Wafer Failure Analysis
Defines the failure mode and then through additional testing determine it's cause.
See Also: Wafer, Wafer Thickness, Wafer Edge, Wafer Resistivity, Wafer Mapping, Wafer Probes, Wafer Probers, Wafer Inspection
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Product
Failure Analysis
MicroINSPECT 300FA
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The MicroINSPECT 300FA is an automated wafer inspection tool used for semiconductor wafer failure analysis. Its small footprint, high speed, and low cost relative to its rich features yield a superb cost of ownership and makes this an ideal tool for your fab or failure analysis lab. The MicroINSPECT 300FA combines advanced robotics, wafer sorting, an intelligent wafer inspection microscope together with SiteVIEW Software to produce an integrated failure analysis tool.
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Failure Analysis
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Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.
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Failure and Technology Analysis
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Failure analyses in order to clarify the failure cause soonest possible.From single device to the whole system - and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).
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Product
Wafer Analysis Systems
Tropel®
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Corning Specialty Materials has a long heritage of providing solutions to semiconductor equipment manufacturers. The Tropel line of wafer analysis equipment enables measurement of wafer substrates from 2” to 450mm regardless of material type and surface finish.
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Failure Analysis Services
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Innovative Circuits Engineering, inc
Innovative circuits engineerin's failure analysis group performs root cause analysis on a wide variety of integrated circuit devices.
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Failure Analysis And Magnetic Imaging Services
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Micro Magnetics offers failure analysis services on a contractual basis. We maintain two current density metrology systems at our headquarters in Fall River and can produce maps of current flow in a wide variety of ICs and packages, usually with initial results delivered within 48 hours. Our engineers will work closely with you to understand and interpret the results in order to determine the root cause of the failure.
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Root Cause Failure Analysis
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Maintenance Reliability Group, LLC
Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.Root Cause Analysis of Grease Lubricated Components: Root cause analysis includes a complete root-cause failure report and recommendations for further monitoring and corrective actions. MRG will test for grease consistency, oxidation, product contamination and wear metals utilizing Grease Thief® Analyzer die extrusion test, FTIR, RULER and RDE Spectroscopy. Testing includes Analytical Ferrography and Rheometer testing. Testing can include the submission of a failed component for extraction of grease from failed component and visual inspection for Root Cause Analysis.
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Benchmark, Competitive and Failure Analysis
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Helping you determine the root cause of product failures and evaluate products against industry competition and standards.We provide third-party verification and support for claims related to performance versus competition, root product failure cause, and benchmark industry performance. As an independent laboratory with over 60 years of product testing experience, our expertise helps you evaluate products for a variety of performance related characteristics. Additionally, we can provide expert witness legal testimony for insurance claims, CPSC filings, and civil/criminal court cases through our testing results and data.
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Partial Load Failure
PLF Device
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The control device series “PLF” has been designed to monitor the partial and/ or total failure of the alternating current absorbed by loads driven by static switches and / or electromechanical relays.
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Failure Analysis – Materials
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Failure analysis – materials is the investigation into the background or history of a sample, or an event, to determine why a particular failure occurred. A product failure may include premature breakage, discoloration or even an unexpected odor. It is useful to know if this failure is a new, unique occurrence or if it has been an ongoing issue. The investigation can involve analyzing the sample as it currently exists and extrapolating from that data what may have caused the failure. A sample of the “good” vs. “bad” product may also be useful for comparison purposes.
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Wafer Testing
Trio Vertical
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SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.
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Product
Wafer Bonder
AML
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Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses. The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
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Failure Analysis
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A partial list of our state of the art test equipment, applicable to these testing disciplines, will include the following: Two Scanning Electron Microscopes with EDS (SEM/EDS) Three Differential Scanning Calorimeters (DSC) Three Thermogravimetric Analyzers (TGA) Three Thermo Mechanical Analyzers (TMA) One Dynamic Mechanical Analyzer (DMA) Two Real-Time Fluoroscopic X-ray Systems, including a Microfocus System One Fourier Transform Infrared Microscope (FTIR) (capable of identifying a single particle of an unknown material) Two Ion Chromatographs (IC) (capable of identifying ionic impurities in ppm)
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Product
Wafer Inspection Machine
IV-W2000
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The IV-W2000 is a wafer inspection machine that features on-the-fly scanning and inspection as well as automatic handling of 6/8/12-inch wafers. With the option to have a Chinese language UI, this machine is also known for being intuitive and user-friendly.
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Wafer Prober
Precio XL
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Fully automated 300mm wafer prober. The system achieves high productivity, excellent contact performance, improved cleanliness, and short lead time, and offers a number of high value-added functions as options.
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Wafer & Die Inspection
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SemiProbe wafer inspection system (WIS) examines, locates and identifies defects created during wafer manufacturing, probing, bumping, dicing or general handling. This provides microelectronic device manufacturers with accurate, timely quality assurance and process information. The WIS has single sided and double sided wafer mapping capabilities and can improve efficiency, reduce manufacturing costs, increase yields and shorten time to market.
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Failure Analysis Services
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BMP Testing and Calibration Services Inc.
Failure analysis plays a crucial role in product development that enables industries to prevent future product failures and improve them for the end-user. It’s a multi-faceted approach to finding how and why a product failed and involves an in-depth investigation of the circumstances surrounding the failure and discovery of relevant background information, including but not limited to the type of application, environmental factors, service life, and pertinent design information.
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Structural Analysis
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With proven accuracy every time, Altair offers industry-leading engineering analysis and optimization tools from simulation-driven design concepts to detailed virtual product validation and simplified modeling workflows to advanced high-fidelity model building. Whether big or small, our customers trust their decision making to Altair, the pioneer of simulation-driven design.
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Construction Analysis
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Customers of MASER Engineering that are using electronic components and materials are interested in the manufacturing quality and used materials.
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Acoustic Analysis
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Noise is increasingly the subject of new regulations for the protection of human health and safety as well as for improving the environment in general. As well as sound levels, the perceived sound quality of products from washing machines to vehicles is often an important part of the customer buying decision so must be considered during product development. m+p Analyzer for noise and vibration measurement and analysis provides a full range of capability for these applications. Real-time fractional octave filters satisfy all acoustic applications from simple sound pressure, sound power for equipment legislative requirements, intensity mapping to isolate sources to sound quality metrics for product refinement.
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Vibration Analysis
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The vibration analysis software WaveImage includes a full set of methods providing an accurate and detailed overview of your vibration measurement data. This gives you a clear understanding of the cause-and-effect relationships between specific excitations and their vibrational response. Create a simple geometry model of your structure and link your multi-channel measurement data to the points in the geometry where the data was recorded. Then visualize the dynamic deformation of the structure under specific operating conditions with a detailed animation.
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Gas Analysis
HPR-40 DEMS
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The Hiden HPR-40 DEMS is a bench top or mobile cart mounted module for analysis of dissolved species in electrochemistry. The system is modular and adaptable. The system includes two differential electrochemical mass spectrometry ‘DEMS’ cell inlets, designed for material/ catalysis studies, cell type A, and electrochemical reaction studies, cell type B.
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Wafer Probers
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Devices to align probes to test the electrical properties of IC chips or TEGs (Test Element Groups) formed on wafers. The vast options available will meet various needs, from research to mass production.
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Gasoline/Fuel Analysis
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A gas chromatograph is used for composition analysis of gasoline and its additives in order to improve fuels' performance. In addition to excellent performance, Shimadzu's GC systems improve productivity. For example, the Nexis GC-2030 system combines three standards into one to save analytical instrument and labor costs.
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Wafer Probe Heads
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WLCSP test is the applying final test conditions at Wafer Level. WLCSP testing is driven in lowering the cost of test of devices through economical methods of manufacturing and testing.
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Acoustics Analysis
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The sounds a product makes directly impact on user experiences. Sounds create strong emotions — positively or negatively — that reinforce brand identity. The difficulty of predicting acoustic results means that a single engineering mistake can prove costly to the final product, making Ansys Acoustics Analysis a powerful solution to ensure optimal acoustics and a successful end product.
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Product
Flexoplate Analysis
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Quality Engineering Associates Inc.
QEA has the most comprehensive and sophisticated lineup of evaluation tools for flexography, one of the fastest-growing sectors in commercial printing. Our test tools quantify flexo plates, film, masks, photopolymer- and metal-backed plates and sleeves, letterpress, newsprint and direct-engraved plates, as well as the final print.
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Fat Analysis
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Unlike standard x-ray systems which use a single x-ray energy spectrum to scan products, DEXA technology uses two energy spectrums to discriminate between high and low energy x-rays. A patented software algorithm uses the differential x-ray energy absorbance of these two energies by the meat to determine the fat content.
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Sample Analysis
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With the wide range of particle characterization methods, having the right measuring device readily available and fully utilized can be challenging. At Particle Metrix, we offer professional sample analysis in our application laboratories, ensuring precise and reliable results. Our comprehensive consulting services complete our offering.
