BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Product
SoC Test System
V93000 SoC / Smart Scale
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Advantest’s V93000 Smart Scale generation incorporates innovative per-pin testing capabilities. Each pin runs it own sequencer program for maximum flexibility and performance, for example in multisite applications. Full test processor control ensures time synchronization between all card types, like digital, Power, RF, mixed signal and so on. The user benefits are reduced test time, best repeatability and simplified program creation. The system design makes it easy to extend your configuration with new modules and instrumentation, as your test needs change.
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Product
Test Sockets
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Smiths Interconnect offers a wide range of spring contacts and design standards for high quality test sockets providing flexibility and fast delivery for optimal cost/performance ratio.
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Product
Test Socket Lids
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For handler setup or hand test, a manual lid is often required as part of the test hardware set. We have refined our standard offerings so that with each socket you can receive a lid designed specifically for your application from one of five standard lid form factors
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Product
Universal Test Socket Receptacle
Series 6556
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Universal Test Socket Receptacle. The Aries Universal Test Socket Receptacle is sturdy, open frame, and easily mounted to PC boards. Allows for easy replacement of Aries and other manufacturers test sockets. A choice of four collet pin styles makes the receptacle useful for any interconnection method.
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Product
EBIRST 50-pin D-type To 25-pin D-type Adapter
93-005-414
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eBIRST is a range of USB controlled test tools capable of performing automated path resistance tests on Pickering Interfaces PXI, LXI or PCI controlled switching solutions. Each tool simply interfaces with the switching system's connector so a test can be run using the supplied Windows-based software.
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Product
LTE RRM Test System
T4010S
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The T4020S LTE RRM tester is the Keysight platform for LTE RRM conformance testing of LTE UEs. T4020S belongs to the Keysight LTE product family and, as the other LTE T4000S test platforms, is based on the T2010A LTE Wireless Communications Test Set.
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Product
PCIe 2.0 Test Platform
PXP-100B
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The Teledyne LeCroy PXP-100B Test Platform provides a convenient means for testing PCIe 2.0 add-in cards with a self-contained portable and powered passive backplane. The PXP-100B provides power required for both cards under test, and an interposer can be used for connection to a protocol analyzer. As an alternative to an interposer, the PXP-100B includes two mid-bus probe footprints to allow connection to an analyzer via a mid-bus probe.
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Product
Custom Test Connectors and Sockets
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Custom test sockets are traditionally expensive to build and maintain. To reduce these costs, consider: Using rapid prototyping techniques to build a housing. Using replaceable Z-Axis Connectors. Depending on board layouts and compressed height, these sockets or test fixtures can achieve high numbers of mate/de-mate cycles and operate at GHz frequencies.
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Product
BGA SMT Adapters
Giga-snaP™
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Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for attaching BGA chips to target board. The product line consists of patented female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board thus interconnecting the chip and the system is ready to go. The SMT adapters have the same solder ball types as the chips they are emulating. These adapters have less than half of the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times. A complete description and drawings of Giga-snaP™ 0.75, 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapters can be found at the tables shown below.
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Product
Build-to-Print for Test Systems
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Built-to-print / test system replication addresses your internal capacity and capability constraints. Ball Systems has perfected quoting, procurement, planning, assembly, testing, quality, delivery and installation to ensure your testers are on-time and on-budget, and meet design and production standards while keeping open and transparent communication.
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Product
PXI Semiconductor/IC Test System
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A high-density 100MHz PXIe digital IO card designed for characterizing, validating, and testing a variety of digital and mixed-signal ICs. Each IO card consists of a Sequencer Pattern Generator (SQPG) and 32 channels of full ATE-like features. The 33010 IO card is expandable up to 256 channels. Some unique features of the 33010 include an on-board SQPG, per pin timing/levels/ PMU/TFMU, multiple time domains, and multithreaded testing for complex IC testing. Each channel is also equipped with 64M vector memory, 16 timing sets with on-the-fly timing change, and per pin timing and frequency measurements up to 400 MHz.
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Product
Fixture Kit 600x455mm RCV 8-slot for 6TL34
AG588
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Stopper kit includedYAVCANCON2 for fixture identification not included
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Product
Automotive Ethernet Test Fixture
AE6941A
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The AE6941A automotive Ethernet electrical test fixture provides easy access to automotive Ethernet electrical signals so you can perform conformance testing and device characterization quickly and easily.
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Product
Fastest In-Circuit Test Platform
TestStation
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Teradyne’s TestStation in-circuit test systems provide electronics manufacturers with reliable high-quality, high-volume testing for the latest printed circuit board assembly (PCBA) technologies that are used in automotive, industrial, computing, consumer, communications, and defense end-products.
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Product
Combination Board Functional Test System
QT 4256 ATE
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Qmax Test Technologies Pvt. Ltd.
QT 4256 ATE is a combination Board Functional Test System , a main frame Automated Test Equipment (ATE) which can be configured up to maximum of 1280 Bi-directional digital channels ideal for testing circuit card assemblies of high level of complexity and whether it is a legacy or new generation PCB.
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Product
6TL19 Off-Line Base Test Platform
H71001900
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The 6TL19 is a bare half-rack with castors for creating Off-Line, modular, flexible and reliable Base test platforms. The overall rack capacity is 11U (580mm depth).
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Product
High Throughput Test Platform for Multi-Site & Index Parallel Applications
ETS-88
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The ETS-88 is an optimal test platform for testing a wide variety of devices including: simple analog, high precision, high voltage, high current / power, automotive, video, audio, complex mixed-signal, as well as emerging power processes like SiC and GaN.
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Product
PXI Digital Test Instrument
PXIe-6943
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Conduct pattern-based digital tests incorporating the latest parallel, digital, serial, and bus protocols with the PXIe-6943 digital test instrument.This instrument is TPS-compatible with the legacy VXI digital test instrument from Astronics as well as other instrument vendors.
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Product
Photodiode Burn-in Reliability Test System
58606
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The Chroma 58606 PD/APD Burn-in system is a high density, multifunction and temperature controlled module based system for photo diode burn-in and lifetime test. Each module has up to 256 Source Measurement Unit channels which can source current and measure voltage in various scenarios such as one described below. The system can accommodate 7 modules for a total of 1,792 device channels.
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Product
Test Port Cable, 1 Mm
11500L
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Connect test ports to devices, fixtures, or probe tips with this 24-cm cable featuring a return loss of 16 dB minimum.
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Product
Benchtop Automated Functional Test
midUTS
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Combining bench-top portability with powerful automated test functionality, the midUTS is an extremely versatile yet cost-effective solution for your electronics functional test needs. Comprised of high-performance commercial-off-the-shelf (COTS) instruments, along with Bloomy’s medium-density signal-routing PCBAs, a built-in or USB-connected PC, and a pair of high-integrity, production-grade cables connected to an adjacent benchtop fixture, the midUTS can be used in engineering for PCBA bring up, as well as scaled to manufacturing to perform high-volume PCBA and sub-assembly functional testing. It is also ideal for depot diagnostic test, debug, and repair of field returns. The two mass-interconnected cables connect the midUTS to as many as 320 test points on the unit under test (UUT), supporting an extreme wide variety of products using bed-of-nails as well as cable-connected UUT test fixtures. Most importantly, the midUTS helps you automate sequences of functional tests using NI TestStand and the Bloomy EFT Module for TestStand. This ideal balance between powerful features and affordable cost allow you to automate earlier in the product development lifecycle, substantially increasing product quality and minimizing time-to-market!
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Product
Semiconductor Testers
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Our integrated team of semiconductor test innovators delivers a complete system tailored to achieve your specific objectives, incorporating:Test strategyHardware designSoftware development and integrationManufacturingInstallationProgram managementOngoing support
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Product
BGA Socket Adapter Systems
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Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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Product
Wireless Device Test
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New wireless standards, in addition to rising wireless usage, are increasing wireless device complexity while lowering price expectations. To counter rising costs, manufacturers require test systems optimized for efficiency.
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Product
EMI Test System
TS9975
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The R&S®TS9975 is the base system for conducted and radiated EMI measurements. Due to its modular design, it covers a wide range of applications and can be very easily adapted to the measurement task at hand. Any configuration is possible – from conducted measurements and the small precompliance system with a compact test cell to the accredited test system for large equipment under test. Combinations of different applications or incremental expansion are easily possible.
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Product
Test Socket Based Elastomeric Matrix Connectors
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Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Product
BGA Rework Station
PDR IR-D3 Discovery
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The system is tool free, gas free, instantly/precisely controllable, clean, modular, upgradeable and produces 100% yield BGA rework without any complications. It provides the extremely high levels of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, CSPs, QFNs, Flipchips and is ready for 0201 and lead-free applications.
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Product
MultiSite Test sockets and Wafer Level
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multi-site sockets include anything from strip test sockets to test sockets for wafer test to multi-position, singulated devices. The advantages of these sockets can be enormous as test time can be decreased by a factor of ten over conventional one up testing. In most cases, the throughput is only limited by tester capabilities and/or handling capacity.
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Product
Test System Optimized for High Volume Production Testing of Integrated Circuits
ETS-364 / ETS-600
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The ETS-364 is a general-purpose precision analog and mixed-signal test platform designed for high volume production testing of integrated circuits; optimized for high throughput applications with a fully integrated multisite software and hardware architecture. The test system offers separate floating resources for each site, improving site isolation and measurement accuracy coupled with digital instrumentation enabling the most efficient, high-volume testing available. The system supports up to 240 analog pin channels, and offers 133 MVPS digital vector rate with up to 128 digital pin channels. Eagle's scalability includes the ability to double the capacity of an ETS-364, providing more than 480 analog pin channels and up to 256 digital I/O pin channels with the ETS-600.
