Thermal Expansion
-
Product
Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
-
The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
-
Product
Horizontal Dilatometers
-
TA Instruments’ unique True Differential configuration makes our dilatometers the preferred choice for the most accurate measurement of Coefficient of Thermal Expansion (CTE). The high precision linear position sensor, the thermostat equipped measuring head housing, and the use of thermally ultra-stable materials all contribute to the outstanding displacement resolution, and ensure the most accurate measurement of low CTE values.
-
Product
Coupler Workstations
-
Workstations using pure hydrogen gas from a tabletop generator, tank supply, or oxygen, can achieve high enough temperatures to develop Fused Biconic Tapered devices, Power Combiners, Wavelength Division Multiplexers, Thermal Core Expansion devices, and many other products.
-
Product
IDoor Module: 4-Ports Non-Isolated RS-232 MPCIe, DB37
PCM-24D4R2
-
Meets Advantech Standard iDoor TechnologyPCI Express® Mini Card Specification Revision 1.2 compliantSpeeds up to 921.6 kbps for extremely fast data transmissionSupports any baud rate setting (50bps~921.6kbps)Supports both Isolated & Non-Isolated Protection with 2/4 Ports RS-232/422/485I/O address automatically assigned by PCIe plug & playOperating systems supported: Windows 2000/XP/Vista/7, and Linux 2.4/2.6OXPCIe952/OXPCIe954 UART with 128-byte FIFOs standardSupports Embedded Automation PC UNO-2200/2300/2400 seriesSupports Control DIN-Rail PC UNO-1200/1300/1400 seriesSupports Control Cabinet PC UNO-3200/3300/3400 seriesSupports Control Panel Computers TPC-xx81/xx82 seriesSupports Thin Client Panel Computers TPC-xx51 series
-
Product
4-Slot Expansion I-Module With 1 PCIe X16, 3 PCI
MIC-75M13
-
1x PCIEx163x PCI1x SATA (2x 2.5" HDD bay)Support 1x 8cm FAN (Optional)Dimension (W x H x G): 90 x 192 x 230 mm
-
Product
IDoor Module: 2-Port Hilscher NetX100 FieldBus MPCIe, EtherNet/IP, RJ45
PCM-26R2EI
-
Meets Advantech Standard iDoor TechnologyPCI ExpressR Mini Card Specification Revision 1.2 compliantIdentical interface for all Hilscher Real-Time Ethernet Fieldbus ProtocolsVarious colorful front plates for protocol identificationEasy integration by wide range of device driversHigh extended temperature range up to 70°CCompatible with embedded automation PC UNO-1/2/3/4 series
-
Product
PCI Express X4, 4-Port USB 3.0 Expansion Card
PCE-USB
-
Four USB 3.0 host controllers, Support 1500mA Max. Current per Port. Supports four or eight USB 3.0 ports, 3 Ports with Locking connector compliant with USB3 Vision V1.0 Standard-A. Compliant with USB 3.0 Specification and Intel® xHCI Specification, Revision 1.0, PCI Express x4 interface.
-
Product
MIC-780 Series I-Module With 1 X PCIex16, 1 X PCI
MIC-78M11
-
1 x PCIEx161 x PCISupport 2 x 4cm FAN (Optional)Support additional 2.5" HDD/SDD kit (Optional)Diemension with MIC-780 : 133 x 195 x 255 (mm)
-
Product
PCI Express X4, 2/4-Port GbE Expansion Card
PCE-GIGE
-
Intel Ethernet Controller i210, Supports Wake-on-LAN function, Supports two or four GbE LAN ports. Supports PXE function, PCI Express x4 interface.
-
Product
Regular Flex I/O For Remote Switch
98R17500401
-
Flex I/O expansion on the front panel for same-side cablingCompatible with MIC-7500, MIC-7700, MIC-770, MIC-7900
-
Product
MIC-780 series i-Module with 2 x PCIex8, 1 x PCIex4, 1 x PCIex2
MIC-78M40-01
-
2 x PCIEx81 x PCIEx41 x PCIEx2Support 1 x 8cm FAN (Optional)Support additional 2.5" HDD/SDD kitDiemension with MIC-780 : 173 x 195 x 255 (mm)
-
Product
IDoor Module: 2-Port Hilscher NetX100 FieldBus MPCIe, EtherCAT, RJ45
PCM-26R2EC
-
Meets Advantech Standard iDoor TechnologyPCI ExpressR Mini Card Specification Revision 1.2 compliantIdentical interface for all Hilscher Real-Time Ethernet Fieldbus ProtocolsVarious colorful front plates for protocol identificationEasy integration by wide range of device driversHigh extended temperature range up to 70°CCompatible with embedded automation PC UNO-1/2/3/4 series
-
Product
Regular Flex I/O For COM Port
98R17500601
-
Flex I/O expansion on the front panel for same-side cablingCompatible with MIC-770
-
Product
I-Module With 1 X PCIex16, 3 X PCI
MIC-78M13
-
1 x PCIEx161 x PCESupport 1 x 8cm FAN (Optional)Support additional 2.5" HDD/SDD kitDiemension with MIC-780 : 173 x 195 x 255 (mm)
-
Product
2-Port Isolated RS-232/422/485 Communication Module
AMAX-5490
-
Data Bits: 5, 6, 7, 8Stop Bits: 1, 1.5, 2Parity: None, even, oddBaud Rate: 50 bps ~ 230.4 kbpsData Signals: RS-232: TxD, RxD, GND RS-422: Tx+, Tx-, Rx+, RXRS-485: Data+, Data-FIFO: 256 bytesFlow Control: Xon/Xoff
-
Product
MXM GPU Expansion Module
MIC-75GF10
-
Support NVIDIA MXM GPU with whole system fanless designSupport up to 80W NVIDIA Quadro MXM 3.1 Type A/B form factor GPU1 x HDMI and 3 x DisplayPort 1.4a display outputOperating Temp. -10~50CSupport 1Grms Op. vibrationDual front removable 2.5" storage bay for easy swapIP40 fanless ruggedized compact size designMIC-7 Series compatible
-
Product
Expansion Peripherals
-
Expansion peripherals are used with data loggers to achieve many purposes, including the following: add additional channels, extend data communications networks, perform media conversions, read vibrating wire sensors, and build distributed measurement networks.
-
Product
Row Expansion Cables
Y1134A
-
Easily configure an expanded matrix using this expansion cable with the 34934C and 34934T terminal blocks
-
Product
Expansion Board
MSXB 044
-
The MSXB 044 expansion board works with the iDSC 1816 to add signal conditioning to the data acquisition and anti-aliasing capabilities. Four MSXB 044 boards are included in each MSSC-8 module. Purchase the MSXB 044 as part of a complete SCS system: an enclosure and 1, 2, 3, or 4 MSSC-8 modules, for a total of 8, 16, 24, or 32 channels.
-
Product
Thermal Management
-
Our air cooling components dissipating heat to the ambient air comprise high-performance heat sinks, general purpose DC fans and AC fans for forced air ventilation, as well as filter fans with exchangeable exhaust filter inserts that ensure clean and reliable air exchange in cabinets.
-
Product
Thermal Profiler
V-M.O.L.E.®
-
The V-M.O.L.E. is a full-featured compact thermal profiler that belies its sophistication in an easy-to-use 3-channel Mini-thermocouple configuration. Ideal for VERIFICATION of PCB profile performance, 3 channels give you Hot, Cold and Sensitive component data for verifying the correct oven settings.
-
Product
PCIe Expansion Modules
-
The AMAX-54XX series are expansion modules for AMAX-5580, targeted at increasing the communication capability of CPU modules.
-
Product
Expansion Adapter Chassis
TB3-TO-CMC-LP
-
The TB3-TO-CMC-LP is an expansion adapter chassis using the Intel Thunderbolt 3 interface. The adapter allows the use of a front I/O XMC or PMC card outside its normal confines of a single board computer (SBC) or PC hosted carrier card. The TB3-TO-CMC-LP enables the deployment of XMC or PMC modules in systems previously unable to host them -- laptops, small form factor PCs, and other computers lacking add-in slots.
-
Product
Thermal camera
-
An efficient way to prevent faults in circuits or facilities by locating hot spots, as well as in veterinary medicine or location of living beings.
-
Product
Thermal Software
ThetaCalc
-
Thermal Engineering Associates, Inc.
A tool designed to provide a quick estimate of the temperature and thermal resistance from a heat source to a reference heat sink. It also shows the temperature and thermal resistance value of each layer in the heat flow path. The program can accomodate up to ten layers of different materials of varying dimensions between the heat source and sink. The heat spreading angle can be set independently for each layer to a value between 0 and 45 degrees; the tool will automatically determine if heat flow reaches the layer edge and then convert to columnar flow.
-
Product
Mini PCIe Expansion Kit
iDoor
-
Advantech’s iDoor Expansion Module is a brand-new design concept which utilizes the Mini PCIe format. iDoor modules include: communication, fieldbus protocol and digital I/O. The highly flexible customization and easy assembly provide integrated solutions to meet different needs.
-
Product
Thermal cameras
-
SKF Condition Monitoring Center
Using an SKF Thermal Camera is a proactive way to help you detect problems before they occur, increasing uptime and improving safety. They allow you to be able to visualise potential problems, invisible to the naked eye, by presenting a picture of the heat distribution of an asset. The thermal image, presented on a large LCD screen, shows you where the temperature is either too hot or too cold allowing you to pinpoint potential problems fast.
-
Product
Thermal Cameras
-
Megger's thermal cameras are professional and easy-to-use, and provide fast accurate readings.
-
Product
PMCspan PMC Expansion Board
PMCspan
-
SMART Embedded Computing’s PMCspan allows users to customize and expand I/O options when coupled with a Smart SBC.
-
Product
Thermal Testing And Analysis
-
Response Dynamics Vibration Engineering, Inc.
We have consulted on thermal issues ranging from conduction issues in TECs, thermal radiation modeling, and countless air cooled system issues relating to system performance, vibration, and acoustics noise. We use a wide array of thermocouple instrumentation, thermal imaging, flow measurements, as well as finite element analysis and analytic modeling to measure, design, and debug thermal and related issues. We often work on customer products in our Response Dynamics lab where we characterize the system, engineer solution options, and prototype solutions. We then work with the customer to work the winning solution into their quality control and manufacturing process.





























