Common Core
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Product
COM Express Basic Size Type 6 Module with 11th Gen Intel® Core™, Intel® Xeon® and Intel® Celeron® Processors
Express-TL
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ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth of previous generation COM Express modules. With a combined 8 cores, 16 threads, and up to 128GB memory, the Express-TL brings uncompromised system performance and responsiveness to your solution. Featuring brand new Gen 12 Intel® UHD Graphics and Intel® AVX-512 Vector Neural Network Instructions (VNNI), the Express-TL provides AI inferencing performance as much as 3X higher compared to previous generation non-VNNI platforms. The integrated Gen 12 Intel® UHD Graphics core can be configured to support one 8K independent display or four 4K independent displays (HDMI/DP/eDP). In addition, legacy display interfaces such as LVDS and analog VGA are still supported as build options. Key features for today’s applications are support for 2.5 GbE and USB 3.2 with transfer rates of up to 10Gb/s that can transfer image data from cameras faster than previous generation products. Combined with 8 processor cores at 25W TDP, Intel® AVX-512 VNNI, Intel® OpenVINO™ toolkit and Intel® UHD Graphics, the Express-TL is well suited for AI at the edge applications (AIoT/IoT).
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Product
COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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Product
2U Rackmount Network Appliance Platform Based On Intel® Xeon® E3 Series And 6th/7th Generation Intel® Core™i7/i5/i3 Processors
FWA-4130
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Intel® Xeon® E3 Series and 6th/ 7th Generation, Intel® Core™i7/ i5/ i3 Processors4 x DDR4 2133/ 2400MHz ECC UDIMMs, up to 64GB4 x Advantech network module expansions1 x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2 x 3.5" HDD bay, CF slot (optional)IPMI2.0 compliant remote management (optional)
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Product
3.5" Single Board Computer With Intel® Core™ Ultra Processors
SBC35-MTL
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ADLINK SBC35-MTL, a compact 3.5" Single Board Computer equipped with Intel® Core™ Ultra Processors for efficient, high-performance computing. It features an integrated NPU to boost AI processing capabilities and includes a reserved MIPI-CSI signal pathway for easy camera integration, making it ideal for real-time and vision-based applications. The SBC35-MTL is designed to meet the needs of modern embedded systems, delivering cutting-edge performance in a compact form factor
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Product
IC-3173, 2.20 GHz Intel Core i7 Dual-Core Processor, 4-GigE Port, 2-USB 3.0 Port Industrial Controller
784965-01
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The IC‑3173 is a high-performance, fanless industrial controller for developers who require a high level of processing power and connectivity for automation and control applications in extreme environments. The IC‑3173 provides connectivity for communication and synchronization to EtherCAT and Ethernet CompactRIO chassis, EtherCAT motion drives, GigE Vision and USB3 Vision cameras, and other automation equipment. In addition, this controller has onboard isolated, TTL, and differential digital I/O, so it can perform synchronization and control tasks without additional tethered I/O.
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Product
SMARC Short Size Module with Freescale i.MX6 Solo, DualLite, Dual or Quad Core Processor
LEC-iMX6
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The SMARC ("Smart Mobility ARChitecture") is a versatile small form factor computer Module definition targeting applications that require low power, low costs, and high performance. The Modules will typically use ARM SOCs similar or the same as those used in many familiar devices such as tablet computers and smart phones. Alternative low power SOCs and CPUs, such as tablet oriented X86 devices and other RISC CPUs may be used as well. The Module power envelope is typically under 6W.
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Product
2U Intel Core Series
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2U Rackmount Network Appliances with Intel® Core™ Series Family for Gateway and NGFW.
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Product
COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
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Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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Product
COM Express Type 6 Compact Module With 7th Gen Intel® Core™ & Celeron® Processor
CEM511
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The CEM511, a new COM Express Type 6 Compact form factor module, is powered by the latest 7th generation Intel® Core™ i7/i5/i3 processor (Kabylake-U) for high-performance applications. The palm-sized CEM511 is packed with a variety of rich features including low power consumption, industrial wide temperature range support and impressive graphic processing capability. The COM Express® Type 6 Compact module supports two DDR4-2133 SO-DIMM sockets with a maximum system memory capacity of up to 32GB. It has a rugged design with an extended operating temperature range from -40°C to +85°C (-40°F to +185°F) to satisfy different harsh environment demands. The system on module also delivers outstanding computing, graphics and media performance through its Intel® Gen 9 graphics engine, DirectX 12.0, OCL 2.0, OGL4.3 features and 4K resolution (4096 x 2160 @ 30 Hz) support. Therefore, the power efficient CEM511 is designed for graphics-intensive applications over the Industrial IoT, including industrial control system, medical imaging, digital signage, gaming machines, military, and networking.
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Product
Embedded Motherboard supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket
AMSTX-CF Series
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Embedded graphics enables system developers to boost the performance of a wide range of workloads, including medical imaging, image analysis, compute acceleration, and artificial intelligence (AI). Leveraging graphics processing units (GPUs), embedded graphics can be used to increase application speed and accuracy, as well as decrease latency. Many embedded system developers are using embedded graphics solutions in real-world applications, such as medical, manufacturing, and traffic management, along with other embedded segments.
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Product
Coupling Decoupling Network for Conducted Common Mode Immunity Testing According to IEC 61000-4-6
CDN
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The CDN M5 is intended to inject common mode disturbance signals to power supply of mains lines (unscreened) in the frequency range from 150KHz to 230MHz. A variety of calibration adapters and other accessories are available as an option. RF Standard connector: BNC type, AC socket 4mm safety bananas.
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Product
Mini-ITX SBC With LGA1150 Socket Intel® Xeon® E3-v3 And 4th Gen Intel® Core™ Processor, Intel® C226, HDMI/DisplayPort/VGA/LVDS, Dual LANs And USB 3.0
MANO882
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The MANO882 supports Intel® Xeon E3 series, 4th generation Intel® Core™ i7/i5/i3 processors and Celeron® processors with the Intel® C226 chipset. Two SO-DIMM sockets onboard support up to 16 GB of DDR3-1333/1600 system memory. The outstanding motherboard sustains HDMI, DisplayPort, VGA and LVDS with triple-display capability, making this system board an ideal solution for digital signage, optical inspection for machinery, and industrial automation and control fields. In addition, the embedded board supports Intel® AMT 9.0 security technology to provide complete protection against viruses and attacks. Additionally, the MANO882 is equipped with an Infineon TPM 1.2 security chipset to enhance user data protection.
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Product
15.6" Fanless Panel PC With Intel® Core™ I7/i5/i3 Processor
PPC-315W TGL
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Industrial-grade 15.6" FHD LCD panel with 50k backlight lifetimeTrue-flat touchscreen with multi-touch projected capacitive contrHigh-performance, fanless 11th generation Intel® Core™ i processorDual channel memory slots, max 64GCompact, fanless design with aluminum alloy enclosureIP66-rated front panelSupports dual displays (1 x external HDMI)1 x M.2 bay (2242/2280 NVME or SATA Interface) for storage and support SATA RAID 0, 1Support TPM2.0 hardware security
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Product
Clamp-On / Precision / Split Core Current Transformer
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Transformer Ratio (Arms) : 100A / 1AColours : Red, yellow, blueConnection : Safety Sockets for Banana Plugs ф 4mm Jaw Opening : Cable Dia 15mm max.
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Product
Industrial IP69K Stainless Steel Panel PCs With 11th Gen Intel® Core™ Processor
Titan2
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- 11th Gen Intel® Core™ i5/i3 BGA type processor- 15.6”/21.5”/23.8” FHD with projected capacitive touchscreen- Full IP69K rating for dust and water ingress- Corrosion-resistant 304 stainless steel enclosure (316 for Option)- All M12 type connectors suite for harsh environments- Optional for optical bonding and high brightness (1000 nits)- Standard VESA, Yoke/Pipe mount (optional)
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Product
COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 Series and Intel® Xeon® Processors (formerly codename: Kaby Lake)
Express-KL/KLE
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The Express-KL/KLE is a COM ExpressR COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 7th Generation Intel Core and Xeon processor E3 (codename "Kaby Lake-H”) with Mobile IntelR QM175, HM175, CM238 Chipset. The Express-KL/KLE is specifically designed for customers who need excellent graphics performance and high-level processing performance in a long product life solution.
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Product
PICMG 1.3 Half-size CPU Card With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3, Xeon® E, Pentium® Or Celeron® Processor, Intel® C246/Q370/H310, SATA 3.0, USB 3.1 Gen1, LAN And DVI-I
SHB250R
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3, Xeon® E (C246), Pentium® or Celeron® processor*Intel® C246/Q370/H310 chipset*2 DDR4-2666/2400 SO-DIMM for up to 64GB of memory*Supports M.2 slot (C246/Q370)*Supports Intel® AMT and vPro (C246/Q370)*TPM 2.0 supported
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Product
PXI/PXIe RF Multiplexer, Single 4-Channel, Terminated Common, 3GHz, 50Ω, MCX
40-876A-101
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The 40-876A-101 (PXI) and 42-876A-101 (PXIe) are 50 Ohm 4 to 1 RF multiplexers with 1 bank in a single slot. Additionally, extra switching allows the common connection to be terminated into 50 Ohm, maintaining signal integrity. The module exhibits low insertion loss and VSWR through the use of modern RF relay technology at an affordable cost.
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Product
Robust DIN-rail Fanless Embedded System With 7th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor And Dual Modular I/O Expansion Design
ICO500-518
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The ICO500-518 featuring flexible I/O expansion, sufficient storage and network capability is well-suited for transportation, public utility, smart building, solar energy, as well as factory automation fields. By bundling Axiomtek’s intelligent AMS software solution for device monitoring and remote management, the ICO500-518 is able to implement environment signal monitoring, edge analytics and remote device management in the IIoT world. It has also passed the EN 50121-4 certified for railway applications. The rugged high computing edge gateway has scalable CPU options with the 7th gen Intel® Core™ i7/i5/i3 (codename: Kaby Lake-U) or Celeron® processors and supports one DDR4-2133 SO-DIMM slot for up to 16GB of system memory. The ICO500-518 features basic benefits whether low latency or cost efficiency; moreover, offering much more other advantages for IIoT applications. It not only supports multiple OT communication protocols that can significantly reduce the effort required to collect data from different field devices, but also provide local intelligence to allow operators respond faster to events that happen at the remote site and minimizes latency between edge devices and the cloud server. Also, with TPM 2.0, this IIoT edge gateway provides tailored levels of security depending on the application needs. Axiomtek’s ICO500-518 has two optional plug-in I/O module slots and four different types of I/O modules to meet different customization requirements. An integrator can choose from four available I/O modules including an 8-port GbE LAN module; 8-port isolated RS-232/422/485 module; 4-port isolated RS-232/422/485 with one isolated DIO (8-in/8-out) module; 8-port isolated CANbus 2.0A/B module to customize the ICO500-518 to fit its specific project requirements. Additionally, the ICO500-518 offers flexible communication options - two full-size PCI Express Mini Card slots and one external SIM card slot for 4G/3G, GPS, LoRaWAN, Wi-Fi and Bluetooth connections. Furthermore, it supports swappable 2.5-inch SATA drive and external CFastTM card to provide sufficient storage capability. For withstanding harsh operating conditions, this IP40-rated embedded box PC offers an extended operating temperature range of -40°C to 70°C, a wide range DC input of 12V to 48V with OVP, UVP, OCP, RPP power protection, and up to 3G vibration endurance.
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Product
2-slot Fanless Industrial System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® Q170, Front-access I/O, PCIe And PCI Slots
IPC962-512-FL
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The IPC962-512-FL is powered by the 7th/6th generation Intel® Core™ and Celeron® processors (codename: Kaby Lake/Skylake) with the Intel® Q170 chipset. It is equipped with dual DDR4-2133 SO-DIMM slots with up to 32GB system memory. The ultra-compact industrial computer supports two swappable 2.5" HDDs; moreover, it offers flexible expansion options with one I/O module slot and two PCI/PCIe slots. It also has a wide operating temperature range of -10°C to +60°C and a 24VDC (uMin=19V / uMax=30V) power input for severe environments. According to the features above, this rugged IP40 industrial PC is a great choice for a wide variety of Industrial IoT applications including automatic optical inspection, digital signage, motion control, and factory automation.
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Product
Fanless Embedded System With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, 4-CH PoE And MXM 3.1 Type A
eBOX671-521-FL
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The eBOX671-521-FL is a GPU computing embedded system that comes with 4-CH PoE and MXM 3.1 Type A slot for applications in machine vision, edge computing, traffic vision, deep learning, and artificial intelligence of things. The outstanding eBOX671-521-FL with enhanced GPU computing performance is powered by the 9th/8th gen Intel® Core™ i7/i5/i3 processor with up to six-core, Intel® Pentium® processor, or Intel® Celeron® processor and comes with Intel® Q370 or optional Intel® C246 chipset. The fanless embedded GPU-based system is equipped with dual DDR4 ECC/non-ECC SO-DIMM slots for up to 64GB of system memory. The embedded vision system has an optional MXM type A slot for NVIDIA GTX1030 and GTX1050 graphics modules to enhance the performance of the visual display. Furthermore, this Intel® Coffee Lake-based embedded box PC is specially designed with four Gigabit 802.3at (PoE, Power-over-Ethernet) compliant Ethernet ports with a total power budget of 60W, six USB 3.1 ports and two Gigabit LANs to connect different devices or sensors. It comes in great expansion possibilities, including one internal MXM 3.1 type A connector, two full-size PCI Express Mini Card slots and two SIM slots. For storage, it has two swappable SATA HDD drive bays with a height of up to 9.5 mm and one mSATA for RAID 0 and 1 feature. Besides, we have designed a flexible I/O window slot for incorporating application-oriented I/O functions to meet the requirements of various cases. This embedded vision computer can be mounted using wall or DIN-rail mounting for versatile use in various environments.
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Product
Fanless Embedded System With Intel® Core™ I5-7300U/i3-7100U & Celeron® 3965U, 2 HDMI, 2 GbE LAN, 4 USB 3.0 And PCI Express Mini Card Slot
eBOX560-512-FL
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The eBOX560-512-FL is powered by the Intel® Core™ i5-7300U/i3-7100U or Celeron® 3965U processor. To enhance system efficiency, the embedded box PC supports one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB system memory. Two HDMI ports with up to 4K resolution are supported for dual independent display applications. The palm-sized fanless embedded system is dedicated to smart factory automation, thin clients, industrial controller system, digital signage and retail equipment. Axiomtek's eBOX560-512-FL was designed to operate reliably in industrial and embedded application environments. It is enclosed in IP40-rated heavy-duty aluminum extrusion and steel enclosure and offers a wide operating temperature range from -10°C ~ +50°C (+14°F ~ +122°F) and up to 3G vibration endurance.
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Product
Fanless Embedded System With LGA1151 Socket 8th Gen Intel® Core™ & Celeron® Processor, Intel® H310, HDMI, DisplayPort, 6 USB, 2 COM And 8-CH DI/DO
eBOX640-521-FL
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3 & Celeron® processor (Coffee Lake)*Supports 2 COM, 6 USB and 8-CH DI/DO*Two 2.5" SATA drive bay*M.2 Key E 2230 for Wi-Fi*Front I/O connectivity design*12/19 to 24 VDC power input via DC-Jack*Flexible I/O window supported
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Product
11th Gen Intel® Core™ I5-Based Fanless Embedded Computer
EMP-510 Series
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- 11th Gen Intel® Core™ i5 BGA SoC processor- DDR4 SODIMM up to 64GB- FHD/4K/8K up to 4x independent displays- 2x GbE, 1x COM, 4x USB ports- M.2 2280 SSD- Wi-Fi 6/LTE compatibility
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Product
Computer With 8th Gen. Intel® Core™ I5 Processor, Built-In 8G DDR4 RAM And UL Class 1 Division 2
TPC-318WH
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Industrial-grade 18.5" WXGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i5-8365UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with PCAP touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Support TPM2.0 hardware security
























