Aries
Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip™ technology. Our website contains over 200 full-spec Product Data Sheets available for viewing, downloading, and printing.
- 215-781-9956
- info@arieselec.com
- 2609 Bartram Road
Bristol, PA 19007-6810
United States of America
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Product
Vertisocket™ Horizontal Mounting
Series 800
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Vertisockets Horizontal Mounting with Bifurcated Contacts. Aries offers a full line of VertisocketsTM for DIP packaging of LEDs, incandescent lamps, DIP switches, test points, etc. The variations of mounting position and pin configuration provide exceptional design freedom.
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Product
Economy Model Vertisocket™
Series 800 and 822
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Thrifty Model Vertisockets with Bifurcated Contacts. These low cost VertisocketsTM are recommended for high volume vertical display mounting applications. Very useful for connection of board-to-board jumpers and for DIP switches as well as LED devices.
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Product
QFP-to-PGA Motorola DSP56000/001 Adaptor
97-56001
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QFP to PGA Adapter for Motorola DSP56000/001. Convert surface mount QFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.
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Product
DIP-ER™ Logic Jumper
Series 115, 116, & 117
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DIP-ER Logic Jumper. Reliable, electronically tested solder connections. Protective covers are ultrasonically welded on and provide strain relief for cables. DIP-ER Logic jumper wiring is point to point. Consult factory for other wiring needs.
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Product
44-Pin 0.8mm QFP-to-44-Pin PLCC Adaptor
44-305263-20
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44 Pin .8mm QFP to 44 Pin PLCC Adapter. cost effective means of upgrading to QFP without changing your PCB layout.
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Product
Lock/Eject DIP Collet Socket with Surface Mount Pins
EJECT-A-DIP
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Lock/Eject DIP Collet Sockets with Surface Mount Pins. Features: Aries Eject-A-Dip is a rugged, solderable socket with a unique ejector/latch for fast in-field board maintenance. The latch locks in the connector or device, making it ideal for high vibration environments. The latch, when used as an ejector, removes DIP packages without pin damage.
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Product
DIP Program Header
Series 675
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DIP Program Headers. Aries DIP programmable headers offer unusual versatility for programming within the header itself. They can be individually programmed using cutters or Aries programming tool, Part No. T-675, available separately, to remove the interconnecting sections. Consult Data Sheet No. 22002 for Aries programming tool.
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Product
Lo-PRO®file Collet Socket with Solder Tail Pins
Series 513
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LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options
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Product
Inverter Socket
Series 6621
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Inverter Sockets. Inverted configuration allows the socket to be wave soldered on the component side of the PCB and the device socketed through a window on the solder side of the PCB. Available on .600 [15.24] centers. Consult factory for other sizes.
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Product
QFP-to-PGA JEDEC 132-Position, 0.025 [0.64] Pitch Adaptor
95-132I25
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QFP to PGA Adapter for JEDEC 132 Position, .025 [.64] Pitch. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.
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Product
Open-Frame Collet Socket with Wire Wrap Pins
Series 508
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Open Frame Collet Sockets with Wire Wrap Pins. Features: Open frame allows for more efficient utilization of board space and better cooling. 2 and 3 level wire wrap pins available. Compatible with automatic insertion equipment. Side-to-side and end-to-end stackable.
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Product
SOIC DW-to-20-Pin PLCC
MC145158-2
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ADAPTER FOR MOTOROLA. FROM PLCC 20 PIN FN PACKAGE TO SOIC DW PACKAGE. A cost effective means of upgrading to SOJ or SOIC ... without changing your PCB layout.
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Product
Lo-PRO®file Collet Socket with Wire Wrap Pins
Series 503
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LO-PRO file Collet Sockets with Wire Wrap Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12011 for solder tail pins. Choose from several sizes and plating options.
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Product
DIP Header with Coined Contacts
Series 600
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DIP Headers with Coined Contacts. Aries offers a full line of DIP headers, available with either coined or screw machine contacts. Consult Data Sheet No. 12035 for screw machine contacts. Snap-on, protective covers are available for all sizes shown below and accommodate .125 [3.18] to .750 [9.05] component heights. Consult Data Sheet No. 12033 for protective covers.
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Product
Program Header and Cover
Series 680
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Program Headers and Covers. Complete versatility for programming within the unit itself...thus eliminating the need for DIP switches in many situations. Available pre-programmed from Aries, or do it yourself using Aries hand tool No. T-680. Consult Data Sheet No. 22002 for programming tool information.
