Image Processors
algorithmically enhances image characterization.
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Product
2U 19” Edge Server with Intel® Xeon® Scalable Silver/Gold Processors for 5G MEC Infrastructure Deployment
MECS-7211
MEC Server
The MECS-7211 Edge Server focuses on the edge of 5G networks to provide an open, white box platform for 5G Open RAN, private 5G networks, and a wide range of 5G MEC applications including smart cities, retail, manufacturing, autonomous vehicles, Argument Reality(AR), virtual reality(VR) and healthcare. The MECS-7211 is designed to meet stringent requirements by delivering a high level of deployment flexibility, reliability, scalability, and carrier-grade processing performance further augmented by hardware expansion. With a 450mm system depth in a small footprint 2U chassis, all I/O front access, wide operating temperature support (-5°C to +55°C), and PCIe expansion slots reserved for access to acceleration hardware such as GPU, FGPA and QAT adapters, ADLINK’s MECS-7211 is a high performance COTS platform that meets varying application and deployment requirements, and enables customers to focus on differentiating their end solutions.
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Product
12" Fanless Panel PC With Intel® Celeron® J6412 Processor
PPC-312 EHL
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Industrial-grade 12" XGA TFT LCD with 30K backlight lifetimeDurable true-flat touchscreen with 5-wire resistive/projected capacitive touch controlIntel® Celeron® J6412 quad-core, 2.0 GHz, processorUp to 32 GB DDR4 SDRAM1 x RS-232, 1 x RS-232/422/485, 2 x USB 2.0, and 2 x USB 3.1Compact, fanless design with solid aluminum alloy enclosure and IP66-rated front panelSupports E-key for wireless moduleSupports expansion via M.2 slotSupports Windows Embedded Linux and Android OS
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Product
Industrial ATX Motherboard with 8th/9th Gen Intel® Core™ i9/i7/i5/i3 or Xeon® E Processors
IMB-M45
Motherboard
ADLINK IMB-M45 ATX industrial motherboard supports the 8th/9th Generation Intel Core i9/i7/i5/i3 and Xeon E3 processor in the LGA1151 package, and the Intel C246 chipset. This model supports ubiquitous high-speed data transfer interfaces PCIe 3.0, USB 3.1 Gen2 and SATA 6 Gb/s (SATA III), with dual-channel DDR4 2400/2666 MHz ECC or non-ECC memory up to 128 GB in four DIMM slots.
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Product
Hyperspectral Imaging Sensors
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HYPERSPEC® sensors are line-scanning instruments (sometimes called pushbroom) that collect reflected light through an image slit. One row of spatial pixels is collected per frame as motion occurs, with each pixel containing full spectral data. Motion can be accomplished in two ways: either as an airborne deployment (UAV, aircraft, or satellite) or stationary (where motion is accomplished beneath the sensor, such as a food inspection line). A third option is also available where pan-and-tilt or rotary stages allow a fixed-location sensor to scan a stationary object (such as a piece of artwork, or a mine face for geological applications).
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Product
Preclinical Imaging
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Bruker offers advanced preclinical imaging solutions for a broad spectrum of application fields, such as oncology, neurology, cardiology, inflammation, infectious diseases, cancer research, functional and anatomical neuroimaging, orthopedics, cardiac imaging and stroke models.
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Product
21.5" Fanless Widescreen Panel PC With Intel® Core™ I5-7300U Processor
PPC-3211W
Panel PC
21.5" true-flat Full HD LCD panel with projected capacitive touchscreen, anti-glare coatingIntel® Core™ i5-7300U(default); i7-7600U/i3-7100U(optional) processor with fanless system designSupports PCIe x4 or PCI expansion1x isolated RS-422/485 with auto flowWide input power range (9 ~ 32 VDC)Dual Gigabit Ethernet with IEEE1588 support3x Independent displays1x M.2 bay (2242) for storage only & 1x TPM 2.0 internal support (optional)No RED Certification
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Product
Fanless Embedded System With LGA1151 Socket 7th/6th Gen Intel® Core™ & Celeron® Processor, Intel® H110, HDMI, DisplayPort, VGA, 6 USB, 4 COM, PCI Express Mini Card Slot And 10 To 30 VDC
eBOX640-500-FL
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The eBOX640-500-FL is powered by the 7th generation Intel® Core™ i7/i5/i3 and Celeron® processor families. It features dual DDR4-2133 DIMM sockets with up to 32GB of system memory, and provides a wide choice of front-accessible I/O interfaces for easy cabling and maintenance. It supports an extended operating temperature ranging from -10°C to +55°C, a wide voltage range DC power input from 10 to 30 VDC with power protection, and up to 2G vibration endurance, enabling a reliable and stable operation in harsh environment. The superior Intel® Kaby Lake-based fanless embedded box PC can support three independent high resolution displays and 4K resolution, offering high quality imaging.
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Product
3.5" Embedded SBC With Intel® Atom® X5-E3940 Processor, HDMI, LVDS, 2 GbE LAN And Audio
CAPA311
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*Intel® Atom® x5-E3940 processor*1 DDR3L SO-DIMM for up to 8GB of memory*2 USB 2.0 and 4 USB 3.0*2 full-size PCI Express Mini Card slots
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Product
OSM R1.1 Size-L Module Based On NXP® I.MX93 Series Processor
OSM-IMX93
Computer on Module
The OSM-IMX93 is an OSM R1.1 Size-L module featuring NXP® i.MX93 series processor with 2-core Arm Cortex-A55 & M33. With its in-SoC Arm Ethos U-65 microNPU, the module is made for edge solutions needing on-device AI processing at ultra-low power.
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Product
COM Express Type 10 Mini Module With Intel® Atom® X5 And X7 Processor
CEM310
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The CEM310, a COM Express Type 10 Mini module, supports Intel® Atom® x5 and x7 processors (codename: Apollo Lake) in a board size of 84mm x 55mm. It has 8GB of DDR3L onboard memory and an optional 64GB eMMC memory. The Intel® Atom®-based COM Express Type 10 Mini module comes with a variety of I/O and expansion options including four PCIe x1 lanes, one Gigabit LAN port with Intel® i210IT Ethernet controller, two USB 3.0, eight USB 2.0, two SATA-600, four digital I/O channels, HD Codec audio, one DDI, one LVDS, one LPC, one SPI, two serial TX/RX and one I2C to meet customer requirements. Aside from the rich I/O options, the CEM310 has a wide voltage input range of 4.75V to 20V to meet the varying voltage input requirements for automotive or transportation applications. In addition, it supports an extended operating temperature range from -20ºC to +70ºC or optional -40ºC to +85ºC to ensure stable and reliable operation in harsh environments. The CEM310 supports watchdog timer, hardware monitoring functions, SMBus as well as smart battery (optional).
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Product
COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)
Express-SL/SLE
Computer on Module
The Express-SL/SLE is a COM Express® COM.0 R2.1 Basic Size Type 6 module supporting the 64-bit 6th Generation Intel® Core™ and Xeon® E3-and Celeron® processors (codename "Skylake-H") with IntelR QM170, HM170, CM236 Chipset.
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Product
Configurable Processor Modules
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Cyclone FPGA based configurable processor modules for embedded control and measurement applications.
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Product
Extreme Rugged PC/104-Plus, PCI-104 Single Board Computer with Intel® Atom™ Processor System-on-Chip
CM3-BT4
Single Board Computer
The CMx-BTx is a PC/104-based, Single Board Computer (SBC), fully compliant with the PCI-104 Specification, Version 1.1 and partially compliant with the PC/104 Specification, Version 2.6. PC/104 SBCs are very compact and highly integrated computers. This SBC features the 22nm, Intel® Bay Trail SoC. The board provides a DDR3L SO-DIMM socket, a PC/104 connector, a PCI-104 connector, two USB 2.0 ports, one USB 3.0 port, up to two Gigabit Ethernet ports, up to two SATA 3 Gb/s ports, one dedicated HD-Audio panel connector, one VGA port, one LVDS port, up to four COM ports, one mini-PCIe slot (with one USB 2.0 port included). The CMx-BTx can be run with only 5 volts and is capable of running operating systems like DOS, Windows XP/7/8 in either 32-bit or 64-bit configuration, Linux, VxWorks, and others. Another feature included on the board is a fail safe BIOS that enables the user to start the module even if the original BIOS is corrupted.
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Product
FPGA Signal Processor
372
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The Model 372 is designed around the Texas InstrumentsADS42LB69 16-bit ADC and the Analog Devices AD9788DAC. The 250 MHz sample clock is supplied by either theon-board frequency synthesizer or an external source. Thefrequency synthesizer can be phase locked to the local10 MHz TCXO or an external reference can be used toachieve system-wide phase coherence.
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Product
COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
Computer on Module
ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
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Product
2D CMOS Image Sensor
Lince6M5
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Lince6M5 is a single chip, fully digital, high speed CMOS active pixel sensor which is designed for maximum flexibility. It has excellent performance in a large variety of applications, ranging from low noise, high dynamic range surveillance, to high speed slow motion analysis, including high resolution machine vision applications. Lince6M5 incorporates a high speed 6.5MP CMOS active pixel image sensor providing both global and rolling electronic shutter, as well as High Dynamic Range (HDR) features. The sensor array utilizes active CMOS pixels with pinned photodiodes to deliver high image quality whilst maintaining the size, cost, and integration advantage of the CMOS technology.
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Product
2U Rackmount Network Application Platform Base On Intel 12th/13th/14th Gen Intel® Core Processors. Ideal For Data Center Deployments.
FWA-4134
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12th/13th/14th Gen Intel Core Processors, up to 24 Cores/32 Threads, Hybrid Performance & Efficiency Cores4 x DDR4 3200MHz ECC UDIMMs, up to 128GB4/8 x Advantech network module expansions1x Mini-PCIe slot1x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2/4 x 3.5” HDD bays
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Product
Mini-ITX SBC With LGA1151 9th/8th Gen Intel® Core™ I7/i5/i3 Processor, DisplayPort++, VGA, EDP, USB 3.0, M.2 And Dual GbE LAN
MANO523
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*LGA1151 9th/8th gen Intel® Core™ i7/i5/i3 processor*Intel® Q370 chipset*2 DDR4 SO-DIMM for up to 32GB of memory*4 USB 3.0 and 4 USB 2.0*6 COM ports*2 SATA-600 and 1 M.2 Key M*PCIe x16 and M.2 Key E
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Product
COM Express Compact Size Type 6 Module with 6th Gen Intel® Core™ i7/i5/i3 and Celeron® 3955U Processors (formerly codename Sky Lake)
cExpress-SL
Computer on Module
The cExpress-SL is a COM Express® COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 6th Generation Intel® Core™ i7/i5/i3 and Intel® Celeron® Ultra-Low TDP processors (formerly Sky Lake-U") with CPU, memory controller, graphics processor and I/O hub on a single chip. Leveraging the benefits provided by the 6th generation Intel® Core™ and Celeron® System-on-Chip, the cExpress-SL is specifically designed for customers who need optimum processing and graphics performance with suitable power consumption using Intel® Configurable TDP in a long product life solution.
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Product
LS1046A Processor AMC, PCIe
AMC708
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The AMC708 is a Processor AMC (PrAMC) in a single module, mid-size AdvancedMC (AMC) form factor based on the NXP LS1046A (quad core) processor. The unit provides PCIe Gen3 on Ports 4-7 or 8-11 per AMC.1.
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Product
Medical Box PC Featuring The 12th/13th/14th Gen Intel® Core™ I3/i5/i7/i9 Processors, With Support For MXM-AXe Based On Intel® Arc™ GPU, And Thunderbolt™ 4 Port
MLB-3102 with Intel MXM GPU
Industrial Computer
- ADLINK MXM-AXe graphics module support (type A, up to 50W TDP based on power supply)- 12th/13th/14th Gen Intel® Core™ i3/i5/i7/i9, Celeron® processor- Dual SODIMM for up to 64GB DDR5 non-ECC memory (depending on CPU)- 1x HDMI 2.0, 5x DisplayPort (1 from CPU, 4 from MXM)- 1x M.2 E-key supporting 1630 or 2230 for Wi-Fi/Bluetooth module, 1x M.2 M-key supporting 2242 or 2280 for SATA/PCIe storage module, 1x M.2 M-key supporting 2242 or 2280 for NVMe & frame grabber- Reliable Molex 24V DC-in connector- 2x 2.5GbE Intel® I225-LM Ethernet Controller- 2x PCIe Gen 3 x4 expansion slot for full-height, half-length add-on card, each slot is 25W power budget and additional Molex 4-pin power cable (12V/1.5A and 5V/2A) support
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Product
Computer With 8th Gen. Intel® Core™ I5 Processor, Built-In 8G DDR4 RAM And UL Class 1 Division 2
TPC-318WH
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Industrial-grade 18.5" WXGA TFT LCD with 50K lifetime and LED backlight8th Gen. Intel® Core™ i5-8365UE quad-core processor with built-in 8 GB DDR4 SO-DIMMDual channel memory slots support up to 64G in totalCompact, fanless embedded system with aluminum alloy front bezel and chassis grounding protectionTrue-flat touchscreen with PCAP touch control and IP66-rated front panelSupport expansion via Full-size Mini PCIe and two M.2 slots (NVMe, 5G)Support TPM2.0 hardware security
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Product
ATX Motherboard With LGA1151 Socket 8th Gen Intel® Core™, Xeon® E Processor, Intel® C246, USB 3.1 Gen2, SATA 3.0, PCI Express Mini Card Slot, VGA, DisplayPort, DVI-D, And HDMI
IMB525
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*LGA1151 socket 8th gen Intel® Core™ i7/i5/i3, Xeon® E, *Pentium® or Celeron® processor (Coffee Lake)*Four 288-pin DDR4-2666/2400 ECC DIMM for up to 64GB of memory*DisplayPort, DVI-D, HDMI and VGA with triple-view supported*6 SATA-600 with RAID 0/1/5/10*1 PCI Express Mini Card slot (optional)*2 USB 3.1 Gen2 and four USB 3.1 Gen1*TPM 2.0 supported (optional)
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Product
Signal And Image Processing Research
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TPAC solutions are ideal for research in signal processing applied to ultrasound. You need to be able to access to any parameter, implement a particular algorithm, and access to any data during the acquisition or postprocessing phase. TPAC provides you all of these. It can be applied to studies in signal processing, image processing, beamforming, machine learning, etc… Thanks to TPAC’s open platforms, you will be able to freely set the ultrasonic sequences, record the raw data from your experiment, and test your own algorithms or even method. In order to adapt to a wide variety of habits, TPAC proposes multiple APIs (Application Programming Interface) compatible with Matlab, C++, Python, C#, Labview and working under Windows or Linux operating systems. Through a socket, it is even possible to use any OS of your choice.
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Product
Data Acquisition Processor Board
DAP 5000a
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When your application needs Pentium-powered real-time processing under Windows, choose the DAP 5000a. Even at maximum sampling rates, the combination of a fast processor with low latency allows computation in real time between samples – and on-time response for control applications.
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Product
17" SXGA Elkhart Lake Thin-Client Terminal With Intel® Atom™/ Celeron® Processor
TPC-317 EHL
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Intel® Elkhart Lake (EHL) Atom™ x6425E 2.00 GHz quad-core / Celeron® J6412 2.00 GHz quad-core processor with 4 GB DDR4 SDRAM.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Wide operating temperature range (-20 ~ 60 °C/-4 ~ 140 °F).Front-facing LED indicators to show operating status.Built-in Advantech iDoor technology, SSD/HDD bay and VESA mount.Compact, fanless system with aluminum alloy front bezel and chassis grounding protection.Supports Advantech’s SNMP Subagent software.Supports Advantech’s WISE-PaaS/RMM remote management software.
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Product
Image Sensor/Fingerprint-on-Display Testing
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Enli Tech provides the most advanced optical and non-destructive inspection technology, which can de-convolute the digital images back to the analog properties, such as quantum efficiency, spectral response, system gain K, Dynamic Range (DR), PRNU, DRNU, Linearity Error LE, and Chief-Ray-Angle (CRA). The testing solution can be applied to CCD and CMOS image sensors in aerospace, defense, and scientific camera field. Image sensor packages that can be tested by Enli Tech’s systems include bare wafers, dies, chips, or camera modules. Our image sensor testers can help users reduce the sensor-modules or camera-modules development time and RD budget.
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Product
Qseven Module With Intel® Atom® X5 And X7 Processors
Q7M310
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*Intel® Atom® x5 and x7 processor (Apollo Lake)*8GB DDR3L memory onboard*4 lanes of PCI Express slot*2 SATA-600*2 USB 3.0 and 4 USB 2.0
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Product
3.5” Embedded SBC With Intel® Pentium® N4200 & Celeron® Processor N3350, EDP, 2 HDMI, 2 GbE LANs And Audio
CAPA315
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The CAPA315 is powered by the Intel® Pentium® processor N4200 or Celeron® processor N3350 (codename: Apollo Lake). It comes with various I/O connectors and flexible expansion features within its 146 x 104 mm dimensions. The CAPA315 also has an extended operating temperature range of -20°C to 70°C to withstand the rigors of day-to-day operation. The 3.5-inch CAPA315 has one 204-pin DDR3L-1867 SO-DIMM for up to 8GB system memory. Furthermore, it comes with one RS-232/422/485, three RS-232, two USB 2.0, four USB 3.0, 8-channel digital I/O, HD Codec audio and dual Gigabit LANs with Intel® i211AT Ethernet controller. For storage requirements, it has one SATA-600 and one mSATA. Moreover, the low power embedded platform runs on +12VDC power, supporting auto power-on. For connectivity, this embedded board has a PCI Express Mini Card slot for 3G/4G, GPS, Wi-Fi and Bluetooth connections. To ensure reliable operation across platforms, the 3.5-in embedded board also supports watchdog timer, hardware monitoring functions and Trusted Platform Module 1.2 (TPM 1.2).
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Product
Quantitative Optical Gas Imaging System for GF620/GFx320/GF320
FLIR QL320
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The QL320 is a quantitative optical gas imaging (QOGI) system that allows surveyors to measure the leak rates for methane and other hydrocarbons. This eliminates the need for secondary sampling with a toxic vapor analyzer or similar tool. In addition, the QL320 does not require close contact with the gas in order to measure emission rates, making it a safer solution for quantifying difficult-to-measure gas leaks.
