-
Product
Flash Memory Test System
T5830
Test System
T5830 memory tester, the latest member of its T5800 product family, optimized for testing a wide range of flash memory devices used in mobile electronic devices. The highly flexible T5830 tester has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories.
-
Product
Parallel Memory Test Solution
Magnum2
-
Teradyne’s Magnum 2 test system delivers high throughput and high parallel test efficiency for high performance non-volatile memories, static RAM memories and logic devices.
-
-
Product
Memory Test System
T5230
Test System
T5230 memory test system for NAND/NVM devices adopts a combined array architecture to achieve best-in-class cost-of-test performance for wafer test, including wafer-level burn-in (WLBI) and built-in self-test (BIST). The system can perform on-wafer test of 1,024 memory devices per test head in parallel, delivering high productivity and enabling floor space savings of up to 86%. Multiple test cells are connected per system controller in the T5230, allowing independent wafer test of each test cell. The test cells can be stored in a general multi-wafer prober while minimizing the test cell floor space, and the tester can be docked with probers in both linear and multi-stack configurations. For functional tests at a maximum test rate of 125MHz/250Mbps, the T5230 assures high timing accuracy, repeatability, and failure detection capability.
-
Product
Memory Test System
T5851/T5851ES
Test System
The T5851 system is designed to provide a cost-effective test solution for evaluating high-speed protocol NAND flash memories including UFS3.0 universal flash storage and PCIe Gen 4 NVMe solid-state drives (SSD), both of which are expected to be in high demand for the LTE 5G communications market.
-
Product
Memory Test Systems
-
ICs that record and retain data are called memory devices. Our memory test systems are optimized for volume production of memory semiconductors, a market where low-mix high-volume production is the norm, and feature industry-best parallelism (the ability to test a large number of semiconductors at the same time).
-
Product
High Throughput 1 ns Pulsed IV Memory Test Solution
NX5730A
-
Precise and fast characterization of new memory, such as spin transfer torque magneto resistive random access memory (STT-MRAM) from DC to high-speed pulsed IV measurement on silicon wafers Apply accurate and high-speed pulsed voltages (down to 1 ns pulse) to magnetic tunnel junction (MTJ) for STT-MRAM and precisely measure the resistance of MTJ Perform all typical MTJ characterization tests in one solution10 to 100 times faster cycle test, such as a bit error rate test (BERT)Capture and visualize MTJ switching waveforms clearly during the writing pulse Dedicated solution with Keysight Technologies’ technical expertise
-
Product
High-Speed Memory Test Solution
UltraFLEX-M
-
The UltraFLEX-M builds on the advanced test technology and architecture of the proven UltraFLEX test system to ensure high test quality at the lowest cost of test for high-speed memory devices.
-
Product
Memory Test System
T5833/T5833ES
Test System
T5833 system is a cost-efficient, high-volume test solution capable of performing both wafer sort and final test of DRAM and NAND flash memory devices. Amid surging sales of mobile electronics, DRAMs, NAND flash memories and multi-chip packages (MCPs) — the main device types used in smart phones and tablets — are quickly evolving toward higher speeds and greater device capacity. Internet and cloud servers also are driving demand for faster, higher-capacity ICs. Yet the cost of testing today's wide array of memory devices is an obstacle for chipmakers, which urgently require solutions that can deliver high functionality, high performance and low cost of test (COT). Advantest's new, multifunctional T5833 memory test system meets these needs, delivering both wafer sort and final test capabilities for a full range of memory devices, including LPDDR3-DRAMs, high-speed NAND flash memories and next-generation non-volatile memory ICs.
-
Product
Memory Test System
T5511
Test System
Offering Multi-functionality and Industry's Top Test Speed of 8Gbps.
-
Product
DDR4 Pro Memory Test Adapter
-
This memory test adapter for the RAMCHECK LX includes an extraordinarily rugged test socket for many thousands of insertion/removal cycles.
-
Product
Ultra-high Performance Solution for Memory Device Test
Magnum EPIC
-
Teradyne’s Magnum EPIC is a high-performance test solution for latest generation DRAM devices. These devices are key enablers for technologies like 5G, AI, cloud computing, autonomous vehicles, AR/VR and applications with high definition graphics.
-
Product
Memory Test Systems
T5503HS2
Test System
Semiconductor memories are in high demand to meet the needs of fast-growing end markets such as portable electronics and servers. It has been forecasted that applications ranging from mobile devices and data centers to automobiles, gaming systems and graphics cards will consume an estimated 120 billion gigabits of DRAM capacity. To meet this market demand, new generations of memories with data-transfer speeds of 6.4 Gbps and higher are being developed. Advantest’s second-generation T5503HS2 tester is designed to handle these ultra-high-speed memory ICs.
-
Product
Memory Test System
T5221
Test System
The T5521 is a memory test system that supports wafer test and wafer burn-in test of non-volatile memory devices such as NAND flash, housed within a multi-wafer prober to reduce test floor footprint.
-
Product
Memory Test Software
-
Teradyne’s customers count on us for our Near Device Under Test (DUT) technology that gives memory device manufacturers a guaranteed performance advantage. A brief description of dynamic memory and storage memory devices will highlight why device manufacturers depend on Teradyne’s memory test solutions.
-
Product
Memory Test System
T5801
Test System
Capable of Testing Ultra-High-Speed DRAM Devices, Supporting Next-Generation GDDR7, LPDDR6, and DDR6 Technologies
-
Product
Memory Test System
T5835
Test System
The new T5835 has full testing functionality, from package testing to high-speed wafer testing, for any memory ICs with operating speeds up to 5.4 Gbps, including all next-generation memories from NAND flash devices to DDR-DRAM and LPDDR-DRAM. It can handle 768 devices simultaneously for final package-level testing. It additionally features functions such as an enhanced programmable power supply (PPS) for advanced mobile memories, and a real-time DQS vs. DQ function to improve yield.
-
-
Product
Generator/Analyzer for NFC/EMVCo Manufacturing Test
Micropross MP500 PT1-NFC
test
Support for ISO 14443 A/B, ISO 15693, MIFARE™, FeliCa™. Measurement correlation with NFC Forum and EMVCo certification test bench. Automated test executive with ready-to-run test sequences. Reader/Writer and Card Emulation modes, resonance frequency measurements supported on same antenna. Embedded analog measurements - LMA, field strength, S11, Q factor, waveform characteristics. Physical parameter/waveshape characteristic definition
-
Product
TestStand
test
TestStand is industry-standard test management software that helps test and validation engineers build and deploy automated test systems faster. TestStand includes a ready-to-run test sequence engine that supports multiple test code languages, flexible result reporting, and parallel/multithreaded test.
-
Product
BSD (Test Diagnostics)
test
BSD Test Diagnostics software can be added to either developer or factory run-time systems to further improve the location of faults such as net bridges (short-circuits), open pins, open nets and even ''twisted'' connections that can occur within cable assemblies. BSD Test diagnostics reports faults in a verbose English language statement with pin level information included and can easily interpret multiple fault conditions.
-
Product
Test Workflow Pro
test
Test Workflow equips engineers with application-specific tools so that they can choose the right one for the job—from graphical programing environments to no-code and interactive software applications. Engineers can use Test Workflow software to perform quick ad-hoc tests, build an automated test system, automate data analysis and reporting, develop test sequences, and more.
-
Product
NI Automated Test Software Suite
test
The NI Automated Test Software Suite features all three NI IDEs and NI's most popular application software and add-ons specifically for building your automated test system with confidence. This package offers the power of LabVIEW, LabWindows/CVI, and Measurement Studio combined with the TestStand ready-to-run, test executive and the Switch Executive intelligent switch management application
-
Product
Automotive Test Solutions
test
The testing and simulation systems from this division are used primarily in the automotive and automotive supplier industry. These are, for example, modular function-testing systems and diagnostic tools for automotive ECUs or bus communication systems for a wide variety of electronic components in automotive production. Electromechanical assemblies and entire car seats are also tested to ensure they function
-
Product
Memory Test System
T5830/T5830ES
Test System
Highly flexible tester which has all of the capabilities needed to perform wafer sorting and final testing of price-sensitive flash memories
-
Product
Design for Testability (DFT Test)
test
Corelis can provide you with design consultation and an analysis of your design for boundary-scan testability. We will review your design and make specific recommendations that if implemented will improve the testability. We can also suggest improvements that will increase test coverage and allow boundary-scan to be implemented in a more cost-effective manner.This service also includes a DFT test coverage analysis that we recommend to do after schematic capture and before PCB layout. At this stage of product development, Corelis provides you with a comprehensive test coverage reports that identifies all of the boundary-scan nets and pins and classifies them as completely tested, partially tested, or not tested. The report also recommends where to add test points (pads) for physical “nails” access if additional test coverage is required.
-
Product
Test Workflow Standard
test
Test Workflow equips engineers with application-specific tools so that they can choose the right one for the job—from graphical programing environments to no-code and interactive software applications. Engineers can use Test Workflow software to perform quick ad-hoc tests, build an automated test system, automate data analysis and reporting, develop test sequences, and more.
-
Product
ARINC-708 Module
M4K708
Test Module
The M4K708 module is an ARINC-708 / 453 2-channel test and simulation module for the Weather Radar Display Databus. The M4K708 supports two ARINC-708 / 453 channels, each selectable as transmit or receive.
-
Product
ARINC 818 Tester
Test Platform
iWave 3U VPX High-Speed Video/Data Processing Card is a rugged standalone module in the 3U VPX form factor, aimed for the high-speed data, video processing, and display applications is ideal for military, defense, and aerospace applications requiring an optimal balance of performance and power efficiency. iWave 3U VPX High-Speed Video/Data Processing Card is implemented using Xilinx Kintex-7 device architecture and has I/O interfaces including High speed 16 channels of transceiver interfaces capable of operating up to 6 Gbps data rate, Gigabit Ethernet, RS232, RS422, PCIe interface, Built-in health monitoring circuits, HDMI input, and output interfaces
-
Product
Test Fixture, Axial And Radial
16047A
Test Fixture
The 16047A is designed for impedance evaluation of axial/radial lead type devices of up to 13MHz. The 16047A employs Kelvin contacts which realize a wide impedance measurement range. The contact tip can be changed according to the device shape.
