Flash Memory
retains data absent of power. Also known as: Flash Device
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Product
PLD ISP Feature, GTE 10.00p
K8220A
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The PLD ISP feature allows the test developer engineer to specify a configuration bitstream file in VCL digital test file, much like programming a Flash memory device. The PLD ISP feature supports multiple PLD configuration data formats are supported including. Serial Vector Format (SVF), Standard Test And Programming Language (STAPL), Jam, Jam Byte Code (JBC) object files.
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Product
In-System Programmers
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Xeltek in-system programming tools provide a convenient method for configuring microcontrollers and various serial devices. Users could simply program microcontrollers, Flash memories, PLDs, and FPGAs via the ISP cable. Devices are programmed in the target system or target hardware, making field applications more convenient than ever. Typically, a jumper/DIP switch enables in-system programming and a set of serial programming connector (such as an IDC connector) connects the target board(s) to the ISP programmer(s).
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Product
6U I7 PXI Controller
GX7927 Series
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The GX7927 is a Single Board Computer (SBC) that features the high performance, highly integrated Core i7 processor platform from Intel. Core i7 offers an integrated graphics and memory controller plus dual core processing, operating at speeds up to 2.53 GHz. Coupled with the Mobile Intel QM57 Express Chipset, the GX7927 provides an unmatched level of I/O bandwidth for both onboard and off-board functions. The module is supplied with 4 GB of DDR3 SDRAM and 16 GB of NAND Flash memory. Both standard and extended temperture operation range versions are available.
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Product
Universal Programmers
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Xeltek engineers work around the clock to maintain the largest device library in the industry, so new devices are being added on a daily basis for EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR), BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, and MCUs. The majority of SuperPro universal programmers come equipped with a ZIF socket supporting up to 144 pins for programming a wide range of DIP devices; other chip package supported includes SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, and SCSP.
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Product
Probes And Cables
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The iProbe is an intelligent temperature sensor that can be calibrated independently of SBIR’s blackbody systems or 104i precision thermometers. These ultra-stable, highly responsive iProbes are used to provide long term accuracy and repeatability of under 0.010°C. Each iProbe incorporates onboard flash memory that allows all calibration constants and calibration date information to be stored independently of the blackbody or thermometer system. This allows iProbes to be exchanged for use on a blackbody or thermometer without any loss in stability or accuracy. To re-calibrate a system you need only exchange the current iProbe with a recently calibrated one. No special equipment is required and there is no down time in the test area.
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Product
Multibus Ethernet Card
MS 1750
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- Processor: LPC3250 processor with ARM 9 core running at 266 MHz- SDRAM Memory: DDR2 256 MB (scalable to 512 MB)- Flash Memory: NAND flash 512 MB- Display & Graphics: Programmable color LCD controller supports up to a TFT interface- Touch screen: Integrated touch screen controller- Network Support: 10/100 Base-T Ethernet PHY- PC Interface: One USB 2.0 high-speed On-the-Go interface- Multibus Interface- Serial Interfaces: Up to four external UARTs- CAN 2.0B controller- Three I2C ports- Three SPI ports- GPIO: Programmable I/O depending on peripheral requirements
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Product
16GB ECC DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GE56-SB
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SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
32GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V32GR56-SB
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SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
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Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
4G DDR4-3200 512X16 1.2V SAM -20~85℃
AQD-SD4U4GN32-SP2
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
16GB ECC SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GE56-SB
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SAM Original Chip, Anti-sulfuration, PCB: 30μ gold finger. Independent Power Management IC build-in, ECC function support.
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Product
ARM 9 System on Module
MS 1515
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- Processor: LPC3250 processor with ARM 9 core running at 266 MHz SDRAM- Memory: DDR2 256 MB (scalable to 512 MB)- Flash Memory: NAND flash 512 MB- Display & Graphics: Programmable color LCD controller supports up to a TFT interface- Touch screen: Integrated touch screen controller- Network Support: 10/100 Base-T Ethernet PHY- PC Interface: One USB 2.0 high-speed On-the-Go interface- Serial Interfaces: Up to four external UARTs- + CAN 2.0B controller- + Three I2C ports- + Three SPI ports- GPIO: Programmable I/O depending on peripheral requirements- Mechanical: 60 mm wide x 60 mm long x 5.4 mm high
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Product
8GB SO-DIMM DDR5-5600 262Pin 1GX16 1.1V Unbuffered Hynix Chip
AQD-SD5V8GN56-HC
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Hynix Original Chip, Increased Banks and Burst Length, DDR5 5.6GT/s. Same-Bank Refresh, On-die ECC for Enhanced RAS.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
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Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
32GB DDR4-3200 2GbX8 1.2V Samsung Chip
AQD-D4U32GN32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
16G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V16GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
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DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
32G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V32GN56-SBH
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SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
16GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-SD4U16GN32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
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SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
Industrial Memory DDR2 Memory
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SQRAM DDR2 memory modules deliver 667/800 MT/s frequency with longevity support for legacy markets.
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Product
Flash Meters
SF 100
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Flash meters for measurement of illuminance time response of rapid changing light sources (flashes, rotating beacons).
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Product
Memory Tester
SP3000
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CST is proud to offer a portable stand alone and affordable memory tester, combining DIMM and SODIMM testing capability all on the same universal base unit with optional easy plug-on test adapters.
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Product
Laser Flash Photolysis
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This system that makes complex electronics, cumbersome software and large optical benches a thing of the past. The LFP system incorporates everything needed except the excitation laser. This is a simple, yet powerful instrument, ready to perform a wide range of time resolved kinetic and spectroscopic measurements involving transient absorption or diffuse reflectance. The LFP system, including the monochromator and digitizer is completely computer controlled, making it easy to obtain
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Product
Memory
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Renesas is renowned for its product lifetimes, and our memory products are no different. Our wide range of low power SRAM products provide high reliability, stable supply and long lifetime support often not found in these devices, making them ideal for industrial designs. Renesas’ ultra-fast QDR™ (Quad Data Rate) SRAMs are ideal for next-generation high bandwidth communication systems that require memories capable of very high operating frequencies combined with low latencies and full cycle utilization. Our EEPROM realizes high speed, low power consumption and a high level of reliability by employing advanced MONOS memory technology, a CMOS process and low voltage circuitry technology.
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Product
Volatile Memory
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CAES offers an extensive volatile memory portfolio developed to handle the demands of harsh space and terrestrial environments.
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Product
Memory Analyzers
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Market drivers in the memory sector have changed. Gone are the days of simply pushing Moore’s Law to ever faster data rates. The memory designs of today and tomorrow must also be smarter than ever before. Today, handheld and wearable computers must draw from a limited battery reserve while serving up fast, responsive, and compelling mobile experiences. Meanwhile the cloud of data centers and server farms that feed us these compelling experiences must continuously grow while simultaneously reducing overhead and environmental impact. These two different markets have the same goals: smarter memory, smarter control systems, and lower power usage.
