Integrators
Unite all or part of a test system. Integration
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±6 kV ANSI/ESDA/JEDEC HBM Test System
HBM-TS10-A
High Power Pulse Instruments GmbH
*±6 kV Human-Body-Model (HBM) tester according ANSI/ESDA/JEDEC JS-001 standard with C = 100 pF, R = 1.5 kΩ discharge network*Wafer, package and system level HBM testing*True HBM: the classical discharge network of the HBM-S1-A according the standard ensures compliant waveforms for all load conditions*No trailing pulses*Integrated 10 kΩ charge removal resistor*Integrated DUT HBM current sensor for real time transient current monitoring with 1V/A output sensitivity into 50 Ω digital oscilloscope input*Integrated DUT HBM voltage sensor for real time transient voltage monitoring with 1/200V/V output sensitivity into 50 Ω digital oscilloscope input*Integrated overvoltage protection of the DUT voltage sensor, DUTcurrentsensor and DC test interface for efficient overload protection of the digital oscilloscope and SMU during high voltage HBM testing*Integrated DC test DUT switch with automatic switch control*Integrated 50 Ω precision hardware trigger output for high speed digital oscilloscopes*Fast HBM measurements, typically 0.5s per pulse including one-point DC measurement between pulses*Eficient sofware for system control and waveform data management (fully compatible with TLP measurement data)*The sofware can control automatic probers for fast measurements of complete wafers*Compact size 145 mm x 82.5 mm x 44 mm of the integrated HBM pulse generator probehead*System controller size 483 mm x 487 mm x 133 mm*High performance and high quality components*Optionally available hardware upgrades to all HPPI fully integrated HBM/HMM/TLP/VF-TLP test systems TLP-3010C, 4010C, 8010A, and 8010C
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Transmission & Integrating Sphere FT-NIR Spectrometer
QuasIR™ 4000
The QuasIR™ 4000 was designed from the ground up to offer the industry a new kind of NIR analysis solution – a solution that brings together the portability required to move NIR analysis closer to point-of-need, combined with unmatched spectroscopic performance for the fastest and most accurate results.
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Parallel Differential Battery Tester With Integrated Chamber
Accelerate your battery parallel test using our PDBT. Featuring an integrated chamber, it precisely conducts battery comparison test and fast measures battery's self-discharge current. Its portable, powerful design is perfect for innovative research applications.
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Ethernet PHY
Macom Technology Solutions Holdings Inc.
MACOM’s portfolio of 10G/25G/40G/50G/100G Ethernet Physical Layer (PHY) devices offer unparalleled performance while maintaining high density at low cost. Integrated high-speed, high performance mixed signal I/O using advanced CMOS process nodes support a variety of optical and copper connectivity interfaces allowing the Ethernet PHY product line to span rack and cluster connectivity within the data center, wireless fronthaul, midhual and backhaul connectivity for 5G wireless infrastructure, and seamlessly extend to core networks over DWDM optical links. Advanced features such as in-service eye monitors, traffic monitoring, optical module identification and link training are just a few of the advantages that MACOM’s portfolio provides for end users to leverage for faster bring up, higher reliability and smarter networks.
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VLT Integrated Testlane Concept
VLT's intelligent test lane concept was introduced in 1994 and has since then been updated regularly. Intelligent test lanes are mainly used in PTI (Periodic Technical Inpsection) stations. These inspection stations deal with large numbers of vehicles every day and have to keep downtime of the equipment to an absolute minimum.
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Integrated Analyzer Systems
For over half a century, ABB has developed, manufactured, supplied and installed analytical instruments for the laboratory, process, environmental, steam and power industries.
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Multi-sensor Drug & Explosive Detection System
HDK
LDS Hybrid Detection Kit (HDK) - By operating the sensors in parallel, and in real-time, results in much higher probability of detection than the performance of each specific detector. Integrated solution including laser detection technologies, dual Ion Mobility Spectroscopy (IMS) and chemical detection, that operate in synch.
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Equipment Front End Module Wafer Handler
Sigma EFEM
Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.
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Ethernet Switch and Router
VPX6-684
Curtiss-Wright Defense Solutions
Curtiss-Wright's VPX6-684 FireBlade provides Systems Integrators with a fast, secure and unified approach to interconnect subsystems, chassis, cards, and compute nodes within any given platform using 1 or 10 Gigabit Ethernet links. Providing up to 24 wirespeed 10/100/1000 Mbps interfaces and up to four 10 Gbps interfaces in a single 6U VPX slot, the VPX6-684 Ethernet Switch is ideal for architecting system-wide Intra-Platform Networks (IPNs).
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BRIC™ - Large PXI Matrix Modules
High Density Packaging and Integrated BackplanesWith Pickering's BRIC Large PXI Matrix Modules, the use of high density packaging and integrated backplanes enables a large matrix to be implemented with no user configuration or special matrix expansion kits. These matrices use thru-hole mechanical relays (not surface mount) and can be serviced using standard de-soldering tools simplifying repair and reducing down time. Our BRIC's integrated design ensures high matrix performance with high signal bandwidth and fewer system implementation errors.
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LED Uniform Light Sources
Integrating sphere light source with LED illuminants (white, RGB-colored, NIR). Options available like variable output control and monitor detectors. We are experts in providing customer specific systems. Please contact us for all possible solutions and finding your perfect solutions. E.g. for EMVA 1288 Standard.
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In-Circuit Tester Integration
The benefits of boundary-scan are noticed in all phases of a product life cycle. By coupling the power of Corelis boundary-scan tools with an In-Circuit Tester (ICT), a complete, integrated solution is available that offers the best advantages of both technologies.Boundary-scan operates as the perfect companion to ICT. Boundary-scan is capable of testing areas of printed circuit board assemblies that are difficult to access due to physical space constraints and loss of physical access, which is often due to fine pitch components such as Ball Grid Array (BGA) devices. Conversely, the ICT is able to check the non-boundary-scan compatible portion of the unit under test (UUT) such as analog.
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Pulse Evaluation Systems
*Intuitive, user-friendly handling*Integrated wide-range power supply*Easily programmable output functions*Devices for monitoring standstill, speed, direction, slip, and frequency*Switching relays and transistor outputs, scalable analog output
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PathWave EM Design (EMPro)
Electromagnetic (EM) simulation brings you insight before physical prototyping. Customize EM simulations for speed and accuracy. Integrate EM analysis with your circuit simulations.
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Fanless Vision System With LGA1151 Socket 7th/6th Gen Intel® Core™ I7/i5/i3 & Celeron® Processor, Intel® H110, Vision I/O, 4-CH PoE And 4-CH LED Output
MVS900-511-FL
*Integrated real-time vision I/O**4-CH trigger input**4 trigger output**4-CH LED lighting control**2-CH quadrature encoder input**16-CH isolated DIO*Supports camera interfaces**4 IEEE802.3at GbE LAN ports (PoE)*Power input: 24 VDC (uMin=19V/uMax=30V)*-10°C to +60°C operating temperature range with W.T. SSD*Supports 2 swappable 2.5" HDD*Supports TPM 2.0 function
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Integrating Sphere Light Sources
Integrating sphere light sources with LED based or continuous broadband emission spectrum for use as luminance standards for camera calibration, for the determination of veiling glare, for the adjustment of night vision devices and much more. Diameters in the range from 50 mm to 500 mm with options like monitor detector, signal output control by manual and remote apertures and much more.
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High performance multisensor
Werth StentCheck®
High performance multisensor CMM with Integrated Werth Zoom® optic with magnification 0.7x – 6.8xRotary/Tilt Axis with high speed air bearing rotary axisRotary OnTheFly for fast measurementsContour image processing for fully automatic measurements of complex geometrical elements with sub-micron repeatabilityIntegrated goniometer (tilting axis) allows for the measurement of non-cylindrical geometriesUnique lighting design optimized for measurement of stentsTemperature compensation included
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The Integrator
L.Net converter
Electronic Solutions ULM GmbH & Co. KG
The great variety of the ESU ECoS command station is so convincing to many model railroaders that they would like to replace their present digital station with an ECoS. This also has been inspiring the desire to continue to use the existing handheld throttles and feedback modules. The ECoSniffer input offered at least a solution for handheld throttles (in combination with „older"digital command stations), whereas the feedback modules couldn’t be integrated into the system.
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AdvancedTCA® Carrier Blade with 4x Intel® Xeon® Processor E3-1515M v5 COM Express Modules and FM10420 Multi-Host Controller
aTCA-9400
- 4x COM Express Type 6 module slots supporting ADLINK Express-SL/SLE with Xeon® Processor E3-1515M v5 (45W)- Integrated Intel® GT4e GPU providing high-performance H.264/H.265 transcoding- COMe modules connected by Intel® Ethernet Multi-host Controller FM10420, supporting up to 25Gbps Ethernet bandwidth between CPUs- 2x 10G SFP+, 4x 1G RJ-45 Ethernet on front panel- 2x 10G to Fabric channels, 2x1G to Base channels
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300 Mm Semiconductor Processes
With the Center Nanoelectronic Technologies (CNT), the Fraunhofer IPMS conducts applied research on 300 mm wafers for microchip producers, suppliers, equipment manufacturers and R&D partners. In the field of FEoL and BEoL we offer the following technology developments and services at Ultra Large Scale Integration level (ULSI):
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Kelvin Test Contactor
cCompact
cCompact™ test contactor offers a reduced site-to-site pitch concept enables high parallel test for power applications on strip test and pick and place handler platforms.Featuring compact Kelvin footprint with outstanding CRES stability by Denmark pin material. Automotive temperature range -60°C to +175°C. Integrated Socket Air-distribution.
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RF/Microwave Components and Integrated Microwave Subsystems
PIN Diode Switches, PIN Attenuators, PIN Limiters, Video Products, Switching Assemblies, Integrated Subsystems
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High Speed Digital Camera
MEMRECAM Q1 Series
*The MEMRECAM Q1 Series cameras can operate as single stand alone cameras, or in a synchronized multi-camera system*Compact, rugged design – can withstand 150G shock for 10ms*Built-in Memory Backup is a standard feature (Up to 1 hour)*2/3-inch format supports standard C-mount and custom Hi-G lenses*62 (H) x 62 (W) x 65mm (D) , 400g.*Fully integratable with existing GX and HX Cameras*Supports simultaneous download of multiple MEMRECAM cameras*Power Input: 20-32 VDC*Power Consumption: 20W
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Integrated Dual Head (IDH) Multibeam Echosounder - Shallow Water
SeaBat IDH T20/50-R
The SeaBat Integrated Dual Head (IDH) is the latest addition to the leading SeaBat T-series product range. Connected to just one very compact Rackmounted Sonar Processor (RSP), the SeaBat IDH is a complete and powerful sonar system.The SeaBat IDH, which produces 1024 beams per ping, is fully frequency agile from 200 to 400kHz, allowing for improved swath performance, less interference from other sensors and reduced survey time under challenging acoustic conditions.
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WireScan
LPA56B Series
Strip and Seal Inspection100% in-process inspection and traceabilityFor Integration on Automatic Wire Processing Machines
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Electric Vehicle AC Charging Compatibility ATS
8000
It is a customized system for Electric Vehicle AC Charging Compatibility testing.Hardware : Integrated by AC Source/Power Meter/DC Source/Function Generator/Scope/ EVSE CP & PD Simulator…。Software : Fully complies with SAE-J1772, CNS15511 test requirements
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Milk Fat Analyzer
LD-LAMA-B10
Milk Fat AnalyzerLD-LAMA-B10based on Soxhlet extraction principle, determines fat and SNF (Solids Non Fat) content in milk by (gravimetric) weight method. Integrated with processes such as soaking, extraction, leaching, heating, condensation and solvent recovery by means of alkali solvent and oil chromatographic fat separation. Batch handling sample volume and automated fat extraction method ensures safe and effective sample handling. This fully automated milk fat analyzer delivers fast and safe determination of fat constituents in milk and milk powder.
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Class 2 Integrating Sound Level Meter
Castle Sonus GA216I
The Castle Sonus GA216i is a feature packed instrument, fully compliant with IEC 61672:2002 Class 2. This meter gives simultaneous Leq and peak measurements for assessments to the Control of Noise at Work Regulations 2005. It has a high-specification measurement microphone and is cased in tough, crack resistant ABS plastic. To comply with the Control of Noise at Work Regulations 2005, this Class 2 Sound Level Meter enables you to assess Noise in the workplace at fantastic value.
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Intel Atom® E3930 and Movidius™ Myriad™ X-Based Industrial AI Smart Camera Starter Kit
NEON-1000-MDX Series Kit
- Integration of intel E3930 and Movidius Myraid X, image sensor and vision software suites, ready to deploy- All-in-one design minimizes cabling, footprint and maintenance- FPGA base DI/O for accurate real-time triggering- Validated and comprehensive accessories, saves effort on surveying and debug
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YIG Integrated Products
With a 30 year YIG heritage, Teledyne RF & Microwave integrates YIG components with related microwave technologies, creating custom solutions that leverage the advantages of YIGs in cost-effective assemblies including synthesizers, receivers, converters and more.
