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Deposition
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Particle Deposition Systems
MSP’s 2300G3 Particle Deposition System sets the standards for wafer inspection and metrology equipment. This advanced tool is vital for increasing the yield of future leading-edge devices, while meeting the measurement needs of today.
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Matrix Vapor Deposition System
iMLayer
The iMLayer matrix vapor deposition system is sample pretreatment (application of matrix) in order to perform MALDI-MS imaging using an analysis system such as the iMScope imaging mass microscope or the MALDI-7090. With the iMLayer, the deposition method has been adopted as a pretreatment method to achieve high spatial resolution. By using this method, fine matrix crystal can be produced. Also, thanks to automated control, the coating thickness is reproducibly controlled as users configure.
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Grid Electrode
Grid electrode is produced by the deposition of the platinum, gold or carbon onto the quartz glass. The dimension of the glass is 8 x 27 mm, with a 1 mm of the thickness, and the grid line is 100 m width with a distance of the 150 m between lines.
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Optical Fiber Type Hot Phosphoric Acid Concentration Monitor
CS-620F
In 3D NAND manufacturing process, dozens of layers of SiO2 and SiN are deposited, and the SiN layer is selectively removed using hot phos.In this process, the desired etching rate can be achieved by controlling the concentration and temperature of the chemical solution.Previous products have difficulty to measure high temperature chemicals, but the CS-620F is able to measure at high temperatures up to 170 C degrees.
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Salt Spray Chambers
MX-9200
LR Environmental Equipment Co. Inc.
A high reliability thermostatic temperature controller maintains the salt solution at a preset controlled temperature in a reservoir within the double wall construction. The salt solution is introduced into the chamber through an atomizing nozzle. The nozzle can be calibrated by us to perform to MIL-STD-19500B, paragraph 40.8 and other specifications. This specification requires that a salt residue be deposited on the specimens, in addition to generating salt fog atmosphere.
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Ozone Gas Delivery Systems
MKS ozone gas delivery systems provide field-proven, high concentration, ultra-clean ozone generation for advanced thin film applications such as Atomic Layer Deposition (ALD), Chemical Vapor Deposition (CVD), Tetraethyl Orthosilicate (TEOS)/Ozone CVD (HDSACVD), contaminant removal and oxide growth. Gas delivery models have integrated ozone concentration monitoring, flow control, and power distribution. Additional system options include safety monitoring, status indicators and ozone destruction capability.
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Dimensional Metrology
Stand-Alone Metrology Family
Nova’s stand-alone metrology platforms are utilized to characterize critical dimensions such as width, shape and profile with high precision and accuracy and are used in multiple areas of the fab such as photolithography, etch, CMP and deposition in the most advanced technology nodes, across all semiconductor leading customers.
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Surface Quality Monitors
PET manufactures and markets non-destructive, non-contact surface contamination and thin film detection models and automated systems (surface quality monitoring system) capable of detecting thin layer contamination, thin films and coating down to the Angstrom level. These systems represent a major breakthrough by providing, for the first time, a quantitative measure of surface cleanliness. As surface cleanliness verification instruments, in a part cleaning environment, these products are capable of validating the cleaning quality of all the part cleaning equipment available in the market. Any of SQM model series is capable of verifying metal contamination; monitoring absence/presence of organic and/or inorganic on virtually on surfaces of all metals. They are, price/performance, the most sufficient product available for testing surface of metals for surface cleanliness. These systems operate in an ambient environment, require no sample preparation or deposit of any agents on the surface. In any parts cleaning environment where the quality and efficiency of part cleaning equipment for removal of surface contamination is highly desired, these systems provide a scientific solution by quantitatively measuring the surface cleanliness. The SQM series has the sensitivity and operational simplicity required to provide fast and cost effective surface evaluation for all metals.
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Chip Manufacturing
KLA’s advanced process control and process enabling solutions support integrated circuit manufacturing. Using KLA’s comprehensive portfolio of defect inspection, review, metrology, patterning simulation, in situ process monitoring and data analytics systems, IC manufacturers can manage yield and reliability throughout the chip fabrication process - from research and development to final volume production. SPTS provides deposition process solutions for insulating materials and conducting metals that cover a range of chip manufacturing process steps. IC manufacturers use KLA's array of products and solutions to help accelerate their development and production ramp cycles, to achieve higher semiconductor die yield and improved IC quality, and to improve overall profitability in the IC manufacturing process.
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Vapor Concentration Monitor
IR-300 Series
Metal-Organic Chemical Vapor Deposition (MOCVD) is widely used in the manufacture of LEDs, optical devices and other components. Liquid and solid precursors are delivered to the reaction chamber by controlling the temperature, pressure and the carrier gas flow rate (bubbling method). Process results can be affected by changes especially in temperature and liquid level. The in-line IR-300 Series measures and reports the precursor concentration in real time.
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Vaporizers
Vaporizers are the backbone of gas phase processes, serving as the catalyst for converting liquids into essential gases. This transformative process is indispensable in a myriad of applications, ranging from precision thin film deposition to critical procedures like metal etching and doped epitaxial growth.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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kSA RateRat Pro
kSA RateRat Pro is a compact, convenient and easy-to-use optical metrology tool for thin-film characterization. Its unique capability is to measure, in situ and in real-time, optical constants (n and k), deposition rate and film thickness.
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Piezobalance Dust Monitor
3520 Series
The Kanomax Piezobalance Dust Monitor 3521/3522 is a unique respirable aerosol monitor, providing direct mass concentration of particulates using PIEZOBALANCE technology; ideal especially for oil mist monitoring. The Kanomax 3521 is equipped with 4 and 10µm impactors while the 3522 is equipped with a 2.5µm impactor. Unlike conventional dust meters, which count particles, a piezobalance dust meter like the 3521 or 3522 “weighs” mass concentration of particulates. As an air sample enters the system, it travels through the impactor, which captures and removes larger particulates away from the sample. Smaller particulates become electrically charged and deposited on the piezo-crystal. The total mass of the deposited particulates affects the piezo-crystal’s frequency. Since the change in frequency is proportional to the mass of the particulates, the actual weight of the particulates is obtained.
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Digital Mammography
Analogic is an established worldwide leader in direct conversion digital detector technology used in digital mammography. We develop and manufacture flat-panel, direct conversion digital detectors used by major medical OEMs in mammography systems. These plates capture image data directly onto a patented detector made with a layer of amorphous selenium deposited onto a thin-film transistor array.
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Micro-spot DUV Reflection and Transmission Spectrophotometry
FilmTek 3000 PAR
Scientific Computing International
Metrology system with a 50µm spot that delivers high-performance transmission and reflection measurement of patterned films deposited on transparent substrates. Ideally suited for measuring the thickness and optical constants of very thin absorbing films.
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Remote Plasma Sources
Semiconductor and Electronic Thin Film applications use plasma sources to generate low-energy ions and radicals to react with material surfaces and chamber walls to remove contaminants and act as a precursor to aid in material deposition. MKS provides multiple options for radical generation including Toroidal and Microwave based Remote Plasma Sources supporting Fluorine, NF3, oxygen, nitrogen and hydrogen process chemistries.
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Liquid Flow Controller
Built upon field proven technology, the Turbo™ Liquid Flow Controller (LFC) 2950 was engineered to pair with MSP Turbo II™ Vaporizers to provide a reliable, high-performance liquid vapor delivery solution for semiconductor thin film deposition processes (including CVD, PECVD, ALD, and MOCVD). The diagram below shows how the LFC fits into the liquid vaporization system MSP offers.
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High Temperature Absolute Pressure Transducers
Our high temperature Baratron® capacitance manometers are controlled to temperatures of 150°C or higher for use use in demanding semiconductor manufacturing vacuum processes such as metal etching and nitride film chemical vapor deposition (CVD).
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Electrostatic Precipitator
HIGHVOLT Prüftechnik Dresden GmbH
Electrostatic precipitators are used for clean process and exhaust gases, for example, in the cement and building materials industry, in steel mills, in conventional power plants, and in waste incineration plants. The dust particles are discharged electrostatically charged by a spray electrode, deflected by a DC electric field and deposited on the electrode.
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Multi-Element Standards
These multi-element standards consist of multi-layer thin film coatings, one on top of the other, upto a maximum of 6 elemental coatings. It is generally recommended to have coating thicknesses < 20 µg/cm2, so as to cause negligible notable matrix effects, in particular absorption of X-rays emitted in lower deposits by those covering them.
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Dynamic Scale Deposition Loop System
Dynamic Scale Deposition Loop fully automated systems includes hardware and software to measure and evaluate the performance of scale inhibitors under high pressure and high temperature conditions.
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Duct Deposit Measuring System
The Elcometer 456 Duct Deposit Measuring System has been specifically designed to meet the requirements of the DTT (Deposit Thickness Test) in HVCA’s (Heating & Ventilation Contractor’s Association) Guide to Good Practice, for the measurement of dust and grease deposits within ventilation systems and kitchen ducts made of ferrous metals.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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Trace Moisture Analyzer
Model 8800P
Teledyne Analytical Instruments
The 8800 series uses field proven aluminum oxide (Al2O3) sensing technology to accurately detect trace moisture on either a continuous or spot checking basis. All Al2O3 sensors share the same basic operating principle: the capacitance measured between the sensor’s aluminum core and gold film deposited on the oxide layer varies with the water content. The 8800 series moisture sensor employs unique Hyper Thin Film (HTF) technology, which offers three major structural improvements in Al2O3 sensor design. These structural changes, noted below, provide the user with increased sensitivity, greater stability and a quicker response time when compared to other conventional aluminum oxide sensors on the market today.
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Differential Quartz Crystal Microbalance
Dike
During an experiment to detect an affinity reaction on biological material, a molecule of interest is attached to the quartz crystal of the measurement channel, this deposition can be achieved by direct binding or by capture through another protein, the result of this process is to make the quartz sensitive to the molecule to be detected.
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Process Sense™ NDIR End Point Detector For Chamber Clean
The Process Sense endpoint sensor is a small, low-cost SiF4 sensor specifically designed for Remote Plasma Chamber Clean Endpoint detection for silicon-based CVD deposition chambers. Process Sense is based on infrared absorption, the only technique applicable to all plasma cleaning processes (in-situ and remote). It gets mounted onto a bypass on the rough line, ensuring no effect on deposition hardware. The signal level reported by the Process Sense, which is proportional to SiF4 concentration, can be used to determine the completion of the chamber clean process.
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PED Systems
Pulsed Electron Deposition
Is a process in which a pulsed (80-100 ns) high power electron beam (~1000 A, 15 kV) penetrates approximately 1 μm into the target resulting in a rapid evaporation of target material. The non-equilibrium heating of the target facilitates stoichiometric ablation of the target material. Under optimum conditions, the target stoichiometry is preserved in the deposited films. All solid state materials – metals, semiconductors and insulators, including those transparent to laser wavelengths in PLD – can be deposited as thin films with PED. By combining PLD and PED, the range of complex materials that can be prepared as thin films can be greatly enhanced.
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Copper Pillar Bump
Like in conventional fabrication, integrated circuits are created on the wafer but near the end of the manufacturing process, the attachment pads are metalized on the surface of the chips to make them more receptive to solder. Then solder dots are deposited on each of the pads, and chips are cut, flipped, and positioned so that the solder balls are facing the connectors on the external circuitry.
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Diamond-like Carbon (DLC) Foils
An intense laser beam is used to evaporate carbon from a graphitic sputter target. In the process, the graphite structure of the source material is converted into nano-particles, which deposit on prepared substrates as diamond-like carbon. The properties of these unique carbon foils make them useful in a variety of applications, in particular beam stripping, as backings for accelerator targets or x-ray attenuators.
