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Product
Osprey Probe Card
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The Osprey probe card is MPI’s solution to demand for ever finer pitch. It is designed for smaller Al pad, and is ideal for tiny pitch application with peripheral and full array pattern. With precise alignment and better planarity control, Osprey can reach higher productivity by multi-DUT design. The forming wire (FW) type needle produced with MPI’s own micro fabrication process not only delivers high-quality performance but also allows easy needle replacement and shortens maintaining cycle time.
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
Fiber Manufacturing
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From preform fabrication to final quality control, our fiber test instruments are designed to provide a complete end-to-end solution for all of your testing needs. Our technology is so widely used that virtually all fibers produced globally encounter multiple PK instruments before leaving the factory.
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Product
Leather Thickness Gauge
Crockmeter UI-TX50
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Crockmeter (Crock Meter) is used to test color transfer of colored textile (leather, fabric and etc,) to other surface due to rubbing. It is test of colour fastness to rubbing, one of physical testing of textiles.
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Product
EEE Component Testing and Screening Services
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DPACI performs 100% screening as well as qualification testing on electronic parts supplied to the high reliability commercial, industrial, space, and U.S. military sectors. We generate software and hardware to test microcircuits, discrete semiconductors, hybrids, PEMS, and other EEE electronic components to exact customer and military specifications. Our engineering experience in electronic parts screening, qualification, and in-house test fixture fabrication allows us to provide value added components in a timely manner.
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Product
Paper Softness Tester ZRD-T1
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The ZRD-T1 Paper Softness Tester is a device designed to objectively measure the softness of paper products, such as tissues, toilet paper, or specialty papers. Softness is a complex tactile property influenced by factors like surface smoothness, flexibility, and bulk compressibility. It is widely used in industries such as tissue manufacturing, hygiene product development, textiles, and packaging to ensure compliance with quality standards and end-user comfort requirements. This test instrument conforms to many national and international standards: ASTM D2923: Standard Test Method for Rigidity of Paper – Measures bending resistance to determine stiffness. ASTM D6828: Standard Test Method for Stiffness of Nonwoven Fabrics – Evaluates drape and flexibility in materials like medical textiles or wipes. TAPPI T498: Bending Resistance of Paper (Gurley Method) – Quantifies resistance to bending forces, inversely related to softness. GB/T 8942: Chinese Standard for Softness Testing of Household Paper – Aligns with consumer expectations for tissue and toilet paper tactile quality. ISO 12625-9: Softness Evaluation of Tissue Products (optional add-on).
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Product
Fabric Tactile Tester
DRK549A
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Shandong Drick Instruments Co., Ltd.
Fabric feel style is not only one of the important evaluation indexes of textile comfort, but also an important factor affecting textile sales. Therefore, textile feel style measurement instrument has always been the research direction of textile science and technology.
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Product
For Conduction Cooled ΜTCA Chassis
UTC003
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The VadaTech UTC003 is the most feature-rich MCH (MicroTCA Carrier Hub) for the Conduction Cooled μTCA chassis in the market. It’s management software is based on VadaTech’s proven Carrier Manager and Shelf Manager. The MCMC manages the power modules, the two CU (Cooling Units) and up to 12 AMCs within the μTCA chassis. It also interfaces to and manages the on-board fabric interfaces. The module is available with PCIe, SRIO, 10GbE Layer 3 managed, and GbE Layer 2 managed. The UTC003 runs Linux 2.6 on it’s MCMC CPU and is hot-swappable and fully redundant when used in conjunction with a second instance of the module. The firmware is HPM.1 compliant which allows for ease of upgrade. The UTC003 provides Fabric (100 Mhz HCSL) clock to each AMC.
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Product
4-Channel 200 MHz A/D with 32-Channel DDC, Virtex-7 FPGA - XMC
Model 71762
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-7 VXT FPGAs- Four 200 MHz 16-bit A/Ds- Four multiband DDCs- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional user-configurable serial gigabit interfaces- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Also available in 3U VPX, 3U & 6U cPCI & PCIe- Supports GateXpress® FPGA-PCIe Configuration Manager- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe- See comparable Jade Xilinx Kintex UltraScale FPGA Module: Model 71862
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Product
3-Channel 200 MHz A/D and 2-Channel 800 MHz D/A with Virtex-7 FPGA - XMC
Model 71720
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- Complete radar and software radio interface solution- Supports Xilinx Virtex-7 VXT FPGAs- GateXpress supports dynamic FPGA reconfiguration across PCIe- Three 200 MHz 16-bit A/Ds- One digital upconverter- Two 800 MHz 16-bit D/As- 4 GB of DDR3 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with swtiched fabric interfaces- Optional user configurable gigabit serial interface- Optional LVDS connections to the Virtex-7 FPGA for custom I/O- Supports GateXpress® FPGA-PCIe Configuration Manager- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Mechanical Yarn Package Density Tester
Y016A
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To measure the hardness of yarn cones or beams of yarn or fabric
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Product
Require External Wireless Module
Moisture Meter
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External wireless connectivity moisture meter is designed for use in wide applications, such as :*For locating water leaks behind walls, above ceilings and below floors.*For wood working, measure moisture content before finishing, painting processing.*For textile industries, regular check moisture content of fabrics and leathers, quality check to prevent mold.*For printing industries, check moisture content of paper before printing.
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Product
2-Channel 200 MHz A/D with 766 DDCs, Kintex UltraScale FPGA - XMC
Model 71865
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete software radio receiver solution for extremely high-channel-count applications- Uses Xilinx Kintex UltraScale KU035 FPGAs- Two 200 MHz 16-bit A/Ds- Four wideband DDCs (digital downconverters)- Up to 762 narrowband DDCs- Sample clock generation and synchronization to an external system reference- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
2-Ch 500 MHz A/D with DDC & 2-Ch 800 MHz D/A with DUC, Kintex UltraScale - XMC
Model 71851
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex Ultrascale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- Two 500 MHz 12-bit A/Ds- Two multiband DDCs (digital downconverters)- One DUC (digital upconverter)- Two 800 MHz 16-bit D/As- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the Kintex - Ultrascale FPGA for custom I/O- Optional 400 MHz 14-bit A/Ds- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
Nanostructuring
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AMO offers a highly flexible process-platform for the fabrication of nanostructures. We have a broad range of lithography techniques that can be flexibly combined with each other – including interference lithography. Each lithography technique is tailored to a specific pattern-transfer process and can be used on a wide range of substrates. In addition, we have developed an advanced nanoimprint lithography process that can transfer e-beam-defined patterns to large areas in a cost-effective manner.
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Product
1 kW and 2 kW Laser-Based Floating Zone Furnace
Laser Furnace
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The 1 kW and 2 kW laser furnace for single crystal fabrication is based on a design and developed in close cooperation with the RIKEN Center for Emergent Matter Science under the leadership of Yoshio Kaneko. Both melting zones have 5 lasers each, which guarantees a high uniformity of power density in the melting zone range. The laser profile has been optimized to reduce thermal stress during the crystal growth process. In addition, the system includes an integrated temperature sensor for real-time temperature monitoring. Temperatures up to 3000 °C can be reached and therefore materials with a very high vapor pressure, a narrow temperature range of the melt, a high thermal conductivity coefficient and incongruent melts can be melted.
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Product
PXIe Chassis: 18-slot, 3U, 24 GB/s, Gen 3
M9019A
Chassis
The Keysight M9019A PXIe 18-slot Gen 3 chassis delivers the flexibility, compatibility, and performance required for demanding applications. With 16 PXIe hybrid slots, it gives the system designer more flexibility to mix and match the number and location of PXIe and hybrid-compatible modules. The ultra-high performance, PCIe switch fabric can operate up to Gen 3 providing up to 24 GB/s of system data bandwidth. Combine the M9019A with the M9022A/23A/24A PXIe System Modules and M9048B/49A PCIe Desktop Adapters to achieve up to a Gen 3 x16 PCIe link to an external PC.
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Product
UV-NIL / SmartNIL® Systems
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EV Group provides a complete product line for UV-based nanoimprint lithography (UV-NIL), including different single-step imprinting systems, large-area imprinters as well as step-and-repeat systems for efficient master fabrication. Besides soft UV-NIL, EVG offers its proprietary SmartNIL technology with multiple-use polymer stamp technology. The efficient and robust SmartNIL process provides high pattern fidelity, highly uniform patterned layers and minimum residual layers, combined with easy scalability in wafer size and production volume. EVG´s SmartNIL redeems the long-term promise of nanoimprinting being a high-performance, low-cost and volume-capable manufacturing technology for mass production of micro- and nanoscale structures.
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Product
144-lane, 72-port, PCI Express
PEX89144
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The new PCIe Gen 5.0 (32 GT/s) PEX89000 series builds on the longevity of the Broadcom series of switches, now spanning 13 families. The PEX89000 family allows customers to build systems from simple PCIe connectivity inside the box to high-performance, low-latency, scalable, cost-effective PCIe fabrics for composable hyperscale compute systems supporting ML/AI and Server/Storage applications.
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Product
Ethernet and Fibre Channel Test Platform
SierraNet M1288
Test Platform
The SierraNet M1288 Ethernet and Fibre Channel test platform provides best in class analysis, jamming and generation for traffic capture and manipulation for testing application and link characteristics. SierraNet M1288 is the latest in the line of industry leading test and measurement tools from Teledyne LeCroy, designed for today’s high-speed storage and communications fabrics. SierraNet M1288 supports examination and modification of Ethernet and Fibre Channel links utilizing both Pulse Amplitude Modulation 4 (PAM4) and legacy Non-Return to Zero (NRZ) technologies.
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Product
Face Masks Particulate Filtration Efficiency PFE Tester
GLE-20
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GLE-20 is an oil-salt two-in-one Face Masks Particulate Filtration Efficiency PFE Tester. According to ASTM F1862-17, ASTM F2299-03 (2017), ASTM F2100-2019, BS EN14683-2019, BS EN 14387-2004+A1 2008, BS EN 136-1998, BS EN 140-1999, BS EN 143-2000 +C1-A1, BS EN 149-2001+A1, etc. It is used to test the particulate filtering efficiency of daily protective masks and medical masks, and to determine the obstruction performance of ordinary fabrics and medical protective masks against a constant flow of airflow.
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Product
Microbolometer Sensors
Calibir GX Family
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The Calibir GX camera family features our latest microbolometer sensor, designed, fabricated, and packaged in our own foundry. With great sensitivity in longwave infrared range (8-12 µm), it features both shutter and shutterless operation and rapid image output on power up while delivering uniform response over the entire operating temperature range, making it an ideal component for thermal imaging systems requiring uninterrupted image acquisition. The GX series also offers our own advanced 21-bit ADC design for unparalleled intra-scene dynamic range without the need for a gain reduction, allowing for the best possible NETD over a vast range of temperature (>600C).
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Product
Random Pilling Tester
UI-TX08
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Random Pilling Tester is a kind of pilling tester to determine textile fabric resistance to pilling, fuzzing and matting by tumbling randomly.
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Product
8-Channel 250 MHz A/D with DDC, Kintex UltraScale FPGA - XMC
Model 71131
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Powerful Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight multiband DDCs (digital downconverters)- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available
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Product
PCIe/104 OneBank SBC w. Dual 1GHz ARM9 & 1Gbyte DDR3
EMC²-Z7015
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Sundance Multiprocessor Technology Ltd.
The EMC²-Z7015 is a PCIe/104 OneBank™ SBC with a Xilinx Zynq SoC, Artix-7 FPGA fabric and a VITA57.1 FMC™ LPC I/O board. The main processing power of the EMC²-Z7015 is a Dual Core ARM9 and combined with traditional FPGA fabrics/gates + High-Speed I/O interfaces, like USB2.0, HDMI, 1Gb Ethernet and SATA and provide an total solution for any Embedded Application.
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Product
Martindale Abrasion Tester
SG-P02M
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This machine is ideal for determining the abrasion resistance of upper, lining, socking, and similar types of shoe materials, particularly those made of fabric. The specimens are capably tested for four bieces or six pieces(option) per time and are rubbed over the abrasive in all directions in a complex, repetitive pattern(a lissajous figure) and, at the same time, the holer totates.
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Product
Computer Control Tensile Testing Machine
SG-L03B
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These series of universal testing machine are used to test tension, compression, bend, shearing force, adhesion, peeling force, tear strength,...etc. of specimen, semi-product and finished product in the field of rubber, plastic, metal, nylon, fabric, paper, aviation, packing, architecture, petrochemistry, electric appliance, automobile,...etc. , which are the basic facilities for input quality contorl (I.Q.C), Quality Control (Q.C.), Physical Inspection, Mechanics Research and Material.
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Product
Magnetism Detector DET
432
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The MAC Magnetism Detector is widely used by steel suppliers and fabricators to determine residual magnetism in iron and steel objects.
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Product
Development Kit
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The VP430 is 3U VPX RF processing system featuring the transformational Xilinx® Zynq® Ultrascale+™ RF system-on-chip technology (RFSoC). The ZU27DR device used on the VP430 includes eight integrated analog-to-digital converters at 4GSPS, eight digital-to-analog converters at 6.4 GSPS, a user-programmable FPGA fabric, and multi-core Zynq ARM® processing subsystem.
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Product
3U OpenVPX VITA 66-67 Backplanes
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VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments.
