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BGA
Surface mount chip package, which uses solder balls for its connectors.
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Signal Integrity Evaluation up to 50 GHz
N5225BT
The N5225BT provides the N5225B 50 GHz PNA, application software including PLTS and Enhanced TDR and accessories for signal integrity evaluation of cables, backplanes, and BGA packages.
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BGA Sockets
Our BGA socket platform takes advantage of the H-Pin®, a high-performance stamped spring probe pin, to provide a pure vertical contact system that meets all BGA design challenges at an enabling cost.
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2D/3D AOI Series
MV-6e
- Exclusive10MP/18MPCameraTechnology- Precision Telecentric Compound Lens Design- Eight Phase Color Lighting System- 10MP / 18MP SIDE-VIEWER® Camera System- Extremely Simple Programming and Operation- Integrated INTELLI-SCAN® Laser Inspection System- 3D Co-Planarity Inspection of Gull-Wing Leads, BGA and CSP - - -- Devices- Enhanced 3D Solder Paste Height Measurement Capability- INTELLISYS® Industry 4.0 Intelligent Factory Automation System
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Test Socket Based Elastomeric Matrix Connectors
Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc.
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Stamped Spring Pin Sockets
Ironwood Electronics SBT sockets are small footprint sockets that are compatible with other product lines such as GHz elastomer sockets, Giga-Spring sockets, etc. The socket needs about 2.5mm extra space around the chip than the actual chip size utilizing only very small PCB real estate. A heat sink screw on the top provides the compression force as well as thermal relief and can be customized to dissipate more power. SBT socket uses SBT contact technology for high endurance and wide temperature applications. SBT Contact is a stamped contact with outside spring as well as inside leaf spring that provides a robust solution for Burn-in & Test applications. Solutions are available for 0.3mm to 1.27mm LGA, BGA, QFN, QFP, SOIC and other packages. Contact technology has 3 part system which includes top plunger, bottom plunger and a spring. The Beryllium Copper plungers are stamped and assembled to a stainless steel spring in an automated system to enable fast turnaround time, low cost and zero defects.
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Silver Button Sockets
For BGA, QFN, or LGA applications, GTP contact technology provides >94 GHz signal speed and can additionally be used in high cycle life applications such as ATE. These sockets support pitches from 0.2 mm to 1.27 mm. Ironwood's GT sockets are ideal for prototyping and testing almost any BGA device application. These IC sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss (1dB at 94GHz) and supports BGA packages with pitches down to 0.2mm was utilized in these sockets. GT BGA sockets are mechanically mounted over a target system's BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry's smallest footprint).
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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X-ray Inspection System
NEO-690Z / NEO-890Z
Off-line Microfocus X-ray Inspection System equipped with PONY ORIGINAL Direct Conversion X-ray Camera; SID-A50. Suitable for inspection of BGA, CSP, and LGA on PCB.
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Low Power MIPI Bridging Solution With Integrated Flash
CrossLinkPlus
*Instant-on (< 10 ms) configuration with integrated flash memory*Integrated flash enables flexible reprogramming in the field*Two 4-lane MIPI D-PHY transceivers at 6 Gbps per port*11 programmable, source synchronous I/O pairs for camera and display interfacing*Available in small 3.5 mm x 3.5 mm BGA package with 0.4 mm pitch*Comprehensive library of IP and reference designs, compatible with CrossLink
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Advanced Diagnostics for ScanExpress™ JET JTAG Embedded Test Solutions
ScanExpress JET Advanced Solutions
ScanExpress JET advanced diagnostics add additional diagnostic resolution with fully automated analysis translating functional test results to down to the net and pin level, even with BGA packages.The seamless integration with ScanExpress JET and ScanExpress Runner as well as the ability to output ScanExpress Viewer fault reports for PCB visualization make ScanExpress JET Advanced Diagnostics a must-have tool for any JTAG test system.
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DDR3 X16 Non-Stacked DRAM BGA Interposer For Logic Analyzers
W3636A
The W3636A DDR4 x16 BGA interposer allows you to gain signal access to the DDR3 signals critical to your debug and validation effort through a logic analyzer. The probe works in existing designs and eliminates the need for up-front planning or redesign. The probe connects directly to the balls of the DDR3 x16 non-stacked DRAM or with an optional 3rd party socket (not provided) enabling operation and acquisition of high-speed DDR3 signals without impacting the performance of your design.
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Ultra High Speed Pick & Place
MC889
The MC889 is specially designed for the fast and highly precise loading of large batch sizes. This pick and place machine is equipped with an optical centering, "Vision on the Fly" system that guarantees the best possible measurement of SMD components (such as 0201, SOIC, PLCC, BGA, µBGA, CSP & QFP, as well as odd-shaped components) while completing placement at rates of 20,000 CPH.
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Fine Pitch Probes
Fine pitch probes are spring contact probes with pitches between 0.10 / 4mil and 1.00mm / 40mil.In this pitch, direct soldering and the use of mounting receptacles is usually no longer possible. Therefore, almost all fine pitch probes are designed as double-sided spring-loaded contact probes. Fine pitch probes are installed in corresponding test sockets, which enable exact contacting of the test points. Feinmetall fine pitch probes are suitable for common components such as BGA, LGA, QFP, QFN or WLCSP. Precision and 100% quality control characterize these probes.In smaller pitches of 60 – 300µm, carrier needles (beams) are also used.
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BGA Socket Adapter Systems
Advanced Interconnections Corp.
BGA Socket Adapter Systems convert surface mount device packages to through hole (pinned) assemblies, making it easy to plug and unplug SMT devices whether you are planning for future device upgrades, field programming at point of use, or need the ability to quickly swap out device packages in the field or the test lab. Protects valuable PC boards and saves time by eliminating the need to desolder packages during device removal.
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PMC Module
PMC-CycloneII-64LVTTL
User Programmable Altera Cyclone II FPGA 672 BGA, EP2C35, EP2C50, EP2C70, Stand alone possibility, Single wide PMC Module, 64 LVTL, Optional User clock oscillator
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High-Throughput Film Frame Handler
MCT FH-1200
FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
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Computer-On-Module
Open Standard Module (OSM)
OSM form factor is the first computer-on-module form factor for solderable BGA mini modules that is natively capable of supporting both ARM and x86 designs. OSM modules are significantly smaller than previously available modules, with the largest measuring 45mm x 45mm. For a growing number of IoT applications this standard helps to combine the advantages of modular embedded computing with increasing requirements regarding cost, foot print and interfaces. The BGA design makes it possible to implement more interfaces on a small footprint. The largest Size-L (Large) measures 45mm x 45mm with 662 BGA pins. The modules are completely machine processible during soldering, assembly and testing.
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HDMI/DVI Receivers
HDMI® receivers and DVI receivers remain in high demand for professional, consumer, and automotive video applications, with HDMI nodes constantly increasing. Analog Devices offers a range of HDMI/DVI receivers that enable high quality conversion of digital video data to formats such as HDMI, MIPI, and TTL. Applications include video distribution, gaming, and HDMI/DVI consumer device connectivity for automotive infotainment systems. Our portfolio of HDMI receivers and DVI receivers offers competitive advantages such as automotive qualification, superior HDMI/DVI equalizer performance, comprehensive audio extraction, and small packages (6 mm × 6 mm, 0.5 mm pitch BGA).
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BGA Sockets
Ironwood has the most comprehensive collection of BGA (Ball Grid Array) sockets that can be used for prototype application, silicon validation, system development, thermal characterization, burn-in application, functional production test, etc. BGA socket can be defined as an electromechanical device, which provides removable interface between IC package and system circuit board with minimal effect on signal integrity. BGA sockets for prototype applications, silicon validations, system development applications uses low cost elastomer contact technology.
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DDR4 BGA Interposers, DDR4 DRAM X4/x8 Packages
N2114A
The N2114A DDR4 BGA interposers provide signal access to the clock, strobe, data, address and command signals to the DDR4 BGA package for making electrical and timing measurements with an Infiniium oscilloscope. With the DDR4 JEDEC specification defined at the DRAM ballout, the BGA probe adapter provides direct signal access to BGA package for true compliance testing.
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Test Sockets & Interposers
Silmat
Innovative technology platforms and multiple product families for BGA, LGA, QFN and CSP packages down to 0.3mm pitch. High frequency bandwidth > 40 GHz..
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Flexible Pick & Place Machine W/ 64-feeder Capacity
MC400
The MC400 Pick and Place machine places an enormous range of components, quickly and accurately, from 0201s through 100 x 150 mm SMDs, including BGAs, MBGAs, CSPs, µBGAs, MLFs, flip chips, odd form components and ultra-fine-pitch parts down to 15 mil. The system is easy to program and operate and comes standard with universal CAD conversion and teach-in capability.
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Detective Logic Analyzer
LPDDR3
Provides logic analyzer like deep transaction Listing and Waveform captureCan store up to 1G of captured States at 1600MT/sContinuous, real time analysis, not post-processingEye Detector guarantees valid data acquisitionExtensive Triggering and Storage Qualification allows precise insightProtocol Violation Detector provides hundreds of simultaneous, real time tests to JEDEC specificationsMode Register Listing providedSupports Auto-Clock rate detect and clock stoppageConnects to the target under test with Flying Lead, BGA interposers or a midbus probeIntegrated Microsoft Charts gives quick insight into large trace capturesTrigger In & Out allows the Detective to integrate with other test tools
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Futureproof Your Control PLD And Bridging Designs
MachXO3
*Up to 9400 LUTs with up to 384 I/O pins*Instant-on 1 ms boot-up with background upgrade, Hitless I/O reconfigure and dual-boot error recovery*Available with 3.3/2.5 V core or low power 1.2 V core – including additional options on 9400 LUT devices*MachXO3LF includes programmable Flash and User Flash Memory (UFM)*Available in amazingly small (2.50 x 2.50 mm, 0.4 mm pitch) WLCSP packages and BGA packages with 0.50 mm and 0.80 mm pitch
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For Real-Time X-ray Inspection Systems
Image Processors
A number of image processing software packages are available. Features include frame averaging, measurement, text, label, marking, 3-D rendering, video recording and image storage. Additionally, BGA analysis and void measurement software can be added as well as other options. See our image processors for x-ray inspection machines below.
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Single Site Test Handler
3210
Chroma Single Site Test Handler 3210 supports various package types such as BGA series, QFP series, QFN, TSOP, and more. The handler is primarily designed for early device design and engineering validation.
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Write!BEFORE Socket Programmer
Socket Adapters are printed circuit boards that connect the programming sites to the base unit. The Socket Adapter (SA) includes the appropriate socket (DIP, SDIP, SOIC, QFP, BGA) and the appropriate electrical connections for programming a specific device.
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BGA Rework Station
PDR IR-E6 Evolution
The PDR IR-E6 SMT/BGA rework system, using PDR’s patented Focused IR technology, has been specifically designed to cope with the challenges of repairing today’s Large PCB assemblies.
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Soldering Inspection Video Microscope
MS-1000
The MS-1000 is a highly portable microscope for exclusive use with BGA, CSP, and QFP. It is highly efficient in inspecting portions which cannot be inspected by the X-ray inspection method.Specifically, it is efficient for inspecting the following conditions: fillets of soldered balls, melted condition of soldered parts, cracks, defective soldering, etc.
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GHz Elastomer Sockets
Ironwood’s GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA or QFN device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. Innovative elastomer interconnect technology that delivers low signal loss up to >40GHz and supports BGA or QFN/MLF pitches down to 0.3mm was utilized in these sockets. GHz BGA sockets are mechanically mounted over a target system’s BGA lands using mounting and alignment holes at proper locations (page 2 of the individual socket drawing shows recommended PCB layout information). These low-profile sockets are only 2.5 mm per side larger than actual IC packages (industry’s smallest footprint). They support IC devices with body sizes ranging from 55mm down to 1mm. Larger body sizes may require a backing plate. If the backside of the target PCB contains capacitors and resistors, a custom insulation plate with cavities cut for those components can be designed. This insulation plate sandwiches between the backing plate and target PCB.
