3D SPI
checks form, height, surface area, bridges, volume, x/y offset and coplanarity of solder.
See Also: 3D Solder Paste Inspection
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Dimensional Inspection (3D Inspection)
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The 3D measurement data from our scanners and PCMMs offers a comprehensive definition of a physical object that is used for measurement, inspection, comparison and reporting. When a part is defined by millions of points, you can see subtle deviations, slight variations and fine details, which gives you the confidence that a part (or mold) meets your specifications. To deliver the best of both worlds, we combine 3D scanning with our contact, touch-probe measurement tools to deliver precise dimensions on geometric shapes.
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Cutting-edge 3D GPR array solution for efficient subsurface imaging cart solutions
Raptor
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The Raptor system covers a wide range of applications and can be configurated with 450 MHz or 800 MHz antennas. Raptor 3D Arrays are based on Real-Time sampling (RTS) technology and the unique antenna design is a milestone in the evolution of the GPR. A Raptor Antenna can be arranged in different ways, which allows for both standard and more advanced GPR measurements. These include common mid-point (CMP), wide-angle reflection and refraction (WARR) and Tomography.
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Academic Suite of 3D Measurement Solutions
Creaform ACADEMIA™
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Provides a complete and collaborative skill-nurturing academic solution. The suite let’s you choose from our full line of 3D scanners and portable CMM, free application software, complimentary add-ons as well as useful tools tailored to get you started with industrial 3D measurement solutions.
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3D Sensors (Main Screen)
surfaceCONTROL
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surfaceCONTROL sensors are used for 3D measurements and surface inspections. The sensors use the fringe projection principle to detect diffuse reflecting surface and to generate a 3D point cloud. This point cloud is subsequently evaluated in order to recognize geometry, extremely small defects and discontinuities on the surface. Sensors with different measurement areas are available. This enables the inspection of the finest of structures on components as well as shape deviations on large-area attachments. Powerful software packages are available for evaluation and parameter setting.
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3D Smart Sensors
FACTORYSMART®
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Scan object shape and contrast, take feature measurements, and make critical control decisions—then communicate directly to factory networks and equipment. All with a single device. All at production speed.
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Portable Metrology‑Grade 3D Scanner
Black Series
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The HandySCAN 3D | BLACK Series delivers accurate, high-resolution and repeatable results, regardless of the measurement setup quality and no matter the user experience. Featuring dynamic referencing, both the scanner and part can move during measurement and still provide an accurate and high‑quality scan.
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3D Point Cloud Data Viewing, Cleaning, Editing, Leveling, and Alignment Software Package for BV5000 3D Data Processing
QuickStitch Powered by EIVA
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QuickStitch is an easy-to-use 3D point cloud data viewing, cleaning, editing, leveling and alignment software package designed specifically for BV5000 3D data processing. The intuitive controls and user interface allows operators to quickly learn cleaning and alignment techniques. QuickStitch provides customers a fast and simple way to produce clean and aligned data sets to their customers.
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TTL/I2C/SPI* Expansion Kit
OP-SB5GL
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OP-SB5GL is the interface expansion kit that has a port to measure RS-232C(V.24) and a port to measure the TTL / CMOS signal level communications. The port for TTL / CMOS supports the measurement of TTL / CMOS level communications that power supply system is from 1.8V to 5V. It is suitable for monitoring the communications between the LSI and the interface IC on the printed circuit board by directly probing into the lines. It supports the protocol of not only UART and HDLC but also I2C and SPI* on monitoring and simulating.
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Bottom-up and Top-down 3D Modular AOI
SpectorBOX
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With up to 9 cameras per side (18 total), it is designed to inspect PCB’s inside solder frames from the heavy duty conveyor system suitable for assemblies up to 5kg. Inspection of PCBs without solder frames is also possible. The PowerSpector 550BTL handles PCBs with a maximum dimension of up to 550x550mm (21.6”). The PowerSpector 350BTL is designed for medium Size PCB’s up to 350x250mm (13.8″x9.8″).
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Solid Optical 3D Measurement Instrument
IF-SensorR25
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The IF-Sensor25 is a solid optical 3D measurement instrument for automated form and roughness measurement in production. The sensor is integrated into a production line and delivers you high resolution, repeatable and traceable results when measuring surface characteristics in the m or sub-m range. This resolution can hardly be achieved by conventional 2D solutions or tactile techniques.
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Product
eviXscan 3D Suite 2.0
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eviXscan 3D Suite 2.0 is a comprehensive software platform that delivers the most powerful and user-friendly tools for scanning and mesh processing within straightforward workflow.With eviXscan 3D Suite 2.0 the scanning process is more easy to use and faster than ever before.The clear workflow will guide the user in all scanning steps from basic configuration to the final mesh processing and will enable to achieve significant productivity gain in work with eviXscan 3D products.
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Area Scan 3D Camera
3D-A5000 Series
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Cognex’s 3D-A5000 series is an area scan 3D camera designed to capture high-resolution 3D images. It features 3D LightBurst technology which rapidly acquires images to maximize throughput. High-resolution 3D images combined with industry-leading Cognex 3D vision tools enable reliable and accurate solutions to applications such as assembly verification, in-line measurement, and robotic guidance.
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High-speed 3D Solder Inspection Machine
YSi-SP
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a high-speed 3D solder paste inspection machine that enables high-speed high-accuracy inspections based on our “1-head solution” concept for using a single type of head to handle various inspections. It is used to inspect the printing quality (volume, height, area, misalignment) of solder paste after it has been printed onto PCBs. Available April '18.
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Open eVision 3D Studio
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Ease the configuration and the setup of a laser triangulation scanner using the Coaxlink Quad 3D-LLESimplify the calibration procedureDisplay interactive Depth Maps, 3D Point Clouds and ZmapsFree of charge
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Optical 3D Measuring Systems & Devices For Your Quality Assurance
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As a manufacturer of optical industrial metrology, we offer a broad portfolio of optical 3D measuring systems & devices to support companies in various industries with precise quality assurance in production. Based on Focus Variation technology, our measuring systems not only enable surface roughness measurement, but also the detection of micro-geometries, shapes and structures.
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3D And 2D Visualization Software
3DViz
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The 3DViz software provides intuitive 2D and 3D visualization of high-definition sensor data. Software allows strain or temperature data from an ODiSI system to be visualized directly on a 3D CAD model or a 2D image.
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Product
SPI | AOI | AXI
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Suitable for a wide variety of SMT applications, Omron’s automated inspection solutions are designed to ensure the highest degree of quality and consistency in PCB production.
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Teledyne PDS Liteview Freeware 3D Viewer for PDS Data Files
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Teledyne PDS LiteView is a freeware 3D viewer that can be used to view Teledyne PDS data files. The viewer will read the Teledyne PDS logdata files, grid model files, 3D design model files and GeoTIFF files. The multibeam and laserscanner data will be extracted from the logdata files and will be visible in the viewer.
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3D Metrological Software
InnovMetric PolyWorks
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Powerful metrological software which can effectively process vast amounts of data from 3D scanners in real time. Due to its modular architecture the software covers a large number of applications: one-point inspection by touch measurement systems, scanned data processing and data comparison to CAD models or complete reverse engineering – CAD model creation.
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Robust RISC-based DIN-rail Fanless Embedded System With I.MX 6UL Processor, COM, SPI, I2C, 2 LANs And DIO (2-in/1-out)
IFB125
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The IFB125 is powered by the low-power Freescale i.MX6UL processor in the ARM® Cortex™-A7 micro architecture. It supports extended operating temperature ranging from -40°C to 70°C, and can withstand vibration up to 5G. Its flexible wide voltage range 9V - 48V DC power input with a lockable terminal block type connector also enhances its reliability in harsh environments. To meet most of Industrial IoT needs, the IFB125 supports multiple communication interfaces for maximum flexibility, including LAN, serial, USB, and digital I/O ports. The Industrial IoT gateway has 256MB onboard memory that features data transfer rates of DDR3-1600, as well as 4GB eMMC flash memory onboard for storage. This embedded IoT gateway platform is equipped with one PCI Express Mini Card slot and one SIM card slot. Additionally, it supports DB9 connectors with both SPI and I2C function as communication protocols to suit for specific applications
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3D CT Micro Or Nano Tomography And Digital Radioscopy Compact System
EasyTom
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Versatility for a wide variety of applications and analysable products. 6 motion axis. Large volume Inspection.
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Breakout - General Purpose USB to GPIO+SPI+I2C
FT232H
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This chip from FTDI is similar to their USB to serial converter chips but adds a ''multi-protocol synchronous serial engine'' which allows it to speak many common protocols like SPI, I2C, serial UART, JTAG, and more! There''s even a handful of digital GPIO pins that you can read and write to do things like flash LEDs, read switches or buttons, and more. The FT232H breakout is like adding a little swiss army knife for serial protocols to your computer!
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Digital Image Correlation System for Complete 3D Warpage, Thermal Expansion, and Strain Analysis of Materials and Components in the Heating and Cooling Phase
Q-400 TCT
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The Q-400 TCT system is designed for complete three-dimensional and highly sensitive warpage, thermal expansion measurement and strain analysis of materials and components in the heating and cooling phase. Areas from 50 mm x 70 mm down to 2 mm x 3 mm can be investigated. Measurements can be done from room temperature up to 300°C and down to -40°C. The system is specially suited for thermal expansion measurement of electronic components and is frequently used in the development and testing of complex anisotropic materials, components, and structures in electronic applications.
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3D Image Processing Software
EyeVision
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EyeVision is the base for numerous measurement and inspection tasks in image processing. Features are: Creation of inspection programs with drag and drop function. EyeVision supports all hardware platforms such as; Smart Cameras, Vision Sensors, PC & Embedded support.
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3D Sensors
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*Up to 38500 distance values per measurement for a detailed assessment of the application*Configurable outputs*Visual assessment of distance, level or volume*Predefined function blocks*Time-of-flight measurement principle
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3D AOI with Revolutionary New 3D Measurement
Zenith
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The Zenith 3D AOI system measures the true profilometricshape of components, solder joints, patterns and even foreignmaterial on assembled PCBs with true 3 dimensional measurement, overcoming the shortcomings and vulnerabilities of 2D AOI.
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High-Speed Multi-IO SPI Host Adapter
BusPro-S™
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The BusPro-S High-Speed Multi-IO SPI Host is designed with speed, versatility, and value in mind. Featuring a 60 MHz clock rate with up to 200 Mb/s throughput and support for standard, dual, quad, and 3-wire modes, the BusPro-S is the right tool for all SPI debugging applications-present and beyond.
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3D Ground Penetrating Radar data processing & Interpretation software
Condor
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Condor is modern processing, visualisation and interpretation software for the efficient management of Raptor 3D GPR array data.Boost performance and improve workflows.- Efficient sub-surface imaging- Effective workflows- Simple and intuitive- Dedicated to processing Raptor data- Modern Windows software (64-bit)
