Semiconductor Test
prevails upon the DUT to demonstrate It's fulfillment of test requirements.
See Also: ATE
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Highest Demanding Finishing Processes
Ismeca NY32
32-position turret platform for semiconductor test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as intelligent features enables extended autonomous operation and productivity.
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Highest Throughput For Fragile Devices
Ismeca NY20
20-position turret platform for semiconductor test, inspection and packaging, provides the highest quality yield and throughput. It integrates innovative hardware and software technology such as intelligent features that enable extended autonomous operation and productivity.
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Differential Picosecond Pulse Generators
PicoSource PG900 Series
The fast-transition pulse can stimulate a transmission path, device or network with a broad spectrum signal in a single instant. Such a pulse is very useful for many of the high-speed broadband measurements that we need to make; for instance in time-domain reflectometry, semiconductor test, gigabit interconnect and port test and in radar.
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Wafer Test
WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
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Custom Test Fixtures
For popular high speed components like semiconductor packages, and test contactors, we have developed a custom test fixture which allows the use of high bandwidth microprobes to measure virtually any I/O pin, according to GigaTest's methodology and requirements.
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Electrical Probe Systems
INSTEC's Probe Systems offer an integrated solution for performing component-level electrical measurements over a wide temperature range.Compact Mini Probe Stages enable an existing inspection microscope or optical test setup to be converted easily into a precision temperature-controlled semiconductor testing and qualification station.Analytical probe stations are fully featured industry-standard platforms for all modern probing applications and testing.Benchtop Probe Stations provide the user with four independent electrical probes with X,Y,Z micropositioning for precise placement without opening the sample chamber.Highly configurable probe systems meet a range of requirements for atmospheric and temperature control, sample areas, and electrical measurements.
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MPI Advanced Technologies & Accessories
MPI Advanced Semiconductor Test
MPI become very fast the truly innovation leader in the Advanced Semiconductor Tests market. By offering wide range of system’s accessories and unique advanced technologies, such as Automated Test over Multiple Temperatures ATMT™, NoiseShield™, PHC™, VCE™, mDrive™, MPI is offering variety of complete test solutions at highest value.
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Semiconductor
Copper Mountain Technologies USB VNAs provide a low-cost semiconductor testing option, offering measurement speeds on the order of 10,000 points per second while maintaining 80-90 dB dynamic range, are uniquely suited for deployment into such demanding scenarios. Additional considerations for these applications include availability of external trigger inputs and outputs, amenability to external program control, size of the instrument, and parallel processing capability.
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Signal Generators
2, 4 and 8 Channel Arbitrary Waveform Generator and Pulse Pattern Generator solutions are ideal choice in automated test benches, for physics experiments, semiconductor tests, analog and digital debugging.
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PXI Switched Guard Reed Relay Module, 13x SPST
40-121-002
The 40-121-002 provides 13x SPST switches in a single slot PXI module and designed to provide an isolation resistance in excess of 1013Ω. It has been designed to ensure high isolation resistance through the use of switched guards, making it ideal for low level measurements and semiconductor test.
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Semiconductor
With ultra-multi pin count and fine pitch, our general-purpose IC socket lineup corresponds to every need. For semiconductor burn-in sockets for thermal acceleration tests, and test sockets for semiconductor electrical testing, we continue to hold a high market share all over the world.
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Semiconductor Testers
Our integrated team of semiconductor test innovators delivers a complete system tailored to achieve your specific objectives, incorporating:Test strategyHardware designSoftware development and integrationManufacturingInstallationProgram managementOngoing support
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µHELIX® Test Probes
Series S200, S300, S400, and S500
Test Probes for fine-pitch applications: CSP, BGA, SiP, SoC, flex-circuits, micro pcb, sub-mm center-to-center spacing, half mm, quarter mm spacing. Excellent for use in sockets, fixtures, and contactors for semiconductor testing and in coaxial installations.
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2-Slot BRIC, 256x4, 1Pole, PXI Matrix (2 Sub-cards)
40-559-201-256x4
This range of BRIC ultra-high-density large PXI matrices are available in 2, 4 or 8-slot PXI sizes to suit all high-performance matrix requirements and are constructed using Pickering Electronics' 4mm x 4mm instrumentation quality reed relays. With their high level of switching density, these PXI matrices allow a complete Functional ATE system to be housed in a single 3U PXI chassis and allow the use of much lower cost 8 or 14-slot chassis. The 40-559 matrices can be used in many industries; typical applications include automotive ECU and semiconductor package testing. Dual analog busing for the narrower matrix options, enable completely separate matrices within a single module for parallel testing.
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Lan Digitizer / Oszilloscope With 16 Bit, 4 Channels 100 MS/s Up To 8 GS Memory
The GaGe series of Faceless Connected Instruments (FCiX) provide test and measurement professionals new options for integrating high resolution, multi-channel digitizers into Ethernet and LAN enabled measurement systems. The applications served include manufacturing test, automotive test, remote communications monitoring, multi-site semiconductor test, and other solutions where a lightweight but powerful, multi-channel, independent digitizer system is required.
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PXI-5670 , 2.7 GHz RF Vector Signal Generators
778768-04
2.7 GHz PXI Vector Signal Generator—The PXI‑5670 has the power and flexibility you need for product development applications from design through manufacturing. It can generate custom and standard modulation formats such as AM, FM, PM, ASK, FSK, PSK, MSK, and QAM. The PXI‑5670 delivers a highly flexible and powerful solution for scientific research, consumer electronics, communications, aerospace/defense, and semiconductor test applications as well as for emerging areas including software defined radio, radio frequency identification (RFID), and wireless sensor networks.
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FCB Probe Card
The FCB Probe Card is the most mature technology of buckling beam probe card. It is aimed to achieve the semiconductor ship manufacture time-to-market (TTM) and cost of test (COT) demand. FCB is a proven solution for a variety of semiconductor production tests from early engineering pilot-runs to high volume manufacturing (HVM). FCB is ready for device requiring high signal integrity probing (SI) and/or power integrity probing (PI). Applications include cutting-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB guarantees the world’s best overall cost-of-ownership (COO) for various DUT applications.
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Semiconductors Testing
Our Testers support the production lines of variety of products such as 40/100 GBps Mux/DeMux, LNA, WiMAX RF Transceivers, Microwave & Millimeter Wave components. This high reliability products are being used in (a) Networking & Communications (b) Consumer Electronics (c) Military & Space
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PXI-5670, 2.7 GHz PXI Vector Signal Generator
778768-02
2.7 GHz PXI Vector Signal Generator—The PXI‑5670 has the power and flexibility you need for product development applications from design through manufacturing. It can generate custom and standard modulation formats such as AM, FM, PM, ASK, FSK, PSK, MSK, and QAM. The PXI‑5670 delivers a highly flexible and powerful solution for scientific research, consumer electronics, communications, aerospace/defense, and semiconductor test applications as well as for emerging areas including software defined radio, radio frequency identification (RFID), and wireless sensor networks.
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Semiconductor Test
Ismeca NY32
32-position turret platform for semiconductor test, inspection and packaging, providing the highest process integration capabilities. Integrating innovative hardware and software technology such as Intelligent Features that enables extended autonomous operation and productivity.
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PXI Switched Guard Reed Relay Module, 26x SPST
40-121-001
The 40-121-001 provides 26x SPST switches in a single slot PXI module and designed to provide an isolation resistance in excess of 1013Ω. It has been designed to ensure high isolation resistance through the use of switched guards, making it ideal for low level measurements and semiconductor test.
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LXI High Voltage Matrix 2-Pole 100x2
60-310-102
The 60-310 is a 2-pole Matrix Module available in 300x2, 200x2 and 100x2 formats. It is capable of cold switching 1000VDC and has a maximum carry current of 1A. It is designed for high voltage applications including circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing. The 60-310 is designed in accordance with the LXI Standard 1.4 and is supplied in a 2U high, full rack width case with 500mm depth.
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Packaging Manufacturing
KLA’s extensive portfolio of packaging solutions accelerates the manufacturing process for outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries for a wide range of packaging applications. Innovations in advanced packaging, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP), fan-out wafer-level packaging (FOWLP) and heterogeneous integration as well as a wide range of IC substrates create new and evolving process requirements. KLA offers systems for packaging inspection, metrology, die sorting and data analytics focused on meeting quality standards and increasing yield before and after singulation. SPTS provides a broad range of etch and deposition process solutions for advanced packaging applications. Orbotech offers a portfolio of technologies that includes automated optical inspection (AOI), automated optical shaping (AOS), direct imaging (DI), UV laser drilling, inkjet/additive printing and software solutions to ensure manufacture of the highest quality of IC substrates.
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PXIe-5672, 2.7 GHz, 20 MHz Bandwidth Digital Upconverter Included, PXI Vector Signal Generator
779900-02
2.7 GHz, 20 MHz Bandwidth Digital Upconverter Included, PXI Vector Signal Generator —The PXIe‑5672 features quadrature digital upconversion, which reduces waveform download and signal generation time. It is a general-purpose vector signal generator that can generate standard modulation formats such as AM, FM, PM, ASK, FSK, MSK, GMSK, PSK, QPSK, PAM, and QAM. The PXIe‑5672 delivers a highly flexible and powerful solution for scientific research, consumer electronics, communications, aerospace/defense, and semiconductor test applications as well as emerging areas including software defined radio, radio frequency identification (RFID), and wireless sensor networks. For specific communications standards, you can use various software add-ons to generate modulated signals according to standards such as WCDMA, DVB‑H, and ZigBee.
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Lan Ethernet Digitizer, 14 Bit, 8 Channel 125 MS/s Up To 8 GS Memory
Octopus-X
The GaGe series of Faceless Connected Instruments (FCiX) provide test and measurement professionals new options for integrating high resolution, multi-channel digitizers into Ethernet and LAN enabled measurement systems. The applications served include manufacturing test, automotive test, remote communications monitoring, multi-site semiconductor test, and other solutions where a lightweight but powerful, multi-channel, independent digitizer system is required.
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LXI High Voltage Matrix 2-pole 200x2
60-310-202
The 60-310 is a 2-pole Matrix Module available in 300x2, 200x2 and 100x2 formats. It is capable of cold switching 1000VDC and has a maximum carry current of 1A. It is designed for high voltage applications including circuit board isolation testing, relay testing, semiconductor breakdown monitoring and cable harness insulation testing.
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PXIe-4163, 24-Channel, ±24 V, 50 mA PXI Source Measure Unit
784483-01
PXIe, 24-Channel, ±24 V, 50 mA PXI Source Measure Unit—The PXIe-4163 is a high-density source measure unit (SMU). It features 4-quadrant operation with a current resolution of 100 pA and the ability to sample up to 100 kS/s. The module also offers the ability to maximize stability and measurement accuracy with SourceAdapt, which allows you to custom-tune the transient response to match the characteristics of any load. The PXI-4163 is ideal for a broad range of mixed-signal integrated circuits (ICs) in semiconductor production test.
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PXIe-5672, 2.7 GHz, 20 MHz Bandwidth Digital Upconverter Included, PXI Vector Signal Generator
779900-01
2.7 GHz, 20 MHz Bandwidth Digital Upconverter Included, PXI Vector Signal Generator —The PXIe‑5672 features quadrature digital upconversion, which reduces waveform download and signal generation time. It is a general-purpose vector signal generator that can generate standard modulation formats such as AM, FM, PM, ASK, FSK, MSK, GMSK, PSK, QPSK, PAM, and QAM. The PXIe‑5672 delivers a highly flexible and powerful solution for scientific research, consumer electronics, communications, aerospace/defense, and semiconductor test applications as well as emerging areas including software defined radio, radio frequency identification (RFID), and wireless sensor networks. For specific communications standards, you can use various software add-ons to generate modulated signals according to standards such as WCDMA, DVB‑H, and ZigBee.
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Semiconductor Large Range Type Tester
HS-PSTT
HS-PSTT large Range Type Tester is a high-grade semiconductor material Type testing equipment,has the feature that testing large range,special suitable for testing the high-Resistivity Silicon Material(contains Silicon Core, phosphorus stick, Boron stick and so on),the resistivity require range is 0.0001～19999Ω·cm, Covers all measurement requirements of various silicon material type testing at the semiconductor and solar energy level at present .
