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Defect
other than specified, imperfection .
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Reject Station for X-Ray Image Analyser
IV-110I
IV-11OI is a reject station for X-Ray Image Analyser known for having an X-Ray Image Wire Defect Detection and a compact and space-saving dimension.
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Armature Tester
Qingdao AIP Intelligent Instruments Co., Ltd
This tester is suitable for online or offline detection of various armature electrical properties, such as power tool motors, garden tools, vacuum cleaner motors, small household appliance motors, automobile motors, fitness equipment motors, permanent magnet micro-motors, etc. The tooling of the tester meets the requirements of arbitrary placement of the armature, and can automatically and accurately sort/track faulty solder joints; the equipment startup methods include buttons, remote control, and sliding cover; it meets the armature test of special processes such as double insulation, and automatically identifies solder joints, winding short circuit/open circuit , winding errors, poor welding and other problems; the tester can also automatically count the number of tests, the number of defectives and other data, which is convenient for quality management analysis.The tester test items mainly include:bar-to-bar resistance, diagonal resistance, welding resistance, insulation resistance, ac hi-pot, surge.
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Ultrasonic Immersion Probes
SONOSCAN I
The SONOSCAN immersion transducers for Non-destructive Testing (NDT) are mainly used to test metals and plastics for the smallest material defects. For example, binding defects, welding defects or cracks and pores in metal parts can be detected. The powerful, robust ultrasonic probes can be connected to all common ultrasonic testing devices. Due to variable designs and sizes, the immersion probes guarantee optimal use. In addition to ultrasonic standard pobes, we also offer customized transducers according to your individual specifications.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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Metrology Solutions for Semiconductors
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
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Defect Inspection System
F30
The F30 System boasts a five-objective turret that enables the resolution-throughput flexibility required by today’s multi-process inspection applications. Equipped with an advanced productivity suite (waferless recipe creation, simultaneous FOUP, recipe server and tool matching), the F30 System redefines inspection cost of ownership expectations.
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Receptacle Tester
RT500
Designed to detect the most common wiring problems in standard 120V receptacles.Test for correct wiring, open ground, reverse polarity, open hot, open neutral, hot and ground reversed.Conditions NOT indicated: Quality of ground, multiple hot wires, combinations of defects, reversal of grounded and grounding conductors.Large light indicators for greater visibility.Reinforced prongs for increased durability.Push-pull design with slip-resistance ribbing.Made in USA of U.S. and imported parts.
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Manufacturing Defects Analyzer (MDA)
TR518 SII DRAWER
*The DRAWER Type is the new Manufacturing Defect *Analyzer (MDA) platform.
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Non- Destructive Testing
NDT
Non-destructive testing (NDT) is an application of industrial radiography that uses X-rays to reveal defects in manufactured products or structures. Fujifilm NDT systems share digital X-ray innovations with our Fuji Computed Radiography (FCR) imaging systems.
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Metallurgical Testing Services
BMP Testing and Calibration Services Inc.
Metallurgical testing is a crucial part of metal processing and manufacturing and is used in almost every industry — aerospace, shipbuilding, steel, construction, and many others. It involves the use of a wide range of techniques and equipment to identify the material type, potential defects, and processing errors.
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T8090 Dual Absolute Leak Tester
The Dual Absolute.The new Dual Absolute technology makes it possible to eliminate the disadvantages of a classic differential system, improve its advantages and renew an industry that has been standing still for decades. Thanks to the new Dual Absolute technology, ForTest has combined the simplicity of a classic absolute decay system with the precision and sensitivity of a differential system, bringing leak testing instruments to a level never seen before.The new algorithms and measurement hardware eliminate typical defects in a differential system, such as differences in stabilization between the test part and the reference sample.The new range of instruments is able to work in 3 different ways: Pure Differential, Dual Absolute and Central Zero.The new Dual Absolute technology is so powerful and reliable that ForTest has decided to stop developing the classic differential system.
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Vibration Testers
Analyzes vibration patterns within mechanical systems or individual components and structures to identify defects and evaluate the test object's overall condition.
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Surface Paint Quality Scanner
Konica Minolta Sensing Americas, Inc
There is always a challenge to achieve a consistent high quality surface on a car body during production. The goal of the manufactures is to reduce defects and, quickly and accurately fix the ones that occur.
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High-precision Surface Inspection for Wind Turbine Blades
waveCHECK™
8tree's waveCHECK is a handheld-portable 3D-inspection tool for inspecting wind turbine blades in manufacturing and operation. Its efficient detection of surface defects and instant visual feedback revolutionize surface inspection.It can detect wrinkles, steps, gaps, rain erosion and any other surface damage.
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Front-end
With geometries getting smaller, macro inspection becomes both more challenging and crucial for defect-free and high-yield wafer manufacturing. The variety of defects calls for detection optimization, fast screening and categorization of the high volume manufacturing environment, while maintaining high throughput.
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Defect Inspection Module
EB40
The Class 1 certified E40 and B40 modules (available separately or combined in one module) can automatically detect defects on the entire edge, from zone 1 to 5, and the entire backside. The ability to inspect the entire backside allows for faster root-cause analysis of zone 5 defects since such defects can migrate from the wafer interior.
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Partial Discharge Testing Equipment
AR700
PD Defect Location in High-Voltage Equipment Insulation by Acoustic Sensors To act on deteriorating insulation the source of PD must be known.The insulation defects produce partial discharges, which emits electrical impulses, radiation of electromagnetic waves as well as acoustic signals.The AR700 measures acoustic signals with multiple sensors spread over the transformer. Then the software determines the failure location using the time difference of all incoming signals. Finally, these coordinates are shown in a 3D model of the transformer. AR700 device is used for measuring of acoustic signals on the external surfaces of gas-insulated breakers and substations, power transformers and other tank high-voltage equipment. The acoustic signals are caused by partial discharges in the insulation, which is the sigh of the defects.The advantage of “AR700” device is the quick installation of the acoustic PD sensors on the external surface of high-voltage equipment tank. The sensors have magnetic holder that is why there is no need to de-energize the equipment for the sensors installation. “AR700” device has 4 syn-chronic channels for acoustic signal measurement. This gives the possibility not only to find the defects in the insulation, but also to locate them. The location function of the “AR700”device is unique for acoustic devices.
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Portable Eddy Current Flaw Detectors
Portable eddy current (EC) flaw detectors inspect metallic parts and perform highly reliable and advanced flaw detection of surface and near-surface defects. Olympus offers portable eddy current equipment to meet a broad range of applications, including the detection of surface or near-surface defects, and the inspection of bolt holes.
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Monitroing and Control
THANKS TO OUR ADVANCED DATA ANALYSIS FUNCTION AND EASY-TO-VIEW USER INTERFACE, YOU CAN IMPLEMENT SPC WITH VERY LITTLE EXTRA WORK. OUR MONITORING SOLUTION IS DESIGNED TO IMPROVE THE TRACKING THE DEFECT AND CAN BE EASILY CORRELATED WITH YOUR MANUFACTURING PARAMETERS FOR ROOT-CAUSE ANALYSIS.
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Automated Optical Inspection (AOI)
TR7700 SIII 3D
TRI’s ground breaking 3D AOI solution delivers the fastest hybrid PCB inspection combining optical and blue-laser-based true 3D profile measurement for the highest automated defect symptom coverage possible. Integrated state-of-the-art software solution and third generation intelligent hardware platform offer stable and robust 3D solder and component defect inspection and with high inspection coverage and easy programming.
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FTIR Microscopes & Imaging Systems
Agilent's FTIR imaging systems and microscopes deliver superb imaging sensitivity at high spectral and spatial resolutions in applications such as polymer defect analysis, measurement of live cells in water, and the determination of chemical changes in tissues without staining. The Cary 610 is a single point FTIR microscope for accurate mapping, while the Cary 620 is a Focal Plane Array (FPA) chemical imaging system, featuring innovative optics that deliver outstanding levels of detail.
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Power Line Purpose Tester
LX-221A+
Shenzhen Lian Xin Technology Co., Ltd.
·Meet UL, VDE, CSA, SAA, T-MARK, KS. IRAM, CCC and other countries’ standards .·Used to test single – ends ,double –ends ,three-ends power supply cords.·Auto and continuous test in COND,Insulation Resistance ,Leakage Current, Line-to-line Hi-pot(inside HV), Leaking copper(outside HV), relative length,·Auto test the fine and detective goods, tested qualified ones can be be ejected by ejector pin and marked , automatic cutting defective products， and alarmed with voice prompt and light,·Provide with RS 232 interfaces, can communicate with PC, easy to upgrade,·Provide personalized customization according to different requirements.
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Contour Check Shape
Contour Check Shape has proven itself in hot rolling of long products and is an essential part of the rolling process in many factories. It checks hot and cold steel profiles with the help of three-dimensional surface reconstruction. Thus, it records geometrical errors due to rolling defects including surface defects like scale seams, shells or roller outbreaks.
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Complex of Visualization and Image Recording for a Video Microscope
To develop a complex for visual inspection of electronic components (other micro-objects) in order to identify visual defects, record the resulting image and transfer information for processing.
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Defect Isolation
*Traverse through the physical design to trace nets and vias down to the defect location*Utilizes industry standard LEF/DEF design files, scan-based test information, tester fail logs and diagnostic reports to determine and isolate the physical defect location*Enables the user to leverage their diagnostic experience to determine the root cause of the defect*Interactive layout viewer displays scan chains, mapped mismatches of scan cells, layers, nets and subnets with search capabilities(component, net, cell)*Physical XY coordinates are always displayed for components and nets to guide the user through the design to quickly identify suspect sites for FA using techniques like Emission, OBIRCH, LIVA, TIVA, or FIB
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Thermal Shock Chambers
We provide a large selection of thermal shock chambers to accommodate various types of product testing. Thermal Shock Chambers perform tailored environmental stress screening of component and board electronic assemblies. Our unique chamber design transfers product between two extreme temperature-controlled chambers, passing equal volumes of high velocity conditioned air over the product and resulting in rapid product temperature changes. The induced thermal stresses can reveal hidden manufacturing defects in electronic sub-assemblies and other components by the expansion and contraction of critical parts.
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PoE Transient Test Meter
Trans-Guard 910016
GrayStone Automation's innovative DCVBD voltage breakdown meter measures the breakdown voltage of many lightning protection devices and components to identify transient protection devices that may be damaged or defective and help prevent costly transient damage to critical and expensive equipment.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Lab Inspection & Testing Services
Our lab services use advanced techniques to thoroughly inspect components for manufacturing flaws before assembly. We work with clients in the aerospace, automotive, oil & gas, manufacturing, wind energy, and various other industries to ensure their materials and components are free from defects that were introduced in forging or manufacturing processes.
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Winding Resistance Tester
JYR20S/10S
DC winding resistance testing is regarded as another essential routine screening tool. It indicates problems such as loose, defective or incorrect connections, which cause enough transformer failures each year to be regarded as a failure category of its own.
