Flash Memory
retains data absent of power. Also known as: Flash Device
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Product
CPCI Dual Industry Pack Carrier
CPCI-6713-2 IP
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The board consists of private SDRAM and Flash memory attached to the 300 MHz, TMS320C6713B floating point DSP. An FPGA provides the timing and control. Peripherals include a serial port and connectors for IP mezzanine boards. Flash memory is available for downloading programs into a nonvolatile memory. A PCIbus connector provides the interface to the host computer.
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Product
32GB R-DDR5 5600 R-Dimm 2GX8 1.1V SAM
AQD-D5V32GR56-SB
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, Compatible with server platform, 30u” golden finger, Operating Temperature: 0°C ~ 85°C.
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Product
16GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
4G DDR4 2400 288Pin 512MBX8 1.2V Registered Samsung Chip
AQD-D4U4GR24-SG
Memory Module
DDR4-2400 Registered DIMM. – standard height, 30μ" gold plating thickness (IPC-2221 Standard) 1.2V power consumption. Low-power auto self- refresh (LPASR) Provides better reliability, availability and serviceability (RAS) and improves data integrity.
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Product
16GB SO-DDR5-5600 2GX8 1.1V SAM
AQD-SD5V16GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
32GB DDR5-5600 2GX8 1.1V SAM
AQD-D5V32GN56-SB
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
16GB DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-D4U16GE32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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Product
32G SO-DDR5-5600 2GX8 1.1V SAM -20~85℃
AQD-SD5V32GN56-SBH
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
8GB DDR4 SODIMM-3200 1GbX8 SAM
AQD-SD4U8GN32-SE
Memory Module
DDR4 3200Mhz Unbuffered SO-DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance, 1.2V power consumption. Samsung original chip, 100% tested for stability, compatibility and performance.
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Product
SODIMM DDR4 3200MT/s
SQR-SD4S
Dual In-Line Memory Module (DIMM)
Original Hynix IC chips adopted, Data transfer rate: 3200MT/s. Capacity: 4/8/16/32GB, Operating temperature: 0 °C ~ 85 °C Lifetime warranty.
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Product
4G DDR4-3200 512X16 1.2V SAM -20~85℃
AQD-SD4U4GN32-SP2
Memory Module
SAM Original Chip, Industrial Design for Improved Reliability, PCB: 30μ gold finger. Anti-sulfuration, Semi Wide-temp Support -20~85℃.
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Product
Rugged SODIMM DDR4 2666/3200 Wide Temperature
SQR-YD4I
Dual In-Line Memory Module (DIMM)
Robust PCB designed with Mounting Hole with Military MIL-810G verified. Extreme Data Transfer rate up to 3200 MT/s, Capacity: up to 32GB. Wide Temperature supported: -40°C ~ 85 °C, Original IC chip (Samsung/Hynix).
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Product
8GB SO-DDR5-5600 1GX16 1.1V SAM
AQD-SD5V8GN56-SC
Memory Module
SAM Original Chip, PCB: 30μ gold finger, Anti-sulfuration, On-die ECC for Enhanced RAS, Operating Temperature: 0°C ~ 85°C.
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Product
Solid State Recorder
MS 2001
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This system is used to acquire Bi phase and DM signals from aircraft and records into FLASH memory. System has automatic frame synchronization and it is achieved through in built hardware circuit.
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Product
16GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U16GN32-SE
Memory Module
16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
8GB DDR4-3200 1GbX8 1.2V Samsung Chip
AQD-D4U8GN32-SE
Memory Module
8GB, DDR 4 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, Unbuffered.
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Product
IP-Reflective Memory
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Each IP-ReflectiveMemory can be used as a standard node or as the Master Node. Clearly labled "DIP Switches" are provided to make the selection of Master or Standard Node, and the Node Address. The Network is based on using LVDS signaling over Ethernet cabling. Nodes automatically come up for pass through operation.
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Product
DDR1 Memory
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SQRAM provides DDR1 memory modules for standard and extended temperature operations with extended longevity.
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Product
DDR5 Memory
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SQRAM DDR5 offers extreme high speed with 6400 MT/s data transfer rate and high efficiency power management.
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Product
Memory Tester
RAMCHECK LX DDR3
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Quickly test DDR3 DIMM and SO-DIMM memory. In just seconds, RAMCHECK LX will perform a thorough test of the module and provide complete identification. Also tests expensive LRDIMM modules.
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Product
CXL Memory
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SQRAM launches next-gen CXL 2.0 Memory Expansion, offering high-speed, low-latency performance to meet the needs of large AI training and HPC clusters.
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Product
Flash Diffusivity Analyzers
DLF 2800
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The Discovery Laser Flash DLF 2800 is an advanced freestanding instrument for the measurement of thermal diffusivity and specific heat capacity of materials from room temperature to 2800°C. The distinctive design incorporates a proprietary laser, laser optics, detector, and furnace technologies, and along with the unique six-position sample carousel, ensures unprecedented measurement accuracy and sample throughput. With the ability to operate in a variety of atmospheric conditions, including inert gas or under vacuum, the DLF 2800 can characterize a wide variety of materials, including polymers, ceramics, carbons, graphite, composites, glasses, metals, and alloys.
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Product
Memory Test Software
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Teradyne’s customers count on us for our Near Device Under Test (DUT) technology that gives memory device manufacturers a guaranteed performance advantage. A brief description of dynamic memory and storage memory devices will highlight why device manufacturers depend on Teradyne’s memory test solutions.
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Product
RightMark Memory Analyzer
RMMA
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Before this test packet was created there was no proper software for measuring vital system parameters such as CPU/Chipset/RAM providing steady and reliable (reproducible) test results and allowing for changing test parameters in a wide range. Vital low-level system characteristics include latency and real RAM bandwidth, average/minimal latency of different cache levels and its associativity, real L1-L2 cache bandwidth and TLB levels specs. Besides, these aspects are usually not paid sufficient attention in product technical documentation (CPU or chipset). Such test suite, which combines a good deal of subsets aimed at measuring objective system characteristics, is a must have for estimating crucial objective platform parameters.
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Product
Flash Photolysis Spectrometer
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Vernier Software & Technology, LLC
The Vernier Flash Photolysis Spectrometer is a simple, user-friendly device for demonstrating the fundamental principles of chemical kinetics and photochemistry to undergraduate chemistry students.
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Product
Flash In Card
FIC Series
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Axiomtek's FIC (Flash in Card) series complies with CompactFlash™ specification and provides complete PCMCIA-ATA functionality and compatibility. This CF card is available in memory capacities ranging from 128MB up to 32GB in standard & industrial temperature to meet the demand of critical application. The operating temperature supports standard temperature grade (0°C ~+70°C) and industrial temperature grade (-40°C ~+85°C). The FIC series is an ideal solution for industrial storage application requiring reliability, high performance, and low power consumption.
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Product
Memory Test Systems
T5503HS2
Test System
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
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Product
Flash Point Tester
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Weshine Electric Manufacturing Co., Ltd
Closed flash point tester, when the test sample is used in a closed environment (such as transformer oil), to determine the closed flash point value of petroleum products. Use touch screen instead of keyboard operation, adopt foreign advanced technology, large LCD screen LCD full Chinese display man-machine dialogue interface, full screen touch key prompt input, convenient and fast, open, fuzzy control integrated software, modular structure, in line with national standards, the United States, EU and other standards.
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Product
DRAM DDR4 Memory
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Improve performance up to 50% (compared to DDR3.) with Advantech! We offer industrial grade DDR4 2666/2400/2133 memory with 30μ" gold plating connector (288 pin), featuring 1.2v low operating voltage and faster burst accesses.
