Ground Bond Testers
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Bond Tester for Wafers 2 - 12 inch
Sigma W12
Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)Precise testing and Cold Bump Pull (CBP) testingLarge X/Y stages X: 600mm, Y: 370 mmForce range from 1gf – 10 kgfBump pitch down to 20 µm
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Bit Error Rate Tester - PXI
BERT 1001/1005 Series
The BERT is 2 or 4-channel PPG and Error Detector for the design, characterization and production of optical transceivers and opto-electrical components at data rates up to 30 Gb/s.With scalability and exceptional signal fidelity, it is a cost effective test solution for 400 Gb/s communication eco-systems.
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Ground Resistance Tester
Weshine Electric Manufacturing Co., Ltd
1.Soil resistivity tester supports 2, 3 and 4wire grounding resistance measurement. 2. 4digit large LCD display with white screen backlight, suitable for use in dimly lit places. 3. IP65 protection grade, good waterproof, compact and portable, supports multiple functional tests.
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Ground Set Tester
Self-contained, portable convenienceThis tester provides an easy way for an electric utility to check the resistance in protective grounding sets used by line personnel.
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Medical Grounding Resistance Tester
2678YM
Shenzhen Chuangxin Instruments Co., Ltd.
Medical Grounding Resistance Tester，Product Introduction2678YM Medical Grounding Resistance Tester Is Used To Measure The Internal Electrical Equipment Of Grounding Resistance,Which Reflects The (Contact) Resistance Of Total Grounding Terminal Of Electrical Equipment.It Suitable For Measuring All Kinds Of Motors,Electrical Appliances,Instruments,Household Appliances And Other Equipment Resistan
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Bond Testing
Our complete line of bond testing (BT) flaw detectors provides unmatched capabilities for the location of discontinuities and other flaws in composite structures. We offer a wide range of measurement features and application-specific options for flaw detection.
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Bond Alignment Systems
With the invention of the world’s first double sided alignment system in 1985, EV Group has revolutionized MEMS technology and set worldwide industry standards in aligned wafer bonding by separating the alignment and bonding process. This process separation results in higher flexibility and universal application of the wafer bonding equipment. The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.
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Bond Tester
Sigma Lite
Sigma lite is a low cost of ownership bond tester that grows with your company. It gives you a low-cost entry point without sacrificing performance to meet future demands.
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Ohm-Stat Ground/Circuit Tester to Test ESD Ground
Tests ground for all 110v electrical circuitsWill determine the status of all electrical groundsEasy to use LED lightsWarranteeProduct conforms to the ESD S.20.20 spec standardsIdentify electrical problemsUsed with the Ohm-Stat RT-1000 resistivity meter
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Earth Ground Testers
TES Electrical Electronic Corp.
Capable of measuring earth voltage. Data hold function. Auto power off function. The timer operates automatically about 10 minutes with the "test button switch are pressed to keep the tester power on.
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Ground Leads Continuity Tester
Weshine Electric Manufacturing Co., Ltd
1. The new power supply technology is adopted in the grounding down lead conduction tester.2. It has the characteristics of small size, light weight, large output current, good repeatability, strong anti-interference ability and protection function. 3. The whole machine is controlled by single chip microcomputer, which has a high degree of automation. 4. The instrument has high precision and easy operation. The maximum current is 10A.
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Earth Ground Testers
Fluke''s family of earth ground testers have been built to address the entire spectrum of ground testing methods from the basic to the most advanced. Our testers have been designed to be accurate, safe and easy to use. We provide quick and precise resistance measurements through several test methods: 3- and 4-pole Fall-of-Potential testing, selective testing, stakeless testing and 2-pole testing. Detailed application information can be found at the Earth Ground Solution Center.
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64 Gbaud High-performance BERT
M8040A
The Keysight M8040A is a highly integrated BERT for physical layer characterization and compliance testing. With support for PAM-4 and NRZ signals and data rates up to 64 Gbaud (corresponds to 128 Gbit/s) it covers all flavors of 200 and 400 GbE standards.
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Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
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Earth Ground Testers
Plant maintenance is a must! Confirming your ground resistance is crucial for instruments and machinery. Our Earth Ground Testers provide simple accurate measurement of earth resistance.
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High Force Large Area Bond Tester
Sigma HF
- For high force and large area- Typically for IGBT, power modules and batteries up to 1000 kgf- High axis speed- Deep access up to 80 mm- SEMI S2 safety cabinet with visual feedback- Flexible positioning of multiple work holders
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SAFE-T-GROUND - Ground Continuity Monitor / Control
TR-7
Model TR-7 Safe-T-Ground provides continuous monitoring of a truck's ground connection throughout loading operations. Static electricity is often brought in by tank trucks entering the loading area. The Safe-T-Ground Model TR-7 instantly stops loading operations if a tank truck loses its ground.
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Ground Fault Monitor
IFT-120
Our ground fault monitors enable you to easily and quickly find the source of the fault before a major problem occurs and damages your equipment. This is the IFT-120, designed to assist you in rapid identification of ground faults.
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Ground Fault Detectors
STB Electrical Test Equipment, Inc
STB's convenient Ground Fault Detectors may be operated with one hand and are ideal for preventative maintenance. Ground Fault Detectors indicate ground faults and electrical leakage while equipment is in operation.
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Ground Fault Finder
FST-JD200 DC
Foresight Electronics Co., Ltd.
FST-JD200 not only can provide a solution on accurately testing the faults of the indirect-grounding of the direct current system, non-metal grounding, loop grounding, simultaneous grounding of the anode and cathode, balanced grounding of the anode and cathode and multi-point grounding 1. The high-precision sampling clamp meter The device uses a high resolution (0.1mA) signal sampling direct current clamp meter that can achieve multi-point grounding and high resistance ground point positioning...
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Neutral Grounding Resistors
NGR
Neutral Grounding Resistors (NGRs) are used to limit the fault current for safety of equipment and personnel in industrial systems.
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Resistance Wire Bonding
Electronic Systems of Wisconsin, Inc.
ESW's Resistance Wire Bonding System comes equipped with the latest features the market has to offer. Our system is capable of bonding armatures, stators or coils. The on-screen display in our bonder makes it easy to read, track, and record your bonding data. If desired, ESW offers complete electrical testing of the part prior to the bonding sequence as well. This ensures only good parts that have been electrically tested are processed through bonding. It is our duty to make sure you never have to worry about losing important information again. Our Sales and Engineering staff will work closely with you to make sure that a bonding systems will meet your needs. See the slideshow below to see some of our Resistance Wire Bonding Testers.
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Fusion Bonded Cable Jumpers
Series 152FB
Fusion Bonded Cable Jumpers. Aries Series 152FB Fusion Bonded Cable Jumpers are flexible...plug them directly into PC boards or sockets. Stranded wire conductors are fusion bonded with an overcoat of tin for easy soldering or socketing. Each jumper is shipped with protective tabs on both ends for maintaining proper conductor spacing.
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Bond Force Measurement And Calibration Systems
BFS-20
Based on its design and easy handling it can be used also on other brands to measure the bond force.
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ESD Ground Point
EGP-020
The EGP-020 ESD Ground Point is a convenient mechanical socket that can be mounted on to any equipment frame for equal-potential bonding to the equipment. The 4 mm socket is not insulated, made of lathed brass, nickel-plated, for use as grounding socket.The EGP-020 is designed to be mounted on an unpainted conductive surface.
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