Image Processors
algorithmically enhances image characterization.
-
Product
6U CompactPCI Processor Blades
-
A comprehensive line of 6 U CompactPCI computers to the embedded board market.
-
Product
3U CompactPCI Serial 9th Gen Intel Xeon®/Core™ i7 Processor Blade
cPCI-A3525 Series
-
CompactPCI® Serial (PICMG CPCI-S.0) is a new modular computer standard officially adopted by PICMG in 2011. The CompactPCI Serial standard defines a completely new connector to support high-speed serial interfaces including PCI Express, SATA, USB and Ethernet. A CompactPCI Serial backplane has six high-speed connectors P1 to P6 on the system slot but only P1 is mandatory on peripheral slots, P2 to P6 being optional. A CompactPCI Serial system can comprise a total of nine blades (one system blade and eight peripheral I/O blades) through an Ethernet full mesh or single star architecture. The CompactPCI® Serial standard is the next-generation of the CompactPCI® specification and provides more flexibility and higher speed and bandwidth in modular system solutions.
-
Product
SOSA-aligned, Rugged 3U VPX Processor Blade with Intel® Xeon® W-11000E
VPX3-TL
-
ADLINK VPX3-TL 3U VPX processor blade is powered by Intel® Xeon® W-11000E Series Processor, formerly Tiger Lake-H and delivers a greater than generational improvement in performance for enhanced data and graphics and the AI acceleration capabilities required for next-generation mission-critical applications. The SOSA-aligned design of the VPX3-TL module offers embedded computing capabilities that are easily reconfigurable and upgradable, highly cost-effective, and quick to develop and deploy.
-
Product
3U CompactPCI Quad-Core Intel Atom® Processor X Series Blade
cPCI-3640 Series
-
- Low power quad-core Intel Atom® x6413E Processor (formerly Elkhart Lake)- Up to 32GB DDR4-2400-3200MT/s ECC soldered memory- Optional onboard SSD support- Flexibility in IO selection- Extended temperature -40 to 85 degree C supported
-
Product
3U CompactPCI Intel® 6th Gen. Quad- Core™ Processor Blade
MIC-3332
-
MIC-3332 is using Intel® 14nm technology to provide significant performance and power efficiency. It provides an ideal solution for railway rolling stock, high-performance computing and military application. With its optimized design on EMC & thermal, it is available to meet or exceed EN50155.
-
Product
AdvancedTCA Processor Blade
-
Offer high-density processing power, faster data throughput, and intelligent system management.
-
Product
6U CompactPCI Intel® 6th Gen. Core™ i3/i5/i7 Processor Blade with ECC support
MIC-3399
-
- Supports 6th Generation Intel® Core™ i3/i5/i7 processors and Intel® CM236 PCH with embedded graphic (up to 3 independent displays)- Up to 32GB (DDR4-2133) memory (max 16GB on board, socket SO-DIMM x1, max 16GB)- Optimized dual-slot SBC with 2.5" SATA-III HDD/SSD, 2240 or 2280 M.2 socket, on-board Nandflash (optional)- Two SATA ports, two USB 3.0, six USB 2.0 ports, two DP ports, two COM ports, one PS/2, one Audio, one VGA and PCIe x8 interfaces to the Rear Transition Module (RTM)- Five Gigabit Ethernet ports including two PICMG 2.16 for front and rear connectivity- PICMG 2.16 R1.0, PICMG 2.1 R2.0, PICMG 2.0 R3.0, PICMG2.9 R1.0 compliant
-
Product
Dual Intel® Xeon® E5-2600 v3 Family 40G Ethernet AdvancedTCA® Processor Blade
aTCA-9710
-
- Two Intel® Xeon® processor E5-2600 v3 family (12C/24T)- 16 memory sockets support DDR4-2133 REG/ECC VLP RDIMM up to 256 GB- Intel® C612 PCH- Dual Intel® XL710-AM2 40GBASE-KR4 Fabric Interface channels- Support Intel® DPDK and Node Manager 3.0
-
Product
Rugged 3U VPX Intel® Xeon® and 9th Gen Core™ i3 Processor Blade
VPX3020
-
- Intel® Xeon® Processor E-2254MLand 9th Gen Intel® Core™ i3 (formerly “Coffee Lake-H Refresh”)- DDR4-2666 soldered ECC SDRAM up to 16GB- Optional SATA SLC SSD, up to 64GB- Up to PCIe x16 Gen3 interface supporting non-transparent bridge=
-
Product
6U CompactPCI 9th Gen Intel Xeon®/Core™ Processor Blade with Two PMC/XMC Sites
cPCI-6540 Series
-
- 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refresh)- Dual channel DDR4 ECC memory, soldered and SO-CDIMM, up to 64GB- Versatile storage: SSD, CFast, M.2- Dual PMC/XMC sites- Remote management and TPM support
-
Product
3U CompactPCI 9th Gen Intel® Xeon®/Core™ i7 Processor Blade
cPCI-3520 Series
-
The cPCI-3520 Series is a 3U CompactPCI blade available in single-slot (4HP), dual-slot (8HP) or triple-slot (12HP) width form factors with various daughter boards to provide a broad range of I/O requirements. Faceplate I/O in the single-slot (4HP) version includes 1x DVI-I, 2x GbE and 1x USB 3.0 port (these I/O are common to all versions). Faceplate I/O in the dual-slot (8HP) version includes additional 2x USB 2.0, 1x COM, 1x KB/MS and Line-in/Line-out on the cPCI-3520D or additional 2x DisplayPorts, 1x COM in RJ-45 connector, 1x KB/MS and 1x additional USB 2.0 port on the cPCI-3520G. Two more dual-slot options are the cPCI-3520L with additional 2x GbE, 1x COM and 2x USB and the cPCI-3520M with one 100-pin high density connector supporting additional 2x DVI-D, 2x USB 2.0, 2x COM, 2x KB/MS and Line-in/Line-out ports.
-
Product
3U CompactPCI Quad-Core Intel Atom® Processor Blade
cPCI-3620
-
The ADLINK cPCI-3620 Series is a 3U CompactPCI® processor blade featuring a quad-core 4th generation Intel® Atom SOC and soldered DDR3L-1333 ECC memory up to 4GB.
-
Product
3U CompactPCI Serial Intel® Xeon® W Processor Blade
cPCI-A3535 Series
-
- Intel® Xeon® W-11555MRE 6-Core processor- Max. 64GB DDR4-3200 by 2x SODIMMs- 80GB 3D Nand flash SSD in SLC mode- USB 3.2, USB-C and RJ-45 iAMT front panel service ports- 2x M12 2.5GbE front panel ports for on train use
-
Product
6U CompactPCI Intel® Atom® X6413E Processor Blade
cPCI-6660
-
The cPCI-6660 Series is a 6U CompactPCI single-board computer available in single-slot (4HP) or dual-slot (8HP) width form factors, powered by the Quad-core Intel Atom® x6413E Processor. The cPCI-6660 now supports dual-channel DDR4-2400-3200MT/s memory with In-Band ECC (IBECC) for enhanced reliability. It features a 5V power input, four 2.5GbE Ethernet ports (3x RJ-45 and 1x M12 X-coded), onboard iSLC, and offers flexible storage options, including an optional 2.5" SATA drive space or mSATA, configurable by BOM.
-
Product
6U VPX Dual Nodes Blade With Intel® Xeon® W-11865MRE
VPX6200
-
- Dual nodes, redundancy architecture- Intel® Xeon® W-11865MRE processor (formerly Tiger Lake-H) per node- M.2 2242 slot per node (upgradeable to 1TB by option)- VITA 46/48/65 compliant for quick deployment- Supports Windows 10 IoT Enterprise LTSC 21H2 and Linux (kernel 5.13 and higher)
-
Product
Intel® Xeon® E3 Quad-Core 10 Gigabit Ethernet AdvancedTCA® Processor Blade
aTCA-9300
-
The ADLINK aTCA-9300 is a high performance AdvancedTCAR (ATCA) processor blade featuring dual 4-core IntelR XeonR processor E3 1275V2 /1225V2, IntelR C216 Chipset, four channel memory up to 32 GB of DDR3 memory and 300 W power supply subsystem. Versatile connectivity includes dual 10GbE Fabric Interfaces, dual GbE Base Interfaces, quad front panel GbE egress ports, front panel dual COM and USB 2.0 ports and front panel VGA connector. An onboard SATA connector supports CFast up to 32 GB and the optional RTM (aTCA-R6270/R6280) supports an 8-channel mini-SAS port, dual 10GbE SFP+ ports, dual USB ports and dual hot-swappable SATA bays providing additional network throughput and storage capacities.
-
Product
Quad-Core Intel® Atom™ Processor 3U CompactPCI® Card
MIC-3329
-
The Advantech MIC-3329 is based on Intel® Atom™ technology, previously codenamed Baytrail and is designed to provide balanced performance and power efficiency. The MIC-3329 is a 3U CompactPCI® processor blade designed for dual-core Intel® Atom E3826/E3827 and quad-core Intel® Atom E3845 processors, and up to 4GB soldered DDR3L-1066/1333 ECC memory. It is available in single and dual slot form factor, offering a range of I/O functionality by XTM (8HP) & Rear I/O extensions. Front panel I/O on the single slot (4HP) provides 2 x RJ45 GbE ports (Switchable with RIO 4HP),1 x VGA port (Switchable with RIO 4HP), 1 x USB2.0 port and 1 x USB3.0 port. Front panel I/O on the second layer (XTM) provides 2 x COM ports (RS232/422/485), 1 x PS/2 KB/MS and 1 x Audio ports or 2 x M12 GbE ports, 1 x COM ports (RS232/422/485). The MIC-3329 provides an ideal solution for transportation, railway and factory automation applications. Its robust design from a layout and thermals perspective allows it to meet or exceed EN50155 and EN50121-4 using a very low TDP selection of 7W/8W/10W processors. Its low power consumption and industrial SoC features make the MIC-3329 a perfect fit for all fanless system applications.
-
Product
6U CompactPCI 6th/7th Gen Intel® Xeon® E3 and Core™ i3/i7 Processor Blade
cPCI-6636(KL) Series
-
The ADLINK cPCI-6636 Series is a 6U CompactPCI® processor blade based on the 6th/7th Generation Intel® Xeon® E3 and Intel® Core™ i3/i7 Processors with Intel® HM170 or CM236 Chipsets. The cPCI-6636 supports up to 16GB onboard DDR4-2133 memory and 16GB DDR4-2133 via SODIMM. Total memory capacity is up to 32GB of DDR4-2133. The cPCI-6636 is a highly integrated processor blade fit for mission critical applications in industries ranging from automation to defence.
-
Product
Rugged Conduction Cooled 3U CompactPCI Processor Blade with Quad-Core Intel® Atom™ Processor
CT-3620
-
The ADLINK CT-3620 Series is a Rugged Conduction-Cooled 3U CompactPCI processor blade in single-slot (4HP) width form factor featuring a quad-core Intel® Atom™ SoC and soldered DDR3L-1333 ECC memory up to 4GB. Graphics is integrated graphics on the CPU and storage is provided by an onboard 32GB SSD. Rear IO signals include 2x GbE, 1x USB 2.0, VGA, 2x COM, and 1x SATA 3Gb/s, providing for expansion with an optional Rear Transition Module (RTM).
-
Product
AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
-
- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
-
Product
Thermal Imaging
JOHO272
-
Wuhan JOHO Technology Co., Ltd
With innovative design and superior functions, this thermal weapon sight sets a new standard to build in an eye-safe laser ranger finder which you can get target distance very easily. The thermal aiming and laser ranging scale line would be changing smaller as distance further so that the shooter would easily and quickly lock target even in a further distance. To improve shooting percentage, as many as ammunition drop chart can be input to the sight program. Should any drop chart be selected, the sight would automatically generate a new shooting scale line after program calculating temperature, angle, wind speed, altitude. Different button size and battery convex design friendly for shooter night us
-
Product
Digital Imaging
-
No one camera does it all. ACCU-SCOPE offers a wide selection of cameras for a variety of applications, and our experts can help you find the best match for your specific need. We have solutions from brilliant brightfield to low-light fluorescence, and from imaging living, moving specimens to fixed stained sections on slides. Need help deciding? Just ask!
-
Product
In Vivo Imaging
-
Introducing two NEW systems in the IVIS® Lumina™ preclinical in vivo imaging instrument family, the IVIS Lumina S5 and the Lumina X5. The IVIS Lumina S5 2D optical imaging system combines high sensitivity optical and patented spectral unmixing capabilities in a high-throughput system. The IVIS Lumina X5 has all the features of the S5 with integrated high-resolution x-ray.
-
Product
Imaging Colorimeter
C-Series
-
RayClouds Photoelectric Technology Co.,Ltd.
C-Series Imaging Colorimeter is equipped with a scientific-grade large surface array CMOS sensor, cooperated with ProICM professional analysis software to detect various optical parameters of the two-dimensional imaging screen. Efficiently complete the data analysis of the measured parameters and optimize the product imaging quality, which is beneficial to improve the yield of finished products.
-
Product
Thermal Imaging
-
Is a sophisticated and non-invasive technique that utilizes infrared technology to detect heat emissions from various objects.
-
Product
Thermal Imager
testo 865
-
The testo 865 thermal imager combines all the important properties required for high-quality thermographic measurement it is accurate, robust, fast and reliable. The testo 865 provides high-quality thermography at an affordable price and keeps going even in tough working conditions. The case supplied with the thermal imager means it can be conveniently transported, so it is always there for you when needed.
-
Product
Terahertz Imagers
T-SENSE
-
The Terahertz imager T-SENSE ® visualizes enclosed hazardous substances precisely in letters as well as small parcels safely and effectively.The process is safe, fast and without risk to the health of the user. Unlike conventional visualizing processes such as x-ray technology, the T-SENSE ® functions on the lower Terahertz frequency level with safe millimeter waves that enable non-transparent materials to be illuminated.
-
Product
Processors
-
Intel sets the industry standard for processor innovation and performance, powering laptops, desktops, workstations and servers—for business and personal use, immersive gaming, content creation, IoT, Artificial Intelligence, and more. Explore the range of options here.
-
Product
Imaging Modules
-
Teledyne e2v has developed compact MIPI modules which feature our own high performance CMOS image sensors inside a pre-focused, industrial-grade scanning optic. As a turnkey sensor/optics for imaging systems, these modules offers customers significant reduction in development time and cost savings. Only a few screws are needed to mount the module, with simple connection to the image processing system through an FPC cable connector. Software development efforts can also be reduced by using some limited API-layer Linux software drivers. This enables the module to be seamlessly interfaced to popular ISP platforms.
-
Product
Thermal Imaging Camera
-
Zhejiang ULIRvisionTechnology Co., LTD
A thermal imaging camera is a device that uses infrared and thermal imaging technology to convert the image of the temperature distribution of the target object into a visible image through detecting the infrared radiation of the target object and applying signal processing and photoelectric conversion. The thermal imaging camera accurately quantifies the actual detected heat and images of the entire object in real-time in the form of a surface, thus accurately identifying the suspected fault area that is heating. The operator initially judges the fever condition and the fault location through the image color and hotspot tracking display function displayed on the screen of the thermal imaging detector, and strictly analyzes it, thereby embodying high efficiency and high accuracy in confirming the problem.
