Image Processors
algorithmically enhances image characterization.
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Product
8 Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - SFF Subsystem
Model 6353S
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- Complete RF converter and processing subsystem- Rugged and conduction-cooled- Ideal for integration into custom enclosures- Incorporates Xilinx® Zynq® UltraScale+™ Gen 3 RFSoC- 16 GB of DDR4 SDRAM- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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Product
Compact, industrial thermal imaging core
Dione 1024 OEM Series
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The Dione 1024 OEM Series is based on a state-of-the-art detector with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35x35x21.5 mm3 and the weight is 25 gr.All Dione 1024 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 1024 OEM series find application in safety & security, transportation and process monitoring.
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Product
Hyperspectral Image Processing Software for THz Imaging Data
ImageLab
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ImageLab is a one-of-a-kind image processing tool developed by our partner EPINA for the analysis of data from various spectroscopic imaging techniques such as THz, optical, UV/VIS, IR, Raman, or mass spectrometry. Based on multivariate statistical methods it enables the user to analyze and classify acquired hyperspectral images, to merge them with maps of physical properties and to overlay them with conventional high-resolution color photos. Visualization of the image data and highlighting of analytical information round up the software package to an indispensable instrument for in-depth analysis of spectroscopic image data. ImageLab is now part of Menlo Systems’ imaging extension TERA Image. Ask us for possibilities to upgrade your THz imaging system with our unique software tool!
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Product
Pico-ITX SBC With Intel® Pentium® Processor N4200 & Celeron® Processor N3350,HDMI/LVDS, GbE LAN And Audio
PICO316
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*Intel® Pentium® processor N4200 & Celeron® processor N3350*1 DDR3L SO-DIMM, up to 8GB*2 USB 2.0 ports and 3 USB 3.0 ports*PCI Express Mini Card slot with mSATA supported
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Product
AMD Ryzen™ Embedded 8000 Series Processor
AIMB-2210
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High-performance Zen 4 up to 8 cores/16 threads with AMD XDNA NPU and 96 GB DDR5 SODIMMAMD Radeon RDNA3 Graphics, up to 12 CUs and Quad 4K display supportSupports PCIe x8 Gen4, 3 x M.2 expansion slots, 6 x COM, 4 x USB 3.2 Gen2x1, 4 x USB 2.0Supports 12-24V wide voltage DC-InSupport Windows 11 LTSC & Ubuntu 24.04 LTS; SUSI API and WISE-DeviceOn
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Product
Intel® 5th Generation Xeon Processor, AMC
AMC752
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The AMC752 is a Processor AMC in a single module, mid-size based on the Intel® 5th generation Xeon (Broadwell). The efficient SoC design has low power consumption and integrated PCH technology. The module follows the AMC.1, AMC.2 and the AMC.3 specifications.
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Product
Single Processor COMe Carrier Board
NS11001
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LinkedHope Intelligent Technologies Co.,Ltd.
NS11001 is a single processor COMe carrier board based on the Intel® AtomTM N270 platform.The board size is: 200mm x 184mm.NS11001 supports both PCI bus and ISA bus in order to be compatible with customers’ legacy peripheral interface cards like MVB. In addition, it consists of a 10.4-inch external TTL LCD panel and a matrix keyboard interface.Bined with COMe module, NS11001 embedded platform using Intel mobile processor N270, 945GSE + ICH7M chipset, and the maximum power consumption at full load is 10W.The system displays interface provides up to 1600 * 1200 resolution display output, and has a variety of interfaces such as Gigabit Ethernet, UART, USB, PATA, etc.NS11001 supports extended working temperature and can be used in harsh environment.
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Product
Imaging & Analysis
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Microscopes offered by Buehler generally fall into the categories of stereo microscopes, upright microscopes, or inverted microscopes. Inverted microscopes are commonly referred to as metallurgical microscopes. Microscopes may offer episcopic (reflected light) observation, diascopic (transmitted light) observation, or both possibilities. Illumination may be delivered in bright field mode (BF) or dark field mode (DF), and several techniques such as differential interference contrast (DIC) and polarized light microscopy make use of the nature of light to reveal specific pieces of information when studying materials.
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Product
Ultrasonic Imaging System
USPC 3010
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Ingenieurbüro Dr. Hillger Ultrasonic-Techniques
Detects internal defects in new materials and metals. The wide frequency range up to 35 MHz enables highestresolution. A-, C-, and D-scans can be recorded. The imaging in B-scans is an option.
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Medical Imaging
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ams offers high-speed, low-noise and low-power sensing solutions that enable manufacturers of Computer Tomography (CT) equipment and digital X-Ray Flat Panel Detectors (FPD) to produce crystal clear images while exposing patients to low doses of radiation. We are taking our leading imaging sensing solutions and expertise forward to achieve an unprecedented level of image accuracy while enhancing convenience and safety for the user.
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Product
12th/13th/14th Gen Intel® Core™ Processor LGA1700
AIMB-278
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12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipsetDual channel DDR5 5600MHz, max. 96GB with two SODIMMsSuper Speed I/O: PCIe x16 Gen5 (32GT/s), USB3.2 Gen2 (10Gbps), 2.5GbEQuad independent 4K displays with 2 DP1.4, 1 HDMI, and 1 eDPRich expansion: M.2 M key for NVMe SSD, M.2 E key for wireless, 3 SATA(RAID 0,1,5)TPM2.0 supportWindows 10 LTSC & Ubuntu 22.04 LTS; SUSI API and WISE-DeviceOn
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Product
Imaging Colorimeter
C-Series
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RayClouds Photoelectric Technology Co.,Ltd.
C-Series Imaging Colorimeter is equipped with a scientific-grade large surface array CMOS sensor, cooperated with ProICM professional analysis software to detect various optical parameters of the two-dimensional imaging screen. Efficiently complete the data analysis of the measured parameters and optimize the product imaging quality, which is beneficial to improve the yield of finished products.
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Product
19" Fanless Panel PC With Intel® Atom™ X6425E Processor
PPC-419 EHL
Panel PC
19" SXGA TFT LCD with resistive (default)or projected capacitive(by request) touchscreenIntel® Atom™ x6425E quad-core, 2.0 GHz processorFanless, slim designSupports 1 x 2.5" SATA and 1 x M.2 B key slot for expansion1 x PCI/PCIe x1 expansion slotWide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F)Wide range DC support (9 ~ 32 VDC)1 x isolated RS-422/485 with automatic flow controlDual 2.5GBASE-T Ethernet supports Time-Sensitive Network(TSN) technology
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Product
Terahertz Gauging And Imaging
TeraMetrix
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TeraMetrix is Luna’s platform for terahertz gauging and imaging, using pulsed terahertz waves to provide precise measurement of single and multi-layer thickness, density, basis weight and caliper thickness.
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Product
hyperspectral imaging sensor
Hyper-Cam
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The Hyper-Cam is a lightweight and compact hyperspectral imaging sensor which uses Fourier Transform Infrared (FT-IR) technology. This advanced high-performance spectrometer allows to detect and identify substances either gases or solids from a distance of up to 5 kilometers. It provides real-time chemical imaging as well as unparalleled spatial and spectral information about the IR targets under measurement.
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Product
6U Processor Board
VP62107
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LinkedHope Intelligent Technologies Co.,Ltd.
VP62107 supports Intel® Xeon-D Processors up to D-1577(16x 1.3GHz). Based on Broadwell microarchitecture, Xeon® Processor D-1577 possessor has 16 computing cores sharing 24MB L3 Cache, and its base operating frequency is 1.3GHz. VP62107 also supports Intel Turbo (automatic overclocking) technology enabling CPU maximum operating frequency up to 2.7GHz. By using Turbo technology of VP62107, users do not have to increase the cost or complexity of the system configuration just to meet the demand of system peak computing performance.
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Product
Solino Imaging Module 10x12
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The Opto solino imaging module is a complete "computational imaging" vision sensor that uses Opto's own solino™ technology to display object anomalies as an image for digital or statistical processing.
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Product
Fluorescence Imaging
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A next-generation fluorescence lifetime imaging microscopy (FLIM) camera that simplifies FLIM for researchers and imaging centers by combining excellent light sensitivity with easy image acquisition and data analysis.
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Product
Dynamic Imaging Particle Analysis Technology
FlowCam® Macro
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Yokogawa Fluid Imaging Technologies, Inc.
Based on proven FlowCam dynamic imaging particle analysis technology, and optimized for larger particles (50μm to 5mm), FlowCam Macro provides rapid particle characterization that goes beyond just particle size. Direct, image-based measurements of particle size and shape enable differentiation of particle types in a heterogeneous mixture.
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Product
Debug probe for ARM Cortex processors
USB Multilink ACP
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P&E’s USB Multilink ACP is a debug probe which allows a PC/laptop access to JTAG/SWD on ARM Cortex devices from several manufacturers (see complete list below). It connects between a USB port on a Windows machine and the standard debug connector on the target. The product photos to the left of this page show how the headers can be accessed by simply flipping open the plastic case. Ribbon cables suitable for a variety of architectures are included. By using the USB Multilink ACP, the user can take advantage of the debug mode to halt normal processor execution and use a PC to control the processor. The user can then directly control the target’s execution, read/write registers and memory values, debug code on the processor, and program internal or external FLASH memory devices.
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Product
6.5" Fanless Panel PC With Intel® Celeron® N6210 Processor
PPC-306 EHL
Panel PC
Industrial-grade 6.5" VGA TFT LCD with LED backlightDurable true-flat touchscreen with 5-wire resistive touch controlIntel® Celeron® N6210 dual-core, 1.2 GHz, processorUp to 32 GB DDR4 SDRAMCompact, fanless design with IP66-rated front panelSupports expansion via M.2 slotSupports VESA 75 x 75 mounting holes
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Product
Reject Station for X-Ray Image Analyser
IV-110I
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IV-11OI is a reject station for X-Ray Image Analyser known for having an X-Ray Image Wire Defect Detection and a compact and space-saving dimension.
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Product
Cavium CN6880 Processor AMC
AMC738
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The AMC738 utilizes the 32 Core Cavium Octeon II Processor that combines with a Xilinx V7 (XC7VX690T) FPGA to provide 100GbE via the CFP2 module. The CFP2 module could utilize 4 x 25 Gbps lanes or 10 x 10 Gbps lanes. The module follows the AMC.1, AMC.2 and AMC.4 specification. The FPGA has a single bank of 64-bit wide DDR3 memory.
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Product
Architecture P4040/4080 Processor
VME-186
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Curtiss-Wright Defense Solutions
The VME-186 VME Single Board Computer is based on NXP's high-performance QorIQ P4080 SOC multi-core processor. With four or eight Power Architecture cores running up to 1.5 GHz, and up to 8 GB of high bandwidth DDR3 SDRAM, the VME-186 SBC provides processing and a variety I/O interfaces to satisfy the most demanding requirements of embedded computing.
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Product
TEM Lamella Preparation And Volume Imaging Under Cryogenic Conditions
ZEISS Correlative Cryo Workflow
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ZEISS Correlative Cryo Workflow connects widefield, laser scanning, and focused ion beam scanning electron microscopy in a seamless and easy-to-use procedure. The solution provides hardware and software optimized for the needs of correlative cryogenic workflows, from localization of fluorescent macromolecules to high-contrast volume imaging and on-grid lamella thinning for cryo electron tomography.
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Product
15.6" All-In-One Panel PC With Rockchip 3399 Processor
PPC-115W
Panel PC
True flat wide display screen with Pcap multi-touch.Embedded Rockchip RK3399 processor, Dual-core Cortex-A72 up to 1.8GHzOnboard 4GB LPDDR4-1333 memory, 32GB eMMC NAND FlashIP65 rated front panel protectionSupports VESA 100 and panel mounting(optional)Supports Android and Debian
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Product
Modular TPC - Computing Box Module With Intel® Core™ Processors (10th Gen)
TPC-B610
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High Performance Computing Box powered by Intel® 10th Gen. Core™ i CPU Socket (LGA1200) with fanless design6 x Panel Modules (IP66) ranging from 15" to 23.8" in selectionDual Channel Memory slots (DDR4) support up to 64GB in totalComprehensive I/Os, including 6 x USB, 2 x COM, 2 x RJ45...etcSupports Expansion via 1 x PCIe x16, 1 x mPCIe, 2 x M.2 (NVMe, SATA, 5G)Supports Storage via 2 x 2.5" HDD/SSD (RAID 0/1), 2 x M.2 (2242/2280)Supports Fieldbus protocols/GPS/GPRS/Wi-Fi capabilities via iDoor technologySupports Diverse system I/O, DIO, PoE...etc. via iDoor technologySupports TPM 2.0 hardware security
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Product
Extreme Rugged PC/104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM1-BT1
Single Board Computer
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Product
Micro-ATX Motherboard 8th/9th Gen Intel® Xeon® E3 Processor LGA1151
AIMB-586
Motherboard
Supports Intel® 8th/ 9th Gen Xeon/ Core™ i7/i5/i3 processor with Q370/C246/H310 chipsetFour U-DIMM sockets support up to 128GB DDR4 2400/2666 MHz SDRAMSupports HDMI2.0a(option),2 DP++,eDP/LVDS(option) displaySupports Intel AMT 12.0 and Intel vPro competentSupports PCIE Gen3, 4 USB3.1, 10 x USB2.0/USB 3.0, upto 4 x SATAIII and quad GbE LAN, M.2(M-key),M.2(E-key)Supports Software RAID 0, 1, 5, 10, TPM 1.2/2.0 (optional)Supports SUSI, WISE-DeviceOn and Edge AI Suite.
