atomic Later Deposition over other methods, are manifest in four distinct areas – film conformality, low temperature processing, stoichiometric control, and inherent film quality associated with the self-limiting, and self-assembled nature of the ALD mechanism ALD is exceptionally effective at coating surfaces that exhibit ultra high aspect ratio topographies, as well as surfaces requiring multilayer films with good quality interfaces technology. This thin-film process builds materials one atomic layer at a time, delivering unmatched uniformity and sub-nanometer precision, even on complex 3D structures. That level of accuracy makes ALD a critical technology for advanced semiconductor manufacturing, flexible electronics, and materials research.
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ICP Plasma System
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The AXIC IsoLok® Inductively Coupled Plasma (ICP) Load-Locked Processing System from AXIC, Inc. defines a new concept in Deep Reactive Ion Etch (DRIE) and low temperature-low damage Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD) plasma processing. The system is based on a modular design starting with a universal chamber and cabinet unit with ICP etch or deposition bottom electrodes available for easy installation into the chamber unit combined with a load-lock. We are confident you will find the ease of use, variety of plasma processes, serviceability and attractive pricing unsurpassed by any other plasma product in the market.
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Ion Beam System
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Veeco's unmatched Ion Beam know-how delivers proven etch and deposition performance enabling the data storage and MEMS markets for decades.
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Panel Light-I-V Teste
ASIV-11
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Greensolar Equipment Manufacturing Ltd.
The Panel Light-I-V Tester (ASIV) is used to test photovoltaic panels or modules during their production. A flashlight illuminates the work piece with similar light spectrum to that of the Sun, while the electric performance of the unfinished panel or the finished module is accurately measured. With the help of the tester the user can filter out reject panels. Testing the final performance reveals changes made by alternations in the deposition recipe.
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Reticle Manufacturing
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An error-free reticle (also known as a photomask or mask) represents a critical element in achieving high semiconductor device yields, since reticle defects or pattern placement errors can be replicated in many die on production wafers. Reticles are built upon blanks: substrates of quartz deposited with absorber films. KLA’s portfolio of reticle inspection, metrology and data analytics systems help blank, reticle and IC manufacturers identify reticle defects and pattern placement errors, thereby reducing yield risk.
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ALD For Research & Development
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Veeco’s atomic layer deposition research systems are designed by ALD scientists and built for maximum experimental flexibility and value. With universal precursor delivery systems, you can use solid, liquid or gas chemistries in any precursor port. There are many options to choose from including ozone generators, in-situ monitoring and various configurations. As always, our team of ALD scientists are ready to answer your recipe development and film characterization questions. Over 2500 published academic papers feature research performed on our Savannah® thermal ALD system and Fiji® plasma ALD system.
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Gridded RF Ion Sources
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Veeco's gridded RF ion sources are designed for improved production of long-run ion beam deposition processes.
