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Void
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Radiographic Inspection Test
The radiographic inspection is a non-destructive x-ray method for detecting internal physical defects in small component parts which are not otherwise visible. Radiographic techniques are intended to reveal such flaws as improper positioning of elements, voids in encapsulating or potting compounds, inhomogeneities in materials, presence of foreign materials, broken elements, etc.
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SAM Auto Line
PVA TePla Analytical Systems GmbH
The fully automated acoustic microscopes from the SAM Auto Line enable simple detection of cavities, voids, bubbles, inclusions, and delamination and are ideally suitable for wafer inspection, bond checking, and MEMS inspection. An automatic defect-review software package performs a fully automated evaluation of the entire wafer. The results can be issued as klarf files and VEGA MAP. A GEM/SECS connection is also possible.
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Partial Discharge Tester (Dry Type)
Partial Discharge testing is a way of detecting voids or imperfections in insulators that would lead to overheating and breakdown under normal operating conditions. Due to the nature of the signal being measured, this test is very susceptible to electronic and RF noise and a proper corona-free properly isolated test chamber is required.
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SOI Bonding Systems
An accurate wafer bonding process is the key factor in obtaining high quality single crystalline silicon films on insulating substrates. The EVG850 SOI/Direct Wafer Bonding systems are designed to fulfill a wide range of fusion/molecular wafer bonding applications, with main focus on SOI substrates manufacturing. Ultra clean handling of wafers throughout the bonding process assures high-yield and void-free bonds. All essential steps, from cleaning and alignment to pre-bonding and IR-inspection are combined in one high volume production system. EVG850 is the only production bonding system built to operate in high throughput, high-yield environments and guarantees void-free SOI wafers up to 300 mm.The EVG300 series single wafer cleaning systems are designed for efficient removal of particles. In semiconductor processing, efficient cleaning and particles removal prior to critical process steps enables maximum yield. Wafer Bonding is a process which is strongly affected by particles: each particle on the wafer surface produces a void orders of magnitude larger than its diameter, contributing to a dramatic yield loss.
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Gravimeter
Gravimeters are specialized accelerometers used to measure local gravity or variations in the gravitational field of the Earth. High-performance gravimeters and gravity gradiometers are well-suited for applications such as geophysical and geodetic surveying, precision navigation, exploration for natural resources, and underground fluid monitoring. Such sensors may also be useful for identifying special nuclear materials, treaty verification, and void detection.
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X-Ray Inspection System
MX1
Manncorp’s new MX1 is a high-performance x-ray inspection system designed for real time imaging of multilayer PCBs and dense metal BGAs, μBGAs, and chip scale packages. Its high voltage (80kV), computer-controlled x-ray tube and 35 μm focal spot provide the power necessary for detection of a variety of defects including bridging, voids, and missing balls. The MX1’s standard camera features continuous zoom magnification from 4X to 50X and variable angle viewing up to 45°, and an upgrade to the x-ray tube can boost magnification to 225X.
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Instruments
Organizations working on new thermosets or new thermoset formulations need an intimate understanding of how these materials cure before they can proceed to the next step in the research, quality control, or production process. What happens when the material is heated? When is the best time to apply pressure to squeeze out voids? How fast does the material react at 120C? 150C? 180C? Most organizations today address this need by curing a sample for an arbitrary amount of time before using inexact, error-prone manual methods, or complex thermal analytical instruments to test cure state. Maybe the sample has reached the end of cure, but maybe not. With traditional methods, it’s difficult to tell for sure. How can organizations determine whether they’re processing materials longer than necessary? Dielectric cure monitoring lets them know for sure.
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X-Ray Inspection
X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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Entry Level GPR System for Concrete Inspection
StructureScan Mini LT
Geophysical Survey Systems, Inc.
The StructureScan™ Mini is GSSI’s all-in-one GPR system for concrete inspection. This handheld system locates rebar, conduits, post-tension cables, voids and can be used to determine concrete slab thickness in real-time.
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CT Polarity Tester
DIR CT
SCOPE proudly introduces Dir CT, a CT Polarity Tester specially designed to verify correctness of polarity of current transformers cores in live EHV switchyards. Polarity test is one of the most common yet crucial tests required to be done on current transformers by commissioning as well as maintenance engineers. Even though it is commonly conducted check, there was no all in one simple tool available for this measurement. DIR CT fills this void to perfection, it is expected to significantly reduce the time taken for polarity checks on numerous CT in sub-station, especially during commissioning of new sub-stations
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Inspection System for Die Casting
X-eye 7000BS
Appropriate for medium•large size component inspection and detecting surface structure and defects(inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's reduced significantly and enables long-term use with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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For Real-Time X-ray Inspection Systems
Image Processors
A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Pitot Tubes
The dpm-i Pitot Tube is a new design concept in Pitot Static Tube technology. It is a multi-functional sensor. It can replace thermally heated instruments, where power requirements are high. Gives easy access to duct measurement compared to a standard Pitot Tube. For example, in ceilings voids and confined areas, where there is a thick lagging or metal cladding.
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Gravity Measurement
Quantum gravity measurement is emerging as a new frontier in sensing, bringing the ability to passively detect objects and voids, through difficult to penetrate materials such as soil, rock, lead and water. Gravity measurement using cold atom interferometers is set to revolutionise nearly all industries from civil to oil and gas, mining to maritime, and medical to defence.
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High Speed Data Acquisition
All systems can be set up in two types of aluminum chassis. These are the conduction cooled rugged 3U VPX chassis “Crosswind 600” and “Desert Gecko” . Ruggedized and sealed to IP65. These units can use void fillers and GORE brand vents depending on the deployment environment.
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GPR System for Concrete Inspection
StructureScan Mini XT
Geophysical Survey Systems, Inc.
The StructureScan Mini XT is GSSI’s newest generation of our very popular all-in-one GPR systems. The StructureScan Mini XT offers a 2.7 GHz antenna for superior target resolution and can reach depths of 20 inches (50 cm). Ideal for locating rebar, conduits, post-tension cables, voids, and real time determination of concrete slab thickness.
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Making Invisible Visible
Quadra 3
Quadra™ 3 is your partner for high quality X-ray inspection for production line quality control. Detect a wide range of manufacturing defects including BGA, QFN and IGBT attachment, PTH filling, interfacial voiding, component cracking and counterfeit device screening. High quality, high magnification inspection for product applications.
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Inspection System
X-eye 7000B
Appropriate for the inspection of medium•large size components and detection of surface structure and defects (inside voids and cracks etc).Due to high-energy, high-power Micro-focus X-ray Open Tube, maintenance cost's significantly reduced and long-term use possible with only replacing consumables.Customization is available with selecting main parts by customers depends on their needs for size and material.
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IR Inspection System
EVG®20
The EVG 20 offers a fast inspection method, especially for fusion bonded wafers. A live imageof the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG 20 tool or as a station in EVG''s integrated bonding systems.
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Flaw Detectors
Flaw detectors are essential for ensuring the safety and quality of industrial products. They accurately identify defects such as cracks, voids, and inclusions without damaging the materials. Ultrasonic testing is particularly notable for its precision and versatility among the various non-destructive testing methods.
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Ultra-sonic Test System
V-Meter
The V-Meter is an advanced ultrasonic, pulse-velocity test system widely used for quality control and evaluation of concrete structures. It can identify non-homogeneous conditions such as voids, cracks, honeycombs and frozen concrete.
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Moisture Meter and Thermal Imager with MSX®
FLIR MR265
The FLIR MR265 is a professional pin and pinless moisture meter with thermal imaging designed to show you exactly where to investigate issues related to moisture, air leaks, and insulation voids. Featuring IGM™ (Infrared Guided Measurement) and MSX® (Multi-Spectral Dynamic Imaging enhancement) technology, the MR265 helps you quickly scan and target problem areas, visually guiding you to the spot where you can confidently take measurements, analyze readings, and ensure that problems are fixed. Using FLIR Thermal Studio™, you can then create and share professional reports that include findings and proof of repairs – giving your clients peace of mind that mold, rot, or moisture challenges have been resolved.
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X Ray Flaw Detector
A non-destructive testing (NDT) device used to inspect materials for internal flaws or defects such as cracks, voids, inclusions, and weld discontinuities.
