3D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder. Also known as: 3D SPI
See Also: Solder Paste Inspection, 3D SPI
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Product
In-Process Wafer Inspection System
7945
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Chroma 7945 wafer chip inspection system is an automated inspection system for pre and post diced patterned wafers. Change kits enable switching between various applications by allowing different carriers including metal frame or grip ring.
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Product
3D Measurement
PSD-Array
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The PSD array consists of 16 parallel one-dimensional PSD elements on the same chip. By utilizing the triangulation technique the reflection of a laser line or multiple laser spots onto the PSD array will provide information about the contour of the illuminated object. The possibility for simultaneous readout of the 16 elements together with the fast response of each element makes the PSD array suitable for applications like high speed 3D contour measurements and measurements of parallel, moving objects such as cantilevers.
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Product
Non-Destructive Resonant Inspection Drop Test Fixture
RAM-DROP
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The Drop Test Fixture, Model RAM-DROP, Resonant Inspection System, allows automated sorting and quality testing of small metal injection molded (MIM), powder injection molded (PIM), additively manufactured, and other small parts by using the Resonant Acoustic Method (NDT-RAM).
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Product
Drone Inspection Software
Qii.AI
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Qii.AI automates the detection and analysis of defects. It is the only enterprise AI platform that combines drone inspection software with an AI labeling tool, AI-assisted computer vision, and machine learning.
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Product
Magnetic Particle Inspection(MPI)
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Magnetic particle inspection is an inspection method used to identify defects on the surface of ferromagnetic materials by running a magnetic current through it.
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Product
Electrical Inspection Adapters & Accessories
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Electrical Inspection Adapters & Accessories by electro-PJP
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Product
3D Sound Intensity Analysis Software
DS-0225A
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Finding out the position where the noise is occurring, and grasping the state of acoustic propagation are important ways to find effective noise countermeasure or improvement of acoustic environment.
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Product
Portable 3D Scanners
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Portable Scanners are the ideal option to quickly scan complex shapes and geometric data from objects large or small when you want to go anywhere and inspect anything.
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Product
96-Pin 1.27mm Pitch Female Solder Pad Connector With Backshell, Screwlocks
C096SFR-4SP-5A
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This connector is designed to allow users to discrete wires using solder pad connections to the 96-Pin 1.27mm pitch connector. Pickering Interfaces recommends the use of purchased cable assemblies for applications where most or all of the contacts are in use.
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Product
X-ray Inspection System
RTX-113™
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Glenbrook’s RTX-113 is designed for heavy production environments where X-ray is used to inspect PCBs and assembled PCBs containing advanced components such as BGA, micro BGA, QFN and other devices.
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Product
Socket with Bifurcated Contact Solder Tail Pins
Series 0511
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Strip-Line Sockets with Bifurcated Contact Solder Tail Pins. Features: For mounting liquid crystal displays and other high pin count or odd centered components. Available in several sizes with bifurcated contacts in solder tail or wire wrap pins. Consult Data Sheet No. 12009 for wire wrap pins. Optional spacer available for mounting on .300 [7.62], .600
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Product
Defect Inspection and Review
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KLA’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.
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Product
X-ray Inspection System
RTX-113HV
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Precision X-ray Inspection for BGAs, QFNs, LEDs, sensors, medical devices, and other packaged devices.
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Product
3D Video Microscope
BVM-20104
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The microscope is configured with 1.3M HD industrial camera. VGA image output interface, can be connected to the computer and monitor directly. clear and vivid image, taking photos, SD card storage, auto exposure. Camera is equipped with remote control panel, which makes the operation much easier. Optical lens keep parfocal under zoom, there is no deviation for center; 3D rotary observation
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Product
Coax, Patchcord, ITA, 20", Mini Coax, Solder Sleeve, RG316 Tan, Single-Ended
7-339116000-036
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Mini Coax, ITA, Solder Sleeve (50 Ohm, 2 GHz) to RG316 Tan (50 Ohm, 3 GHz).
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Product
High Energy Industrial CT X-Ray Inspection System
MeVX Series
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The most advanced industrial DR & CT systems in the world are now available with Linear Accelerators. Offered with energies up to 9MeV, the MeVX series of systems provide the same ease of use as our low energy systems in a high energy format. Utilizing our current efX software platform along with the superior service, support & training that we are known for puts these systems in a class of their own.
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Product
Structural Adhesive Bead Inspection
Predator3D
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The Predator3D bead inspection technology measures bead height, width (volume) and position to assure structural integrity. It also alerts users to skips and partial skips, where material is deposited with insufficient volume.
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Product
Highly Integrated Optical Inspection
BOA
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BOA is a highly integrated optical inspection tool for controlling quality and increasing productivity. It comprises all the elements of an industrial machine vision system in a tiny smart camera style package.
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Product
Reverse Engineering 3D Scanner
peel 3.CAD
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peel 3.CAD is your go-to fully integrated 3D scanning solution for all your reverse engineering needs. Extract all the information you need and send them right to your preferred CAD software.
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Product
Fiber Optic Inspection & Cleaning
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One of the most basic and important procedures for the maintenance of fiber optic systems is to clean the fiber optic equipment.
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Product
Desktop 3D Scanners
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Automated 3D Scanning for small to medium sized parts. Desktop scanners offer a more compact solution with great accuracy.
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Product
Post Wire and Die Bond Inspection Machine
IV-T3300
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IV-T3300 is a post wire and die bond inspection machine with Dual JEDEC Tray Feeder System. It features a large inspection area of 600x500mm and a quick trays change of 5-7 seconds.
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Product
Conformal Coating Inspection (CI AOI)
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They cover the components, the area around the components and identify most coating issues including cracks, bubbles, insufficient / excess coating, loss of adhesion and other common contaminations. Full coverage inspection for conformal coating.
