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Product
Test Handler
M4841
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High-Throughput Device Handler for Volume Production Testing of MCUs and DSPs.
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Product
6TL36 Inline Handler
AM304
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Test handler 6TL36 able to test DUTs inside Faraday ChamberDual line (bypass)
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Product
Hybrid Single Site Test Handler
3110
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Chroma Hybrid Single Site Test Handler 3110 is a full range ATC (Active Thermal Control) test handler capable of handling device bodies up to 120x120mm with 450kg force load.
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Product
Die Test Handler
3112
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Chroma 3112 is a productive pick & place handler for high volume single- or multi-site bare die testing.
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Product
Test Handler
M6242
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Optimal Test Handler for Mass-Production DRAM, with Double the Throughput.
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Product
Test Handler
M4872
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Improve Efficiency in High-Volume Manufacturing and Device Characterization.
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Product
Single Site Test Handler
3210
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Chroma Single Site Test Handler 3210 supports various package types such as BGA series, QFP series, QFN, TSOP, and more. The handler is primarily designed for early device design and engineering validation.
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Product
Tabletop Single Site Test Handler
3111
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The Chroma 3111 is an automated pick & place handling system ideal for small lot engineering samples and/or NPI test development parts.
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Product
Wafer Level Test Handler
Kronos
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Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Product
ATOM Handler
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The ATOM-IC Handler is a benchtop handler designed for use on engineering test floors and in development operations. Its innovative design allows for maximum flexibility and minimum cost and maintenance.
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Product
Wafer Manufacturing
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Scientific Computing International
A procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits on semiconductor wafers in semiconductor device fabrication process.
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Product
Wafer Chucks
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ARC, in addition to fabricating Wafer Chucks from aluminum, is also known for its ability to work in hard to machine materials such as hardened (50-62 Rockwell) metal alloys, fired ceramics, e.g. SiC and glasses. These materials are often ideal for semiconductor equipment applications due to their ability to hold critical dimensions and tolerances. ARC specializes in surface grinding and lapping these materials to precision flatness and parallelism specifications needed for semiconductor wafer chuck requirements.
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Product
Logic Test Handler
M620
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- Maximized Productivity- Handles various device size- Short conversion time- Easy mantenance- Minimized footprint
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Product
Test Handler
JOT M5
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Simple, cost-effective way to automate PCB and pallet based testingSafe, reliable product handlingQuick-adjust ease: no product-specific partsFaster handling of smart productsIndustry 4.0 autonomous interconnectivityTruly scalable for growing test needsReusable, application-specific test boxesM-TestBoxes compatible with M1 handlerBoxes are fully independent, just pull out from M5 rack and use in off-line testingFail product separation to integrated magazineSpacious service-friendly constructionErgonomic workspaceTouchscreen UI with base statistics and service capabilityEasy start-stop operabilityAutomated width adjustment
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Product
Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
CCD Device Handlers
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Exatron has been in a unique position to supply handling systems for the new CCD device market. Manufacturers of CCD devices came to Exatron when these devices were new, looking for custom handling applications, and Exatron responded by modifying its Model 3000B, 3000BL, 5000, 5080, and 8000 systems to accommodate CCD devices.
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Product
Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Product
Test Handler
ETH
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The ENGMATEC test handler as the "heart" of our inline test solutions impresses with its wide range of applications for in-circuit, functional or final tests. All components of the modular system are coordinated with one another and can be combined with one another and with various production systems. Vision systems, scanners, marking devices and many other functions can be integrated.
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Product
Wafer Tester
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Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Product
Octal Test Site Handler
3180
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The Chroma 3180 is a productive pick & place system for high-volume multi-site IC testing.
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Product
Wafer Flatness Measurement System
FLA-200
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*Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)*Measures all materials including Si, GaAs, Ge, InP, SiC*Full 500 micron thickness measurement range without re-*calibration2-D /3-D Mapping software
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Product
Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Product
Wafer Inspection System
INSPECTRA® Series
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INSPECTRA® series meet the requests of 100% automatic inspection with high speed and high specifications from front-end to back-end of semiconductor processing. INSPECTRA® series are wafer inspection systems with high speed and high sensitivity. Our original "Die-to-Statistical-Image" comparison method achieves the target defects detection controlling process variation and overkill.
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Product
Wafer Prober
Prexa
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The latest fully automated 300mm wafer prober. The system offers excellent productivity and advanced functions, contributing to KGD (known good die) testing for advanced packaging.
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Product
Stand Alone Wafer Sorter
MicroSORT
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The Microtronic MicroSORT semiconductor wafer sorter is designed to maximize throughput while minimizing wafer handling in a user-friendly operating environment. This stand-alone semiconductor wafer sorter enables sophisticated semiconductor wafer sorter routines for up to 4 wafer-cassette platforms. MicroSORT semiconductor wafer sorter reads OCR scribes from the top, bottom, or simultaneously, allowing for enhanced semiconductor wafer tracking and sorting. The MicroSORT semiconductor wafer sorter’s basic functions include the ability to move, compress, randomize, find, align, verify, and split semiconductor wafer lots. With our virtual tweezer mode, an operator can click on wafer icons to move wafers between cassettes, read semiconductor wafers, and swap wafer positions.
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Product
Wafer Auto Line Integration
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The line is used for semiconductor wafer grinding. It carries out material matching and distribution, automatic loading and unloading, auto focusing and positioning and many other functions. The grinding precision is 2μm(3-sigma). It is also capable of collecting and analyzing real-time production data and interfacing with MES system.
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Product
High Parallel Test Handlers
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High parallelism test in strip or singulated device batch handling on carriers, WLCSP post singulation test.
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Product
ROV Thickness Gauges & Probe Handlers
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ROV Thickness Gauges & Probe HandlersCompleting the Cygnus ROV Mountable thickness gauges, a range of ROV Probe Handlers have been developed to offer an engineered probe handling solution. Each probe handler will work with a thickness gauge of the Cygnus ROV Mountable range listed below.
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Product
Wafer Demounting And Cleaning Machines
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Demounting and cleaning to high throughput fully automatic ingot after cutting in the slicing machine and wire saw.
