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Product
8-Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - 3U VPX
Model 5953
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- Supports Xilinx Zynq UltraScale+ RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- PCI Express (Gen. 1, 2 and 3) interface up to x8- LVDS connections to the Zynq UltraScale+ FPGA for custom I/O- Optional VITA-66.4 optical interface for backplane gigabit serial communication- Dual 100 GigE UDP interface- Compatible with several VITA standards including: VITA-46, VITA-48, VITA-66.4, VITA-57.4 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Model 8257 1-Slot 3U VPX Development Chassis for Quartz Products- Model 4801 Carrier Design Kit for designing custom carrier for the Model 6003 QuartzXM- Model 6003 unique QuartzXM eXpress module enables migration to other form factorsPentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products VideoLive Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boardsPipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoCSynchronize up to eight modules with Model 5903 High-Speed System Synchronization and Distribution Amplifier - 3U VPXPlease refer to the product datasheet for Installed FPGA IP Module details
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8-Channel 250 MHz A/D with Multiband DDC, Kintex UltraScale FPGA - XMC
Model 71132
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Powerful Xilinx Kintex UltraScale FPGAs- Eight 250 MHz 16-bit A/Ds- Eight wideband DDCs (digital downconverters)- 64 multiband DDCs- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available
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16GB SO-DDR4-3200 1GbX8 1.2V ECC Samsung Chip
AQD-SD4U16GE32-SE
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16GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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PCIe VU13P UltraScale+TM With Massive Optical I/O
PCI597
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The PCI597 is based on the Xilinx VU13P UltraScale+TM FPGA, which provides over 12,000 DSP slices, 360 Mb of UltraRAM and 3,780K logic cells. The Unit provides active cooling of the FPGA making it appropriate for power-hungry applications or those requiring temperature stability for good performance. The FPGA has interface to DDR4 memory channels (single bank of 64-bit wide, 16 GB). This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
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LGA1700 12th/13th/14th Generation Intel® Core™ I9/i7/i5/i3 ATX Motherboard With DP/HDMI/VGA, DDR4, USB 3.2, M.2
AIMB-788
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Intel® 12th/13th/14th generation Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor with Q670E chipsetFour DIMM sockets up to 128 GB DDR4 3200Triple display DP/HDMI/VGA and dual GbE LANM.2, SATA RAID 0, 1, 5, 10, USB 3.2 Gen 2Advantech iBMC remote out-of-band power management solution on DeviceOnAWS (Amazon Web Service) IoT Greengrass qualifiedNote 1: Legacy platform is not supportedNote 2: dTPM 2.0 module is required to enable Intel vPro and TPM technologiesNote 3: Intel® Platform Trust Technology (Intel® PTT) ready for Windows 11
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1-Ch. 6.4 GHz or 2-Ch. 3.2 GHz A/D, 2-Ch 6.4 GHz D/A Kintex UltraScale - XMC
Model 71141
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Ideal radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- One-channel mode with 6.4 GHz, 12-bit A/D- Two-channel mode with 3.2 GHz, 12-bit A/Ds- Programmable DDCs (Digital Downconverters)- Two 6.4 GHz, 14-bit D/As- Programmable DUCs (Digital Upconverters)- 5 GB of DDR4 SDRAM- µSync clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- VITA 42.0 XMC compatible with switched fabric interfaces- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Ruggedized and conduction cooled versions available- Synchronize up to four modules with Model 7192 System Synchronization and Distribution Amplifier - PMC/XMC- Synchronize up to twelve modules with Model 9192 System Synchronization and Distribution Amplifier- 1U Rack-mount
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Fanless Embedded System With LGA1151 Intel® Xeon®, 9th/8th Gen Intel® Core™ I7/i5/i3 Or Celeron® Processor, Intel® C246, ECC/Non-ECC And 1 PCIe X4 Expansion Slot
eBOX710-521-FL
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*Intel® Xeon®, 9th/8th gen Intel® Core™ i7/i5/i3 or Celeron®processor*2 DDR4 ECC/non-ECC memory supported, up to 64GB*Dual swappable 2.5" SATA HDD drive bays with RAID 0 &1*DVI-I, HDMI, and DisplayPort with triple-view supported*6 GbE LAN, 6 USB 3.2 and 1 PCIe x4 expansion slot*Flexible I/O window supported
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DDR Detective Logic Analyzer
DDR4
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NOW supports 3DS at 3200MT/s!Provides logic analyzer like deep transaction Listing and Waveform capture. Continuous Capture for Violations and Performance metrics NOT a fill memory and then post process like other tools. This is a FuturePlus ONLY feature!
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System on Module Microsemi PolarFire
SoM3-MPF300T
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Sundance Multiprocessor Technology Ltd.
The SoM3-MPF300T is a small footprint System On Module (SoM) with 40x50mm dimensions. It has a low power, highly secure FPGA from the PolarFire family from Microsemi. It comes with 4GB of DDR4 memory, Ethernet PHY, and FLASH. This SoM is ideal for being used in complex hardware designs, and is compatible with Sundance SoM carriers SE215 and EMC2-DP-V2.
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4U Intel® Xeon® Scalable GPU Server With 4x Double-Deck PCIe Cards For AI Training And Scientific Computing.
SKY-640V2
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Processor: Dual 3rd Gen. Intel® Xeon® scalable processorsMemory: 16x DDR4 3200 MHz ECC RDIMM/LRDIMM / Intel® Optane™ support up to 2TBRemote Management: IPMI function supportExpansion: Supporting 4 * PCIe x16 double-deck card + 2* PCIe x8 single-deck FH/HL card + 1*PCIe x8 cardPSU: 2000W 1+1 redundant power supply with 80 PLUS Platinum level certification3 x 12CM system fan with easy maintenance feature
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32GB DDR4-3200 2GbX8 1.2V ECC Samsung Chip
AQD-D4U32GE32-SB
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32GB, Speed 3200MHz, 30u" Gold Plating Thickness, Anti-sulfurization resistance, ECC.
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15" XGA TFT LED LCD Touch Panel Computer With 8th Gen. Intel® Core™ I3/ I5/ I7 Processor, Built-In 8G DDR4 RAM
TPC-315
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Industrial-grade 15" XGA TFT LCD with 70K lifetime and LED backlight.8th Gen. Intel® Core™ i3- 8145UE dual-core/ i5-8365UE quad-core/ i7-8665UE quad-core processor with built-in 8 GB DDR4 SO-DIMM.Compact, fanless embedded system with aluminum alloy front bezel and chassis grounding protection.True-flat touchscreen with 5-wire resistive touch control and IP66-rated front panel.Supports expansion via Full-size Mini PCIe and NVMe.Diverse system I/O and isolated digital I/O via iDoor technology.Supports fieldbus protocols via iDoor technology.
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PCIe FPGA Carrier For FMC+, Altera Arria-10 GX1150
PCI536
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The PCI536 is based on the Altera Arria-10™ GX1150 FPGA in F1517 package. The FPGA interfaces directly to the FMC+ DP 0-23 (single connector) and all FMC+ LA/HA/HB pairs, making it compatible with a wide range of industry standard VITA 57 modules. The PCI536 has x8 PCIe edge connector routed to the FPGA PCIe Gen3 hard IP block. It also has interface to two DDR4, 64-bit wide, with 16 GB total memory. This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host.
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Embedded System Support Intel® 12th/ 13th/ 14th Gen. Core I9/i7/i5/i3 Platform
EPC-B2208
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Support Intel 12th/ 13th/ 14th Gen. Core i9/i7/i5/i3.Two DDR4 3200MHz SODIMM and up-to 64GB.Supports triple independent displays of 2x DP/HDMI/LVDS.One low-profile PCIe expansion slot.
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Small-Size Integrated DIN-Rail IPC With Intel® Atom® X6413E And X6425RE
UNO-137 V2
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Intel® Atom® x6413E (1.5 GHz) and x6425RE (1.9GHz) processor with 8GB DDR4 memoryWide operating temperature range (-40 ~ 70 °C/-40 ~ 158 °F) and wide power input range (10 ~ 36 VDC)Port isolation for 8 x DI, 8 x DO, 2 x COMDP++ ensures HDMI/DVI compatibilityDual storage: 1 xM.2 M-key 2242 PCIe/NVMe or SATA/SSD and 1 x mSATAOnboard TPM 2.0 provides hardware-based securityModular design for optional iDoor extensionRuggedized DIN-rail kitCompliant with IEC 61010-1 safety requirements
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PXI Express Embedded Controller
PXIe3110
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The PXIe3110 is the most compact andpowerful 3U one-slot embedded controller forthe PXI Express and CPCIexp platform. With itshuge and future-ready interface capabilities,it runs perfectly with most test and measurementapplications.The Controller is driven by a 7th generationIntel® Core™ processor combined with up to32 GB DDR4 memory and easily supports highbandwidth applications with its PCIe Gen3system and storage interconnectivity.
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32G DDR4-3200 2GbX8 1.2V SAM -40~85C
AQD-D4U32N32-SBW
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DDR4 3200Mhz Unbuffered DIMM, 30u" Gold Plating Thickness, Anti-sulfurization resistance. 1.2V power consumption, Samsung original chip, 100% tested for stability, compatibility and performance.
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8 Channel A/D & D/A Zynq UltraScale+ RFSoC Gen 3 Processor - SFF
Model 6353
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- Small form factor rugged enclosure- Conduction-cooled- Designed to the IP67 specification for dust and water immersion- Sealed military-grade circular connectors- Incorporates Xilinx® Zynq® UltraScale+" RFSoC FPGAs- 16 GB of DDR4 SDRAM- On-board GPS receiver- Optional dual 100 GigE UDP optical interface- Optional fan cooling for benchtop use- Navigator® BSP for software development- Navigator® FDK for custom IP development- Pentek's Quartz Family of Xilinx Zynq UltraScale+ RFSoC FPGA Products Video- Live Signal Acquisition Video: Quartz Model 5950 and Model 6001 RFSoC boards- Pipeline Newsletter: Strategies for Deploying Xilinx's Zync UltraScale+ RFSoC- Please refer to the product datasheet for Installed FPGA IP Module details
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ATCA Rugged Blade Processor With Dual Xeon Cascade Lake-SP, 100G Ethernet
ATC129
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The ATC129 is a high performance ATCA processor blade featuring dual 24 core Intel® Xeon® processors, each with six banks of memory providing up to a total of 384 GB DDR4 memory with ECC.
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DDR4 X16, 2-Wing, Small KOV, BGA Interposer For Logic Analyzers
W4636A
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The W4636A DDR4 x16 – 2 wing BGA interposer for 96 ball DDR4 DRAM is designed for data rates up to and including 2.4 Gb/s. The W4636A probes all ADD/CMD/CNTRL and partial DQ/DQS, and it is designed for minimal KOV for space limited systems under test. The W4636A is the least expensive DDR4 BGA interposer for a logic analyzer.
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Pico-ITX SBC With 6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processors, HDMI/LVDS, LAN And Audio
PICO500
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The PICO500, an extreme compact pico-ITX embedded board, supports the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (Codename: Skylake-U). The tiny PICO500 is equipped with one DDR4 SO-DIMM with up to 16 GB memory capacity. Integrated with Intel® HD graphic engine, the Pico-ITX motherboard supports HDMI and 18/24-bit dual channel LVDS that delivers a whole new level of Ultra HD 4K visual experiences. Its Pico-ITX form factor allows for an extremely compact performance system; meanwhile, the PICO500 is built to withstand wide temperature conditions, ranging from -20°C to +70°C (-4°F to +158°F) with active thermal solution.
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Multi-site Module Testing System
TCIII-3200ST
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TurboCATS introduces a new line of redesigned TCIII-3200ST DDR4 and DDR3 multi-site module testing system - compact, high-performance, and equiped with enhanced productivity features. The TurboCATS TCIII-3200ST module test system features an optional 8, 16 or 64 module testing, in parallel, for high throughput on your production floor.
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LGA 4189 Intel® Xeon® Scalable Proprietary Server Board with 16x DDR4, 4 x PCIe x16, 10 x SATA3, 8 x USB 3.2 (Gen 1), Dual 10GbE, and IPMI
ASMB-976
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- LGA4189 proprietary server board with 3rd Gen Intel® Xeon® scalable processor- DDR4 3200 MHz RDIMM up to 2TB supports Intel® Optane™ Persistent Memory- 4 x PCIe x16 and 7 x PCIe x8- Intel® X550 dual 10GbE ports- Ten SATA3 and two M.2 connectors (SATA/PCIe compatible)- 0 ~ 40 °C ( 32 ~ 104 °F) ambient operating temperature range
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2U Rackmount Network Appliance Platform Based On Intel® Xeon® E3 Series And 6th/7th Generation Intel® Core™i7/i5/i3 Processors
FWA-4130
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Intel® Xeon® E3 Series and 6th/ 7th Generation, Intel® Core™i7/ i5/ i3 Processors4 x DDR4 2133/ 2400MHz ECC UDIMMs, up to 64GB4 x Advantech network module expansions1 x PCIe x8 slot on rear, supports FH/HL add-on cards1 x mSATA slot, 2 x 3.5" HDD bay, CF slot (optional)IPMI2.0 compliant remote management (optional)
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Machine Vision SBC With AMD® Ryzen™ Embedded V1807B And V1605B APU, DisplayPort, HDMI, 2 GbE LAN, 2 IEEE 802.3at PoE GbE LAN And Vision-specific I/O
MIRU130
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*AMD® Ryzen™ Embedded V1807B and V1605B APU*2 DDR4 SO-DIMM for up to 16GB of memory*2 GbE LAN and 2 IEEE 802.3at PoE GbE LAN*2-CH camera trigger outputs*2-CH LED lighting control*1-CH incremental quadrature encoder input*4 isolated DIO
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DDR4 Pro 288-Pin DIMM Adapter
INN-8686-18-PRO
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Your best option if you need to test a large volume of memory! The RAMCHECK LX DDR4 Pro 288-pin DIMM Adapter (p/n INN-8686-18-PRO) gives RAMCHECK LX users the power to test 288-pin DDR4 modules, including unbuffered (UDIMM), load-reduced (LR-DIMM) and registered modules (RDIMM), both ECC and non-ECC, that comply with JEDEC standards. It includes the DDR4 Series adapter and DDR4 Pro DIMM test head.
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COM Express Type 6 Compact Module With 6th Gen Intel® Core™ I7/i5/i3 And Celeron® Processor
CEM501
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The CEM501 COM Express Compact Type 6 module is based on the latest 14nm 6th generation Intel® Core™ i7/i5/i3 processors (codename: Skylake) with support for up to 32 GB dual channel DDR4 SO-DIMM memory. Featuring improved processing and graphics performance compared to the previous generation Intel® processor, the compact-size system on module CEM501 offers intense graphics performance and multitasking capabilities, making it ideal for telecommunication, medical imaging, digital signage, gaming machines, military, and IoT related applications.
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2-Ch 500 MHz A/D with DDC & 2-Ch 800 MHz D/A with DUC, Kintex UltraScale - 3UVPX
Model 52851
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Supports VITA-49.2 VITA Radio Transport standard- Two 500 MHz 12-bit A/Ds- Two multiband DDCs (digital downconverters)- One DUC (digital upconverter)- Two 800 MHz 16-bit D/As- 5 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x4- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Optional 400 MHz 14-bit A/Ds- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Product
6-Ch 200 MHz A/D with DDC & 4-Ch 800 MHz D/A with DUC, Kintex UltraScale - 6UVPX
Model 58821
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- Jade Xilinx Kintex UltraScale FPGA Products and Navigator Design Suite Software Video- Jade Xilinx Kintex UltraScale FPGA Family Brochure- Complete radar and software radio interface solution- Supports Xilinx Kintex UltraScale FPGAs- Six 200 MHz 16-bit A/Ds- Six multiband DDCs (digital downconverters)- Two DUC (digital upconverter)- Four 800 MHz 16-bit D/As- 10 GB of DDR4 SDRAM- Sample clock synchronization to an external system reference- LVPECL clock/sync bus for multimodule synchronization- PCI Express (Gen. 1, 2 & 3) interface up to x8- Optional LVDS and gigabit serial connections to the FPGA for custom I/O- Compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65 (OpenVPX™ System Specification)- Ruggedized and conduction-cooled versions available- Synchronize up to eight modules with Model 7893 System Synchronization and Distribution Amplifier - PCIe
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Intel® Core™ I3, N Series And Atom® X7000E/x7000RE Series Processor
AIMB-219
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Intel® Core™ i3, N series and Atom® x7000E/x7000RE SeriesUp to 32GB DDR4 3200MT/s SODIMMTriple independent display with 1 DP(over USB-C), 1 HDMI, 1 LVDS(or eDP)Abundant I/O expansion: 1 M.2 B-key & 1 M.2 E-key, 3 USB 3.2 Gen2x1, 5 USB 2.0, 1 USB Type-C and 6 COMTHIN Mini-ITX low profile I/O stack design, fanless thermal solutionExtend operating temperature: -20C~70°C (-4 ~ 158 °F)
