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ASIC
Application Specific Integrated Circuits are application specific custom made ICs.
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Microelectronic Services
Services for ASIC houses and Integrated Device Manufacturers are IC Wafer / Final Test, IC assembly, Test Program development, product engineering, Flash / EEPROM programming, characterisation / capability studies, yield enhancement, design verification and failure / yield analysis. Das Test Haus are specialists for wafer test, low power, mixed signal and eeprom test.
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IF/RF Receivers
IF and RF Receivers are designed for communications infrastructure applications. Wide input bandwidth and high sample rates allow digitizing close to the antenna. Various receiver architectures, such as zero-IF, IF sampling to direct RF receivers, are supported and available on chip post digital signal processing can be used to offset demands in the FPGA or digital ASIC and ease analog filtering.
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Pressure Sensors
ESCP-MIS1 Sensor
ES Systems has developed a series of medium isolated pressure sensors suitable for applications with harsh environmental conditions where resistance to corrosive fluids or gases is required. Each sensor integrates a MEMS capacitive pressure sensor die, and a CMOS ASIC for the signal conditioning. The MEMS pressure sensor dies are underpinned by ES’s innovative microfabrication process for silicon capacitive sensors.
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Constraints Certifier Platform
ConCert
ConCert is a sign-off platform providing a unique system for verification, demotion and budgeting of timing constraints at any stage of the ASIC or FPGA flow.
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Ultrascale FPGA PCIe Board
SE100 – Solar Express
Sundance Multiprocessor Technology Ltd.
SE100 is based on Xilinx’s Virtex Ultrascale FPGA XCVU190-2FLGC2104E, and is a powerful processing card with plenty of IO capabilities to meet the needs of modern compute-intensive applications such as Supercomputing, Data Centers and defense. The board can optionally be populated with 095, 125, and 160 devices in C2104 package for reduced cost. Host interface is via 8 lanes of PCIe Gen3 but the card can also be used as an embedded, standalone, hardware too. Multiple cards can be cascaded to provide a multi-FPGA system with cards connected together via the board’s fast IO channels to meet the needs of even more demanding applications like ASIC design and Stock Market fast trading systems.
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Component Test and Analysis Laboratories
The Component Test and Analysis team specializes in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.
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Development Switch
TTESwitch Lab Space
The TTESwitch Lab Space supports laboratory testing efforts of Time-Triggered Ethernet applications; user development costs can be reduced by using the internal TTESwitch Controller HiRel ASIC that is also used in flight equipment. With advanced features like speeds of up to 1 Gbit/s, flexible physical layer configuration and three supported traffic classes, it is the optimal switching solution for a large variety of application areas. TTEthernet is a fault-tolerant, real-time communication protocol for safety-relevant systems integrating Ethernet and TTEthernet data flows onto one physical infrastructure.
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360 EC-FPGA
Functional correctness of FPGA synthesis from RTL code to final netlist. Systematic design errors, introduced by automated design refinement tools, such as synthesis, can be hard to detect, and damaging if they make it into the final device. Formal equivalence checking has been used for ASIC design flows for many years. As FPGAs become bigger and critical system components, exhaustively verifying the functional equivalence of Register Transfer Level (RTL) code to synthesized netlists and the final placed & routed FPGA designs is mandatory.
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Transducer / Transmitter
General purpose industrial pressure transducer provides outstanding integrity concerning high shock, vibration and pressure cycling. Utilizing high-performance ASIC, digital compensation provides excellent temperature performance, while the thin film sensor enables long-term stability.
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Digital Oscilloscope
MSO/DS7000
The MSO/DS7000 series digital oscilloscope is a mid-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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ARM Development Studio 5
DS-5
ARM DS-5 is the tool-chain of choice for software developers who want to fully realize the benefits of the ARM Architecture. Comprising features such as the best-in-class ARM Compiler, powerful OS-aware debugger, system-wide performance analyzer, and real-time system simulator, DS-5 is an integrated development environment that assists engineers in delivering optimized and robust software for ARM processor-based ASICs and ASSPs.
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3U VPX Flash Storage Module
Curtiss-Wright Defense Solutions
The 3U VPX (VITA 46 and 48.2) Flash Storage Module (FSM) provides high-performance, high-capacity, solid-state SATA storage with AES-256 bit encryption using an Application Specific Integrated Circuit (ASIC) that is FIPS-140-2 validated (Certification #1472). The 1" pitch conduction-cooled solid state storage device utilizes high reliability SLC NAND flash designed for the most demanding application.
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Digital Oscilloscope
MSO8000
The MSO8000 series digital oscilloscope is a mid- to high-end mixed-signal digital oscilloscope based on RIGOL's proprietary intellectual property ASIC chip and UltraVision II technology platform.
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The Intel® RealSense™ Depth Sensing Portfolio
Intel® RealSense™ offers a range of stereo vision cameras and modules, supported by an extensive open-source SDK. The D400 product line helps you ensure that you can add robust three-dimensional vision capability to your products or systems. The cameras feature an integrated ASIC that performs real-time depth calculation directly on the camera, saving you processing resources on the host system. The SDK allows you to further tune the depth data stream to your needs.
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Power Management
Menlo’s family of custom power management ASICs are designed to make the Ideal Switch even easier to use, opening up new applications and markets.
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Rad-Hard ASIC Platforms
STMicroelectronics, a leading supplier of digital CMOS technologies, is bringing differentiation by developing advanced deep-nanometer radiation hardened technologies dedicated for the Space, Aerospace and High-Rel & Defense markets.
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Electrical Testing Services
Integra provides extensive experience with complex test development: Digital & Mixed Signal Devices: Microprocessor, Microcontrollers DSP, ASIC. Linear: DAC, ADC, Operational Amplifier, Comparator, Multiplexer, Interface, Discrete. Memory: SDRAM, DDR, SRAM, SSRAM, Flash, EEPROM, EPROM. Logic: 74xxx, 16/32-bit, ECL. RF, 8GHz typical and experience to 50GHz: PA, LNA, Filter, Mixer. Expertise in developing test plans (semi mfgr production & device characterization)
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Centralized Motion Controller
ADLINK‘s pulse train controllers provide comprehensive and application-oriented motion functions for servo and stepper motors through digital signal processing (DSP)-based and Application Specific Integrated Circuit (ASIC)-based two pulse train mode controllers to achieve excellent synchronous motion control and precise positioning suitable for laser engraving, marking and cutting applications in semiconductor, AOI, and conventional manufacturing industries.
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PCI Express IP
Rambus silicon-proven, high-performance PCI Express® (PCIe®) 6.0, 5.0, 4.0 and earlier generation digital controllers are optimized for use in SoCs, ASICs and FPGAs. These market-leading solutions for high-performance interfaces address AI/ML, data center and edge applications.
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Analyze RTL
ASICs and FPGA routinely have millions of gates with memories, transceivers, third party IP and processor cores. Problems can be time consuming and complex to debug in the lab and through simulations. Designers need verification tools that can identify problems quickly to reduce their verification and debug time before simulation, before synthesis, and definitely before burning chips in the lab.
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Hybrid Verification Platform
HES-DVM
HES-DVM™ is a fully automated and scalable hybrid verification environment for SoC and ASIC designs. Utilizing the latest co-emulation standards like SCE-MI or TLM and newest FPGA technology, hardware and software design teams obtain early access to the hardware prototype of the design. Working concurrently with one another they develop and verify high-level code with RTL accuracy and speed-effective SoC emulation or prototyping models reducing test time and a risk of silicon re-spins.
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Brick Power Module Test
Modern servers, workstations, and telecom equipment often use an Intermediate Bus Architecture (IBA) powered by isolated DC/DC converters known as "brick" modules. These brick converters step down the input voltage to a lower DC bus voltage, enabling designers to implement efficient, high-density, non-isolated Point-of-Load (POL) regulators that power components such as microprocessors, FPGAs, and ASICs on system boards. With smaller voltage step-down ratios now common, designing POL regulators has become more straightforward. Brick modules are so named for their standard physical formats (1/4 Brick, 1/2 Brick, Full Brick, etc.), making them easy to integrate and replace.
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Universal PMICs
PowerArchitect™ design and configuration software speeds development and significantly reduces overall time-to-market compared to legacy analog power solutions. An I²C interface and multiple GPIO pins ensure easy system integration. Configurable warning and fault levels, fault behavior and power up and down sequencing ensure any load can be properly powered and protected. The power system design can be completed with confidence long before the final revision of the SoC or ASIC is available.
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Functional Testing
Functional Ethernet testing is done during the research and development phase of a product or service. It can cover many parameters depending on the DUT and the application. Using Xena’s products, your range of functional Ethernet testing includes:*Multicast*40/100G PCS and PMA Layer*Transparent Transport*Energy Efficient Ethernet (EEE)*Microbursts and random IFG*Synchronous Ethernet*Automotive Ethernet*1588v2 Performance Testing*Regression testing*Kernel drivers and NIC testing*Hardware emulation (ASIC*)
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I/O Expanders and Level Translators
ST’s Xpander family of general-purpose input/output port expanders are used to interface digital ASICs via a two-line bidirectional bus (I²C) . ST’s dual-supply level translators are used as interface between multi-voltage chipsets and system I/Os, ranging from 5.5 V down to 1.2 V.
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Custom & ASSP
Offering innovative SoC, SiP, ASIC, audio/video ASSP and other custom solutions and foundry services across a wide variety of applications in the automotive, industrial, medical, and aerospace & defense markets.
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Power Bead Inductors
Power bead inductors are typically used in high current multi-phase voltage regulators that power processors, memory modules and high current ASICs and FPGA in a wide range of applications including servers, graphics cards, storage and data centers. The construction consists of a ferrite core assembled over a 1T or 2T winding and which allows for extremely low DCR, high peak current and low AC losses. Pulse has single phase, integrated phases and coupled inductor versions. Our high volume manufacturing enables us to produce components that are cost-effective while maintain exceptional quality and reliability.
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Complete IP Module
Scan Ring Linker SRL
The Scan Ring Linker SRLTM - is a complete IP module that can be easily embedded into a CPLD, FPGA or ASIC on a PCB to reduce the complexities and costs of designing 1149.1 (JTAG) test infrastructure for designs that use multiple scan rings. The SRL IP module links any number of scan rings (secondary scan paths) into a single high-speed test bus, which permits devices on secondary scan chains to be independently tested and configured through a single 1149.1 external interface.
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nductive Proximity Sensors
Millions of inductive proximity sensors are currently in use in virtually all industries. They detect metal objects without contact, and are characterized by a long service life and extreme ruggedness. With the latest ASIC technology, SICK's sensors offer the ultimate in precision and reliability. SICK can provide the right solution to meet your requirements every time – from cylindrical or rectangular standard sensors with single, double or triple operating distance, to special sensors for explosive zones and harsh environments. Our sensors are the intelligent, reliable route to implementing industry-specific and customized solutions to any task involving automation.
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Function Generators
Waveform : Sine, Triangle, Square, Pulse, Sawtooth, Ramp 0.2Hz-150MHz EXT Frequency Counter(Option : 1:6 GHz or 2.7GHz) Self made insert ASIC Function : Total, RPM, Period, LPF, COUPL(AC/DC), ATT(X10) Fast,High-Resolution, 8Digits LED display Internal or External AM,FM Modulation Internal or External Burst and Linear Sweep Countrol from 1 : 1 to 100:1 TTL/CMOS Leveled Square Wave Output Maximum Attenuation of 20 dB cna be obtained Output impedance : 50 INPUT SENSITMTYKHz Range : 100mVms, MHz Range : 300mVms SWEEP WIDTH : Variable from 1:1 -100:1 RATE : 0.5Hz - 50Hz(20ms-2s) INTERNAL : Linear Bilt-in 5digits Green LED display
