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Product
Cantilever Spring Pin ULTRA
CONTACT Series
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ULTRA® CONTACT Series offers high yield, durability and consistent performance under the most demanding testing environment. Our design offers easy integration to most test handler platforms and on automotive devices.
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Product
Automatic System Function Tester
3260
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Chroma 3620 is an innovative system handler for high-volume multi-site IC testing at the system level.
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Product
High-Speed Laser Mark Handler
MCT MH-3300
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MH-3300™ high-speed laser mark handler is used for marking of 2DID codes on the lead frame in support of strip testing, marking of reject devices, and for final package marking in strip test or assembly operations. The MH-3300 offers unparalleled throughput performance and the best cost-of-ownership in the industry.
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Product
ROV Thickness Gauges & Probe Handlers
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ROV Thickness Gauges & Probe HandlersCompleting the Cygnus ROV Mountable thickness gauges, a range of ROV Probe Handlers have been developed to offer an engineered probe handling solution. Each probe handler will work with a thickness gauge of the Cygnus ROV Mountable range listed below.
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Product
Gravity Feed - Benchtop
3000B
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Exatron's Model 3000B Series of automatic component handlers integrates customer-specific ambient temperature programming and/or test sites and up to eight automatic device inputs and outputs.
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Product
Software Tool Especially Designed for Production Process Supervision
LEON OP
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The Leon OP is a software tool especially designed for production process supervision. Therefore, the application provides the following key features:- Execution of KT ICT sequences or NI TestStand sequences- Parallel, semi-parallel or sequential execution of test sequences, individually definable per Test Sequence- Customizable User Interface, simple or detailed test views, grid or board layout arrangement possibilities- Tracing into sequence execution- User management with different user levels and restrictions per user group- Displaying execution results and statistics by panel or nest- Supporting interaction with an automation (e.g.: handler system)- Supporting interaction with a process control / MES system- Integrated Callback structure to adopt to different workflows- Maintenance view for fast displaying of fails inside a board- Result History View to quickly access the last test results- Store execution results in result files with user defined format- Autostart-option for running application in automation mode without any operator interaction at all- Several abortion criteria to abort execution by fail count (consecutive or time based)- A Maintenance View for viewing testprobe locations on the DUT is available via Aster Quadview
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Product
Die-To-Wafer Bonding Systems
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Several different D2W bonding methods are available and selected depending upon the application and customer requirements. In direct placement D2W (DP-D2W) bonding, the singulated dies are bonded to the target wafer one by one using a pick-and-place flip-chip bonder. Plasma activation and cleaning of the surfaces of the dies on the handler wafer are essential steps for establishing a high-yielding bond and electrical interface between the dies and target wafer. This is where the EVG320 D2W activation system comes in.
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Product
TestStation Automated Inline Handler | In-Circuit Test Solution
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Teradyne’s High-Speed Inline Automated Board Handler with TestStation Multi-Site Test Insert is designed for productivity, fast change-over, and low operating cost. Our in-circuit test solution fits seamlessly into automated production lines to provide “hands-off-lights-out” operation.
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Product
MEMS Handler
4664-IH
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The ULTRA P is a high performance production handler that provides thermal conditioning, full 6 DOF mechanical stimulus and an electrical ATE signal path for testing Micro-Electro-Mechanical Systems (MEMS) Accelerometers and Gyroscopes.
