-
product
Fibre Channel
Fibre Channel continues to evolve as the preferred communications standard for mission critical and time sensitive Storage Area Network (SAN) applications. Fibre Channel supplies over 80% of the datacenter and enterprise interconnections where lossless delivery of data is required and will be used for many years to come. Gen 6 (32GFC) products and solutions are rapidly being deployed ubiquitously across key markets today.The Fibre Channel industry is now focusing efforts on the development of Gen 7 – 64GFC utilizing PAM4 signaling – and will continue to serve those applications needing higher bandwidth and guaranteed delivery of time and content sensitive data.The SierraNet Family of Fibre Channel test platforms provides best in class traffic capture, analysis, and manipulation for testing physical link characteristics and application operations. SierraNet is designed for addressing today’s high-speed storage and communications fabrics problems and compliments other tools offering industry leading visibility and utility.
-
product
Crimp Tester
TF125
TESTEX Testing Equipment Systems Ltd.
Crimp Tester, to calculate the crimp in yarn affected by knitting or weaving by taking apart the yarn from a piece of given-length fabric, unbending it under given force and measuring its length, to determine actual yarn usage.
-
product
2-Channel 500 MHz A/D and 2-Channel 800 MHz D/A with Virtex-6 FPGA - XMC
Model 71650
- Complete radar and software radio interface solution- Supports Xilinx Virtex-6 LXT and SXT FPGAs- Two 500 MHz 12-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- Up to 2 GB of DDR3 SDRAM or 32 MB of QDRII+ SRAM- Sample clock synchronization to an external system reference- Front panel clock/sync bus for multimodule synchronization- PCI Express (Gen. 1 & 2) interface up to x8 wide- VITA 42.0 XMC compatible with switched fabric interfaces- Optional user-configurable gigabit serial interface- Optional LVDS connections to the Virtex-6 FPGA for custom I/O- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
-
product
10 Micron Wire Grid Polarizer
Fabricated from 10 micron diameter tungsten wire, and with a choice of wire spacing starting from 25 microns, these wire grid polarizers are suitable for use from approximately 100 microns (or 3 THz) to longer wavelengths. Please refer to the table below for the standard availability of wire spacing and frame clear aperture / outer diameter.
-
product
RF Power Transistors
Silicon Bipolar
Macom Technology Solutions Holdings Inc.
At MACOM we offer a broad range of silicon bipolar transistor products designed for applications ranging from DC to 3.5 GHz. Our silicon bipolar transistors are ideal for civil avionics, communications, networks, radar, and industrial, scientific, and medical applications. Our all-gold metallization fabrication processes ensure high performance and long term reliability for ground and space applications.
-
product
Face Masks Particulate Filtration Efficiency PFE Tester
GLE-20
GLE-20 is an oil-salt two-in-one Face Masks Particulate Filtration Efficiency PFE Tester. According to ASTM F1862-17, ASTM F2299-03 (2017), ASTM F2100-2019, BS EN14683-2019, BS EN 14387-2004+A1 2008, BS EN 136-1998, BS EN 140-1999, BS EN 143-2000 +C1-A1, BS EN 149-2001+A1, etc. It is used to test the particulate filtering efficiency of daily protective masks and medical masks, and to determine the obstruction performance of ordinary fabrics and medical protective masks against a constant flow of airflow.
-
product
Plastic Fabrications Testing Equipment
PD and PHD Pinhole/Holiday Detectors have an alarm circuit to alert the operator when a fault has been located and the required test voltage can be set on the unit's meter. Spark Testers provide an inexpensive means of testing but have no output voltage meter or audible alarm. However, they can test joints even if the backing is not connected.
-
product
Textiles
Physical Property Testers Group
From raw materials to fabric manufacture, to garment makers and machinery manufacturers, all of varying size and resource. Within this chain sits 'Textile Testing', the purpose of which is to test materials before, during and after material processing, to confirm the finished product quality.
-
product
Uncooled Microbolometer
384 x 288 FPA
Drawing on its extensive experience in microbolometric detector design, fabrication, and characterization, as well as in detector-to-ROIC (Read-Out Integrated Circuit) monolithic integration, INO is proud to offer its 384 x 288 pixel microbolometer FPA (Focal Plane Array) in short series.
-
product
Ball-bursting Strength Tester
TF003
TESTEX Testing Equipment Systems Ltd.
Ball-bursting Strength Tester, used for testing the ball-bursting strength and expansion rate of cotton fabrics, elastic fabrics, sock and glove products.
-
product
TDR Structural Health Monitoring
Material Sensing & Instrumentation
MSI Time-Domain-Reflectometry (TDR) Structural-Health Monitoring probes the structural health of a composite part by propagating a fast electrical pulse along a distributed linear sensor which has been fabricated directly in the laminate. The sensor is formed from the native graphite fibers already used in composite manufacture, and constitutes zero defect. Fibers are patterned into a microwave waveguide geometry, or transmission line, and interrogated by a rapid pulse as shown below. Structural faults along the line cause distortions in waveguide geometry, producing reflected pulses similar to radar. Cracking, delamination, disbonds, moisture penetration, marcelling, and strain are all detected by propagation delay, for sensor lengths up to several meters.
-
product
CW IMPATT DIODES FROM 30 TO 140 GHz
Insight Product Company offers IMPATT diodes with CW power up to 400 mW and operational frequency range up to 140 GHz. Silicon p+-p-n-n+ IMPATT diodes are designed to be used in the millimeter wave oscillators and amplifiers. They are fabricated in the metal-ruby packages with hard-lead carrier (diameter 3.0 mm, 1.5 mm).
-
product
Multi-purpose Textile Flammability Tester
TESTEX Testing Equipment Systems Ltd.
Multi-purpose Textile Flammability Tester, to determine the flammability resistance of textile fabrics and for the flammability test of toys and toy material. Multi-purpose Textile Flammability Tester complies with ISO 6940 (1995&2004) / 6941 (1995&2003), ISO 15025, EN71-2, etc. Please contact us for more information about flammability test method.
-
product
BIM Structural Modeling Services
Structural Modeling represents the digital replica of structural components of a building i.e., beams, columns, torsion, and foundations, using Autodesk Revit software. Tejjy-BIM Inc. provides Revit Structural BIM design-drafting-modeling services for concrete & steel structure building design. Integration of BIM modeling in structural engineering facilitates better analysis of design detailing and simulates the behavior to coordinate and collaborate with the architectural & MEP (mechanical, electrical, and plumbing) system. BIM services in structural engineering facilitates structural analysis, and optimization of building design, as well as generate fabrication and construction documents.
-
product
Highly Accelerated Life Testing (HALT)
Quickly validate reliability and identify manufacturing defects that could cause product failures in the field with MET’s Highly Accelerated Life Test (HALT)HALT technique uses a combination of accelerated stresses to expose product flaws early in the design and manufacturing stages, which improves product reliability and customer confidence inherent to the design and fabrication process of a new product as well as during the production phase to find manufacturing defects that could cause product failures in the field.
-
product
Shrinkage Template Scale
TESTEX Testing Equipment Systems Ltd.
Shrinkage Template Scale, suitable for all shrink testing standards. Shrinkage Template Scale complies with AATCC 135/150/160/179, BS EN 3759, ISO 3759, etc. Welcome to contact us if you have any problems about fabric shrinkage test method.
-
product
Wafer Bonding Systems
ith over 15 years experience in designing and manufacturing precision wafer bonding equipment, EVG wafer bonding systems are well recognized in setting industry standards for the MEMS production industry. Besides supporting wafer level and advanced packaging, 3D interconnects and MEMS fabrication, the EVG500 series wafer bonding systems can be configured for R&D, pilot-line or volume production. They accommodate the most demanding applications by bonding under high vacuum, precisely controlled fine vacuum, temperature or high pressure conditions. Multiple bonding methods including anodic, thermo compression, glass-frit, epoxy, UV and fusion bonding are covered. Based on a unique modular bond chamber design the EVG500 series allow for an easy technology transfer from R&D to high volume production.
-
product
Metrology Solutions for Semiconductors
Bruker Semiconductor develops, manufactures, markets, and supports metrology solutions for thin films, which are based on novel, rapid, non-contacting and non-destructive X-ray technology. With Bruker’s acquisition of Jordan Valley Semiconductors, a name synonymous with unparalleled worldwide customer service and support, 75% of the world's top 25 semiconductor manufacturers rely on Bruker metrology tools for front-end and back-end applications, including development of their next-generation thin films. Bruker commitment to innovation and technology leadership drives the continued release of new advancements in metrology, and has garnered numerous awards and industry recognition. In applications ranging from C-S thin films materials characterization to wafer substrate analysis and defect detection, Bruker’s systems provide simulation analysis and fit. HRXRD, XRR, WA-XRD, and XRDI measurement types are fully supported, enabling researchers, production engineers, and process developers unparalleled capabilities. Whether you are a semi and C-S fabricator, R&D center or academy, or an industry materials research facility, Bruker has a specifically designed solution for your metrology needs.
-
product
Surface Water Absorption Tester
TF167
TESTEX Testing Equipment Systems Ltd.
Specimens are placed at an angle on the base of the apparatus. After water flows down the surface of each specimen, the amount of water retained by each specimen is measured. Six specimens are tested, three on the face of the fabric and three on the back of the fabric. The six observations are averaged to determine the surface water absorption of the fabric.
-
product
Air Permeability Tester
TF164B
TESTEX Testing Equipment Systems Ltd.
Our Air Permeability Tester determines the resistance of fabrics (woven, knitted and non-woven textile materials) to the passage of air (air flow) under constant pre-set air pressure while firmly clamped in the test rig of selected test head/area.The specimen is loaded to the test area of the instrument easily by means of a pneumatic holder. By pressing down the holder to start the test. The air permeability tester is equipped with a vacuum pump to draw air through an automatic interchangeable test head with a circular opening. The pre-selected test pressure is automatically maintained, and after a few seconds the air permeability of the test specimen is digitally displayed in the pre-selected unit of measure on the touch panel after test the holder is released and the vacuum pump is shut off.
-
product
TR H4x/msd-RCx, 3U VPX Server board
TR H4x/msd-RCx
TR H4x/3sd-RCx is a compute intensive rugged server board. It features a processor with 12-cores, large memory capacity, local storage and has 40G and 10G Ethernet interfaces for high throughput fabric connectivity.
-
product
cPSB 2.16 8 Slot - 6 w/cPCI, 2 FS
107PS21608-0157R
CompactPCI CPSB 2.16 6U 8 slot, 6 w/cPCI, 2 Fabric, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
-
product
Wet Oxidation System For VCSEL Fabrication
VIXEL-320
The VIXEL-320 is a wet oxidation system intended for the fabrication of Vertical Cavity Surface Emitting Lasers. It is an atmospheric-pressure oxidation system with in-situ monitoring of oxide aperture formation. It accommodates single wafers of up to 150mm (6") in diameter.
-
product
ICI Mace Snag Tester
TF220
TESTEX Testing Equipment Systems Ltd.
ICI Mace Snag Tester. To determine the tendency of fabrics to snag (pull yarn loops from fabric) in normal wear (mace snag).Provided with 4 rotating test cylinders fitted with sleeves of test fabric, mace balls with tungsten carbide points and controlled by a predetermined electronic counter.
-
product
Rugged Blade Processor W/ Dual Xeon E5
ATC126
The ATC126 is a high performance ATCA processor blade featuring dual 14-core Intel® Xeon® processor (E5-2658 v4, E5-2680 v4, E5-2648L, 2618L, 2620 or 2630 v4), with up to eight banks of 256 GB DDR4 memory with ECC. Versatile connectivity includes two 10/40GbE Fabric Interfaces, dual GbE Base Interfaces, dual front panel GbE egress Ports, front panel dual RS-232 and USB 3.0/2.0 Ports and front panel DVI-I connector.
-
product
Hand-held Textile Moisture Meter
TF123B
TESTEX Testing Equipment Systems Ltd.
Hand-held Textile Moisture Meter, widely used in leather materials, fabrics, garments, yarn, axis, cheese, textiles and other industries that need rapid determination of moisture (moisture regain).
-
product
Fabric Unidirectional Water Transmission Performance Tester
DRK-UPT1
Shandong Drick Instruments Co., Ltd.
The unidirectional water transmission performance tester is a special instrument for measuring the unidirectional water transmission performance of textiles.
-
product
cPSB 2.16 4 slot - 3 w/cPCI, 1 FS
107PS11604-0157R
CompactPCI CPSB 2.16 6U 4 slot, 3 w/cPCI, 1 Fabric, fully compliant to the PICMG 2.16 Packet Switching Backplane specification.
-
product
High-power Melt Blown Cloth Electrostatic Electret Device
HTRP-140A / 515
Wuhan Huatian Electric Power Automation Co., Ltd.
It is widely used in masks, melt-spraying non-woven fabrics, printing, film sticking, spray painting, flocking, sorting and bioengineering.
-
product
CCD Foundry Services
Teledyne DALSA Semiconductor’s 150mm CCD process offers surface or buried channel operation at up to 15V with two or three layers of polysilicon and one, two or three layers of metal. A modular processing approach allows our foundry customers to adjust process parameters to meet the most demanding requirements for CTE (>99.999%), charge storage capacity, and dark current (<1nA/cm2). The base process uses 1X projection lithography with 2.5µm design rules, allowing die sizes of up to 100mm X 100mm. Where required, tighter alignment tolerances and smaller feature sizes can be obtained by using 5X lithography, using a mix and match or all-stepper approach. The maximum die size attainable with the stepper is 22mm X 22mm, but larger sensors can be fabricated using stitching.
