BGA Test Sockets
Ball Grid Array package test connection between BGA and board.
See Also: Test Sockets, Burn-In Sockets
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Lens Module Test Platform
The Lens Module Test Platform is a flexible solution to deliver the quality that is expected from your brand for all types of lenses and cameras. The system can be configured to measure objective, eyepiece or camera lenses. As the platform can efficiently measure lenses as small as 2 mm3, it is perfect for the critically precise applications of life sciences, consumer electronics, automotive and other industries. With 25+ years of quality experience, the Lens Module Test Platform ensures that all products shipped to market work as intended.
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Asynchronous System Level Test Platform
Titan
The Titan System Level Test (SLT) platform delivers maximum flexibility, scalability and density in semiconductor test environments that require the highest levels of system performance testing. Titan is Teradyne’s solution for high-volume mobile application processor SLT requirements.
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Socket Probes
A lot of companies build test sockets. But only our test sockets are populated with our own proprietary probe technology, developed internally. This assures you that when you purchase one of our test sockets, you are using the most advanced interconnect available.
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Universal SOIC ZIF (Zero-Insertion-Force) Test Socket
Series 547
Universal SOIC Zero Insertion Force Test Socket. Devices with up to 44 pins can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Accepts SOIC gull-wing and J-lead devices, up to 44 pins on .050 [1.27] lead pitch, body widths from .150 to .600 [3.81 to 15.24].
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Camera Module Socket
Designed for application to all SMD type products, compact camera module clamshell socket provides a connector clip embodying precision in contact, a total interface solution.
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Plug And Socket Torque Test Machine
Shenzhen Chuangxin Instruments Co., Ltd.
Plug Torque Tester/Device is for compliance is checked by engaging the device, as during intended use, with the socket-outlet of a test apparatus. Plug Torque Tester is a device provided with pins intended to be introduced into fixed socket-outlets shall not impose undue strain on these socket-outlets.
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Aspen Sockets
Ironwood Electronics’ Aspen line of sockets are designed in standardized stepped footprint configurations, incorporating industry standard high performance spring pins. Sockets can be designed to work with any type of IC package; BGA – LGA – QFN – DFN and even leaded devices where you have minimal space to fit a socket in place of your device to allow fast, easy testing and development.
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DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Benchtop Communication Test System
ATS3000A
The ATS3000A is designed using Astronics Test Systems’ proven Synthetic Instrumentation architecture. Featuring 23 instruments, and both Automated and Standalone modes to test, record, and diagnose faults, the unit provides complete RF, Analog and Digital capabilities. The ATS3000A also includes the sophisticated IF and baseband I/Q Digital Signal Processing required for modern radios. The fieldupgradeable, software-defined architecture features easy-touse graphical user interfaces and enables testing with minimal operator intervention. Test Program Sets areavailable for a full range of tactical radios, or you can create new TPSs easily using the included TestEZ® software suite.
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Automated Multi-Functional Tester
QTouch 1408 C
Qmax Test Technologies Pvt. Ltd.
QTouch 1408 C – Automated Multi-Functional Tester with in-built camera is designed to make automatic image capturing and probing of electrical signals with ease and speed especially in PCBs with high density/high pin count device that are mounted on the PCB. It is designed to move on X, Y, Z directions making it possible to probe every component as close as 20 mils. Easy tagging feature allows the user to get the real time XY coordinates using the library information with minimal intervention. CAD import feature is available for Auto Test Generation/to extract the XY coordinates from the CAD data. Qmax Automated Multi Functional Tester can perform Board level functional test of a PCB and guided probe / Back tracking diagnostics utility to reliably test Digital, Analog and Mixed Signal PCBs and fault isolation to the PCB level or component level.
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19inch 43U Heavy Duty Test Platform
6TL28
The 6TL28 is a bare rack for creating Off-Line, modular, flexible, and reliable Base test platforms. The overall rack capacity is 43U (640mm depth).
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Fully-Automated CTIA-Compliant OTA Test System
TS8991
The R&S®TS8991 OTA performance test system measures the spatial radiation and sensitivity characteristic as specified by CTIA and 3GPP.The system software provides ready-to-use test templates for OTA measurements and supports all wireless standards.The integrated report function collects all measured test data such as graphics or numeric results, test environments, EUT information and hardware setup in one document.
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Socket Saver
4690
The Technobox PMC Socket-Saver permits cost effective volume testing of PMC modules when used with Technobox P/N 3390 ?PMC to PCI adapter for Test.? It may also be used to reduce wear and tear on Technobox P/N 1518/1523 (?Extender/Preprocessor?).
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Test Sockets
QFN/QFP
For today’s chipscale packages, finding the right socket solution can be challenging. With SC™ sockets from Ardent, you can count on the right design, the best performance, and quick turns for even the most challenging custom designs
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LGA Sockets
We’ve taken our QFN expertise and combined it with the versatility and performance of the H-Pin® to leverage an LGA socket platform that serves the demanding requirements of today’s market. Plastronics LGA sockets using the H-Pin provide a high-performance socket that is affordable for all burn-in operations. These LGA sockets meet the power, temperature and signal performance needs of the higher density, larger package outline, and sometimes mix-pitch LGA designs. The LGA platform serves package sizes from as small as 2.0mm X 2.0mm to the industry’s largest standard socket for 60.0mm X 60.0mm packages.
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Write!BEFORE Socket Programmer
Socket Adapters are printed circuit boards that connect the programming sites to the base unit. The Socket Adapter (SA) includes the appropriate socket (DIP, SDIP, SOIC, QFP, BGA) and the appropriate electrical connections for programming a specific device.
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Test Sockets
socket design as per customer specificationsquick + easy socket changehigh-performance spring probesdesigned for high frequency up to 16 GHz-55C/-67F to 150C/302F temperature rangemanual/automatic application optionssmall socket footprintone socket base for each insert (3x3 to 9x9 QFN)one-click switch from engineering to production socket modedevice dependent standard socket frame with changeable insertmore than 500,000 compression cyclesKelvin test applicabilitytool-free insert + actuator exchanges0.3 mm minimum lead pitchQFP extender available
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IEC60884 Fig22 Plug Socket Covers Pendulum Impact Test Apparatus
CX-BC22
Shenzhen Chuangxin Instruments Co., Ltd.
IEC60884 fig22 plug socket covers pendulum impact test apparatusMeet the standard: IEC884-1 Figure 22-26,, IEC60068-2-75Uses: Suitable for household and similar plugs and sockets, wall mounted mounting boxes, screw glands, covers, switches and other electrical accessories for mechanical strength test
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Boundary-Scan DIMM Socket Tester
ScanDIMM
Maximizing test coverage is an important piece in test procedure development. Unfortunately, not all designs have the necessary requirements in place to accommodate boundary-scan test methods on memory devices. ScanDIMM digital socket test modules are designed to overcome such limitations when testing DIMM sockets utilizing boundary-scan test techniques.ScanDIMM modules provide the capability to instantly turn any DIMM socket into a fully compliant IEEE-1149.1 device. Integration is as simple as assigning the included BSDL file to the reference designator of the target socket and compiling test vectors.In multi-socket systems, multiple ScanDIMM modules can be linked to provide even greater boundary-scan test depth.
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Test Fixture
N1295A
The Keysight N1295A Device/Component Test Fixture provides a low-cost solution to quickly and easily test packaged devices and components. For more advanced packaged testing needs, the Keysight 16442B Test Fixture provides more capabilities.
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Test Sockets
Yamaichi Electronics Co., Ltd.
A test socket is the ideal point to test your home’s internal phone wiring for faults. You can also use it to identify any potential faults with the phone line outside. Your test socket is located in your master socket. It is the point between the internal phone wiring in your house and the phone line outside. That means by plugging into your test socket you can bypass all the internal wiring and test your device directly on the phone line.
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Socket Accessories (Thru-Hole Options)
The male pin adapter consists of standard high temperature FR4 with pressed in terminal pins and threaded inserts for mounting the socket. The top side of adapter has gold plated pads to receive socket interconnect and the bottom side has 0.006″ to 0.018″ diameter pin tails. These pins can be soldered to the plated thru holes in the target board. Then socket can be mounted to the threaded insert.
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BGA Rework Station
PDR IR-E6 Evolution
The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
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Socket Accessories (SMT Options)
The SMT adapter consists of standard high temperature FR4 with plugged via technology, eutectic SN63PB37 solder balls or SAC lead free solder balls and threaded inserts for mounting the socket. The top side of adapter has SMT pads to receive socket interconnect and the bottom side has appropriate solder balls for corresponding pitch. This FR4 adapter with balls can be soldered to the SMT pads in the target board. Then socket can be mounted to the threaded insert on the FR4 adapter.
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Socket Tester c/w Buzzer
DL1090
Clear visual and audible indication of wiring status LED indication of a wide range of wiring conditions Designed to EN 61010 and IP30
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NI Semiconductor Test Systems
The STS delivers the openness and flexibility of the NI PXI platform to the semiconductor production environment. For easy integration into the production test cell, the STS comes with features such as handler/prober integration, spring probe device under test interfacing, STDF data reporting, and system calibration.
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Fixture Kit 600x455mm RCV 8-slot for 6TL34
AG588
Stopper kit includedYAVCANCON2 for fixture identification not included
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Tester, US Mains Socket
72-6861
The 72-6861 is a Receptacle Tester with 3-indicator light. 2nd-Amber indication for ground contact (Open ground) and 3rd-amber indication for neutral contact (Open neutral) not connected, for hot and ground contacts interchanged indication by red and amber. If 2-amber indication occurred, receptacle is wired correctly.
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In-line High-Density ICT System Series 7i
E9988GL
The E9988GL Keysight i3070 Series 7i Inline High-Density In-Circuit Test (ICT) system brings industry-leading ICT technologies into your automated manufacturing line, saving resources and optimizing your automated test strategy.





























