Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
TSOP-to-DIP (0.600 [15.24]) Adaptor
655000
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TSOP to .600 [15.24] DIP Adapter. Designed to allow user to cut 32 position adapter down to any size desired. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
Pin-Line™ Vertisocket™
Series 0517
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Pin-Line Vertisockets. For mounting components, jumpers, etc., at right angle to PC board. Available 1 to 25 positions; cuttable to any number desired.
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Product
Flat Pin-Staked Flex Jumpers
Series 171 thru 173
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Flat Pin Staked Flex Jumpers. Aries Flat Pin Staked Flex Jumpers combine thin, flexible, solid Copper conductors embedded between layers of tough, flexible, flame- retardant insulation.
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Product
40-Pin DIP-to-Socketable PLCC Adaptor
1111163
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40 Pin DIP to Socketable PLCC Adapter. Can be used with Intel 80/83C652 and 80C251 microprocessors and any IC that follows standard DIP to PLCC pinout conventions. Allows user to switch package styles and avoid shortage problems. Designed to plug directly into your 44 pin PLCC socket.
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Product
Vertisocket™ Horizontal Mounting
Series 800
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Vertisockets Horizontal Mounting with Bifurcated Contacts. Aries offers a full line of VertisocketsTM for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. The variations of mounting position and pin configuration provide exceptional design freedom.
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Product
Header Covers
Series 650
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Header Covers. Aries offers a complete line of DIP headers and covers useful for mounting components such as resistors, diodes, etc. Consult Data Sheet 12032 for mating DIP header information. Four cover heights provide mounting of 1/8? [3.18] high to 3/4? [19.05] high components.
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Product
Hybrid Socket
CSP/Ballnest
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Any grid size available on 0.50mm pitch or larger. ZIF style socket using Aries solderless, gold plated pressure mount Spring Probe. The gold over nickel plated compression spring probes leave very small witness marks on the bottom surface of the device solderballs.
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Product
P/N 1110087 144-Pin VQFP-to-PGA Adaptor
1110087
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144 Pin VQFP to PGA Adapter. Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact. Consult factory for panelized form or for mounting of consigned chips.
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Product
QFP-to-PGA JEDEC 132-Position, 0.025 [0.64] Pitch Adaptor
95-132I25
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QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
ZIF (Zero-Insertion-Force) Socket
Series 516
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Zero Insertion Force Socket. A choice of 24, 28, or 40 pin count devices can be inserted without bending or otherwise damaging the legs, since no force is required to either insert or remove the component from the socket. Contacts are normally open and are closed by a unique cam action controlled by dual lever arms. The last 15° of movement of the cam provides a wiping action to the contacts on the legs of the device to remove any residue, ensuring a gas-tight seal.
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Product
0.5mm 8- and 10-Pin MSOP-to-0.300" DIP Adaptor
1111841-X
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.5MM 8 AND 10 PIN MSOP TO .3 DIP ADAPTERS. A cost effective means of upgrading to MSOP .5MM package SOIC... without changing your PCB layout. Available on .300 [7.62] centers.
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Product
Mini-Link™ Miniature Jumper
Series ML-100
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Mini-Link Miniature Jumpers. Used to jumper from row-to-row or from pin-to-pin. Their miniature size makes it possible to stack one on top of the other. A convenient test probe slot is provided as well. Mini-Links are available from the factory with or without a handle, used for ease of inserting or extracting.
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Product
PQFP-to-PGA 132-Pin Amp Footprint Socket
97-AQ132D
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132 Pin PQFP to Amp Socket PGA Footprint. Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs.
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Product
SOWIC-to-DIP Adaptor 14 to 28 Pins
Series 35W000
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SOWIC to DIP Adapters - 14/28Pins. A cost effective means of upgrading to SOIC without changing your PCB layout.
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Product
Universal ZIF (Zero-Insertion-Force) DIP Test Socket
Series X55X
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Universal Zero Insertion Force DIP Test Socket. All pin count sockets go into PCB with either .300 or .600 [7.62 to 15.24] centers. Sockets can be soldered into PCBs or plugged into any socket. Socket fits into Aries or any competitive test socket receptacle.
