3-D Solder Paste Inspection
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
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Surface Inspection Gauge for the Shop Floor
4D Inspec Surface Gauge
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Your product description goes here.
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3D Optical Profiler
7503
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Chroma 7503 uses the technology of white light interfaces to measure and analyze the surface profile of micro-nano structures with sophisticated scanning system and innovative algorithms.
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Radiographic Inspection Test
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The radiographic inspection is a non-destructive x-ray method for detecting internal physical defects in small component parts which are not otherwise visible. Radiographic techniques are intended to reveal such flaws as improper positioning of elements, voids in encapsulating or potting compounds, inhomogeneities in materials, presence of foreign materials, broken elements, etc.
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3D LaservScanners
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With unsurpassed accuracy and scan quality API’s Hemispherical Scanner is ideal for use Building Information Modeling (BIM), historical preservation and forensics.
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For Real-Time X-ray Inspection Systems
Image Processors
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A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Measuring And Inspection Systems For Extrusion, Injection Molding & Calendering Of Plastics And Films
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Measuring and inspection systems from Micro-Epsilon are used in the plastics processing industry in order to ensure efficient production.
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3D Metrology Solutions
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SHINING 3D owns multiple core technologies in the field of 3D machine vision based 3D inspection, bringing a variety of independent research and development equipment including laser handheld 3D scanner, blue-light high-precision 3D scanner for inspection system, intelligent robot automatic 3D inspection system, wireless optical portable CMM system and etc.
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Lo-PRO®file Collet Socket with Solder Tail Pins
Series 513
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LO-PROfile Collet Sockets with Solder Tail Pins. Features: LO-PRO file Collet Sockets are available with solder tail or wire wrap pins. Consult Data Sheet No. 12012 for wire wrap pins. Choose from several size and plating options
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Clarity 3D Solver
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The Cadence Clarity 3D Solver is a 3D electromagnetic (EM) simulation software tool for designing critical interconnects for PCBs, IC packages, and system on IC (SoIC) designs. The Clarity 3D Solver helps designers tackle the most complex electromagnetic (EM) challenges when designing systems for 5G, automotive, high-performance computing (HPC), and machine learning applications with gold-standard accuracy.
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MT Inspection Scope
Um
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● Test 12 or 24 fiber MT Connectors● Find Endface defects fast● 800x Magnification●Numbered Dial Indicator to quickly identify which fiber you're onThe Um MT Inspection Scope accurately shows defects in your MT 12 or 24 fiber connectors. Quickly view each fiber to save time and money. Our unique Fiber Dial shows which fiber you are inspecting. No more getting lost!The Um MT is compatible with our Eagle Inspect Software. Create reports with images for your MT connectors.
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Replacement Solder Tip Leadset for Use with D420/620
Dx20-SI-HiTEMP
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The 90 cm HiTemp cables and Solder-In lead can be used for controlled situations where the differential amplifier module needs to be removed from the extreme temperature environment. Ideally suited for testing scenarios where the temperature can fluctuate from -40 °C to +105 °C.
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3D Scanner
Artec Leo
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The first 3D scanner to offer onboard automatic processing, Artec Leo is able to provide the most intuitive workflow, making 3D scanning as easy as taking a video. As you scan your object, see the 3D replica being built in real time on Leo’s touch panel screen. Rotate the 3D model, check if you have captured all areas, and fill in any parts you may have missed.
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Handy Scan 3D
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The truly portable metrology-grade 3D scanners delivering highly accurate measurements.Truly portable and faster than everMetrology-grade accuracy and resolutionUser-friendly and easy to use
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Field Inspections
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MISTRAS Group has evolved into an asset protection industry leader on the backbone of our expansive non-destructive testing (NDT) and field-testing portfolio.
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Luminescence Defect Inspection System
INSPECTRA® PL Series
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This system uses luminescent images created using photoluminescence (PL) to perform high-speed, high-sensitivity automatic inspection for crystal defects, cracks, and luminescence defects which cannot be detected with conventional visible light surface inspection!
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X5 Pack X-Ray Inspection
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Designed to be integrated into line with built-in automatic reject and available in 300, 500 and 600 mm belt width models, the X5 Pack is perfect for a variety of unpackaged and packaged products.
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Digital Automated Interferometer and Microscope for Surface Inspection
DAISI-V3
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The ultimate production interferometer for measuring end-face geometry on single-fiber connectors, equipped with a revolutionary «no-exterior-moving-parts» mechanical design.
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Inspection Instrument for Indicators
i-Checker
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The i-Checker is specially designed to calibrate measuring accuracy of dial indicators, dial test indicators, and other electronic comparison gage heads with a stroke of up to 100mm (4").±(0.2+L/100)µm indication accuracy. Directly inspects an indicator with a stroke of up to 100mm (4"). The dial test indicator, bore gage and lever-type inductive head can be inspected with optional accessories. Adjustment of the measurement position is very easily accomplished because of semi-automatic measurement and full automatic measurement functions. Creates and prints out the simple inspection certificate. Saves inspection result as CSV file for reusable inspection result by any kind of software.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
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MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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3D Imaging Sensor
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The GS 3D sensors, can be used in applications such as bin picking, robotic manipulation, sorting products, mold clearance checking, and space monitoring and object recognition. In addition, the 3D technology will aid in determining spatial positions and measurements.The GS 3D images larger objects at longer distances and does so in milliseconds without the cycle time and motion required by scanning-based methods.
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3D Scanner
Artec Eva Lite
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Eva Lite is the budget version of the bestselling white light Artec Eva 3D scanner. It features the same accuracy specs, but with reduced functionality: Eva Lite has geometry only tracking and capture. As a result, this affordable 3D scanner can be used for making high quality textureless 3D scans when scanning geometrically rich objects, such as the human body.
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Digital Video Inspection Microscope
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Contamination is the first reason for troubleshooting optical networks. Proactive inspection and cleaning of fibre connectors can prevent poor signal performance, damage to equipment, and network downtime. DIAMOND’s Video Microscope Kit contains all necessary tools for proper inspection and cleaning of the connector’s front-faces to help ensure optimal connector performance.
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3D Sensors
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*Up to 38500 distance values per measurement for a detailed assessment of the application*Configurable outputs*Visual assessment of distance, level or volume*Predefined function blocks*Time-of-flight measurement principle
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X-Ray Inspection
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X-ray inspection systems are used wherever defects need to be detected by non-destructive means. The spectrum of use is broad and ranges from quality controls for complex assemblies, to the testing of materials for cracks and air inclusions, to foreign matter inclusions and shape deviations. The trend toward miniaturization, higher packing densities, and the relocation of components to the interior of the assembly require precise X-ray inspections that detect hidden defects quickly and reliably. X-ray systems from Viscom are used for the inspection of series assemblies as well as sampling and prototype controls. They take care of typical inspection tasks in concealed areas such as void controls, THT filling level measurements, and HIP inspections. At the same time, the systems reliably determine defect features such as coplanarity and polarity – at high inspection speeds and in a cost-effective way.
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Xray Food Inspection
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FlexXray has developed leading, certified technology and processes to use advanced x-ray technology to inspect products specifically for food companies. Although they look like a TSA line at the airport, our systems are highly customized machines and processes built specifically to find contaminants like metal, glass, wood, stone, plastic, and rubber in food products of all types. What we do is find needles in haystacks – but the needles we find are even smaller than needles in a haystack. In fact, FlexXray can find contaminants down to 0.8mm or smaller.
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01 With Soldering Eyelets | 10 Positions | M6
01-1xxx-00/30xxx-10-M
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Multi wafer compact selector with 36° detent angle, 3 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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X-ray Inspection Performance
MXI Quadra 7
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Ultimate image quality and magnification, Quadra 7 reveals quality defects as small as 0.1 µm. Ideal for root cause failure analysis, wire bond integrity checking, component cracking, MEMS inspection and wafer level components including TSV and wafer bumps.
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01 With Soldering Eyelets | 12 Positions | M10
01-1xxx-00/30xx-12-N
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Multi wafer compact selector with 30° detent angle, 6 mm shaft diameter, 25'000 switching cycles and with up to 6 Ncm switching torque
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Semiconductor Package Inspection System
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NIDEC-READ GATS (Grid Array Testing System) series carry out open/leak circuit tests on semiconductor package (MCM/CSP/BGA).
