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Wafer Level Test Handler
Kronos
Wafer level test handler for 6/9DOF sensors with real stimulus. Very high UPH capacity and the lowest cost of test (COT). KRONOS is one of the only wafer level test solutions for motion sensors with real stimulus.
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Test Handler
M4171
Advantest’s M4171 single-site handler combines these capabilities in a portable design that is ideally suited for use in engineering environments.
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Test Handler
ETH
The ENGMATEC test handler as the "heart" of our inline test solutions impresses with its wide range of applications for in-circuit, functional or final tests. All components of the modular system are coordinated with one another and can be combined with one another and with various production systems. Vision systems, scanners, marking devices and many other functions can be integrated.
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Automated Fiber Handler
1200
The 1200 Automated Fiber Handler is the first fiber preparation product that enables optical fiber manufacturers to significantly reduce the cost of production measurements by automating the critical optical fiber stripping, cleaning, cleaving and temporary coupling processes.
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Wafer Probe Loadboards/PIB
DTS has a full line of standard PIBs for all major tester platforms. Custom PIB designs can accommodate any test head, prober and manipulator configuration, including probe card changers, overhead direct dock setups and cable interfaces. DTS wafer test loadboards are compatible with a variety of pogo pin interface towers. All PIBs are constructed with impedance control, precision matched line lengths, full power and ground planes and both analog and digital resources to provide high quality signal integrity directly to the device.
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Wafer Bonder
AML
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Wafer Level Test
Double sided wafer inspection system is an automatic inspection system for afterdicing wafer chip. It can do double side inspection simultaneously. The appearance defects of wafer chip are clearly conspicuous by using advanced illumination technology. Illumination and camera acquisition mode can be adjusted for various wafer process, like vertical chip or flip chip.
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Wafer Prober
Precio XL
Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Inline Wafer Testing
IL-800
Pre-process elimination of low-quality wafers using measured lifetime, trapping, and resistivity. Process control and optimization at dopant diffusion and nitride deposition steps.
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Tri-Temp Test Handler
JANUS 2800T Tri-Temp Handler
SESSCO Janus 2800T Tri-temp Handler is designed to accommodate small to medium size standard and custom IC packages. Supports high parallelism of up to octal sites and is equipped with dual high-speed input tube loaders and dual auto output tube unloaders for higher throughput up to 28K UPH. With over 500+ I/O and 16 temperature zones available, it has plenty enough resources for the most demanding applications. It can be customized for MEMS applications and high-voltage testing. Powered by a cutting-edge 10 ns/step all-integrated controller and modular programming design.
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Automated Test Handler
In-Line Duomax
100 % Automated Fixture Change1.5 N x 8000 Test PointsICT FCT EOL IntegrationHigh ProductivityHigh QualityGreat ROINo PLC
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Wafer Test Solutions
Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer and other advanced packages.
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Turret Test And Scan Handlers
Turret platforms for semiconductor test, inspection and packaging.
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Wafer Tester
Tokyo Electronics Trading Co., Ltd.
A vital step in the Semiconductor Value Stream, focusing on electrical screening and consumption of Known Good Die (KGD).
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Gravity Test Handlers
Extremely small to very large packages, very wide temperature range, high throughput octal site and quad site testing.
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Semiconductor Wafer Microscope Inspection System
MicroINSPECT
MicroINSPECT Semiconductor Wafer Defect Microscope Inspection System combines state-of-the-art robotics, intelligent microscopes and SITEview software to provide a flexible, easy-to-operate defect inspection platform for either micro or macro defect wafer inspection.
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High Speed Gravity Handler
MT9928 xm
This well-established test handler provides field-proven reliability and performance. Its modular and scalable design and variety of options allow configuration of the MT9928 exactly according to the test needs. Easy-access design and easy-to-change conversion kit parts support fast and easy package style changes. The MT9928 has a large soak capacity and features the entire tri-temp range at outstanding temperature accuracy and stability.
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6TL36 Inline Handler
AM304
Test handler 6TL36 able to test DUTs inside Faraday ChamberDual line (bypass)
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Wafer Inspection System
AutoWafer Pro™
AutoWafer pro is our most advanced ultrasonic equipment for detecting defects in bonded wafers in a production environment, providing fast, high-resolution scanning of 200mm and 300mm bonded wafers.
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Production Wafer Level Burn-in
TV19 VersaTile™ probe cards are designed with Celadon’s patented ceramic technology for superior electrical performance, yet is highly modular due to it’s 28mm x 28mm chassis. Micro-adjustments can be made in seconds with an allen wrench and a microscope. Easily align VersaTile cards for different wafer layouts using a 4.5” compatible 1×3 , 200mm, or 300mm VersAdjust plate.
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Rotary Table Handler
6000 Series Rotary Handler
Rotary table handlers are an excellent choice for PCBA or product – level test, programming, part marking, automatic part rejecting, and vision inspection in order to satisfy manufacturing applications that require high throughput. Rotary table based systems used in production can also help reduce the impact of load and unload times for the operator, because the device-under-test (DUT) automatically moves to the next cell within the station as each DUT is loaded. Circuit Check’s 6000 series handlers are modular, scalable and flexible, supporting high-mix and high-volume production needs. A common application example is to configure a 6000 series as a rotary station to perform simultaneous PCBA bar code scanning, testing, programming and marking, in a pipe-line process which improves throughput requirements. The 6000 series handlers leverage Circuit Check’s unique quick-change fixture drop-in technologies to allow for station modularity and scalability. Production line flexibility is achieved because the 6000 series handler is software and hardware agnostic, enabling adaptability to a variety of applications, and is limited only by the number of stations.
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CCD Device Handlers
Exatron has been in a unique position to supply handling systems for the new CCD device market. Manufacturers of CCD devices came to Exatron when these devices were new, looking for custom handling applications, and Exatron responded by modifying its Model 3000B, 3000BL, 5000, 5080, and 8000 systems to accommodate CCD devices.
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High-Throughput Film Frame Handler
MCT FH-1200
FH-1200™ film frame test handler is designed to handle leadless devices mounted on film frame, such as QFN, DFN, WLCSP, BGA, µBGA and eWLB packages. The FH-1200 enables high parallelism testing of post-saw IC devices at ambient temperature. It can accommodate 200 mm and 300 mm wafer rings and custom shapes onto which multiple strips can be mounted. No change kits are required regardless of package size (if same frame is used).
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RF Solution Integrated Handler
3240-Q
The Chroma 3240-Q is a unique and innovative handler with integration of RF/Wireless isolation chamber.
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Tube-To-Tube Gravity Handler
Rasco SO1000
The SO1000 test handler’s mature design and high reliability it provides excellent cost of test. Highly flexible as a result of a broad range of device kits can be combined with various Sensor and MEMS applications.Featuring a fast plunger with up to four plunger heads for high speed and high throughput with index time down to 500 ms. Available in single, dual, and quad configurations.
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MEMS Handler
4664-IH
The ULTRA P is a high performance production handler that provides thermal conditioning, full 6 DOF mechanical stimulus and an electrical ATE signal path for testing Micro-Electro-Mechanical Systems (MEMS) Accelerometers and Gyroscopes.
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ROV Thickness Gauges & Probe Handlers
ROV Thickness Gauges & Probe HandlersCompleting the Cygnus ROV Mountable thickness gauges, a range of ROV Probe Handlers have been developed to offer an engineered probe handling solution. Each probe handler will work with a thickness gauge of the Cygnus ROV Mountable range listed below.
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Die Sorter Handler
4605-HTR
4605-HTR is a MAP Sorter which picks up devices from wafer ring and sorts to tape or bin according to the MAP file created by film frame test handler or prober. 4605-HTR is a high speed handling system, available for 12 inches wafer rings. When used in combination with 4170-IH, 4605-HTR much improves efficiency in testing process of leadless devices as a high speed sorting machine.
