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Computer On Modules
COM Express Compact
Advantech COM-Express Compact includes Intel core i, Intel 5th Generation, Intel atom processor, which are all designed with low power consumption processors. They perform the same functions and same pin definitions as the COM-Express Basic module but with smaller board dimensions of 95 x 95 mm. And COM Express Compact series provide from Intel core i, Intel 5th Generation, Intel atom processors, and is the best solution for mobile applications.
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COM Express R3.1 Type 6 Compact Size Module Based On Intel® Core™ Ultra Processors
cExpress-MTL
Featuring Intel’s latest Intel® Core™ Ultra processors (formerly “Meteor Lake-U/H”), the cExpress-MTL, a COM Express® COM.0 R3.1 Type 6 Compact size module, presents Intel’s modular architecture that combines CPU+GPU+NPU all-in-one to the embedded market. It provides up to 8 GPU Xe-cores (128 EUs), an 11pTOPS/8.2eTOPS NPU, and 14 CPU cores at 28W TDP.
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COM Express Compact Size Type 6 Module With Intel Atom® Or Intel® Celeron® Processor SoC (Formerly Codename: Bay Trail)
cExpress-BT
The cExpress-BT is a COM ExpressR COM.0 R2.1 Type 6 module supporting the Intel Atom® processor E3800 Series and Intel® Celeron® N2900/J1900 processor SoC (codename: Bay Trail). The cExpress-BT is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.
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Ultra-Small SBC Using COM Express Type 10 CPU Modules
ZETA
The Zeta COM Express SBC family of ultra-small embedded computer boards combines a COM Express Mini CPU module with a same-size carrier board to create a complete embedded PC. Designed in the COM Express Mini Type 10 form factor (84 x 55mm/ 3.3 x 2.2 in), Zeta provides an ultra-compact, industry-standard form factor solution.
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COM Express Module
CM22202
LinkedHope Intelligent Technologies Co.,Ltd.
CM22202 is a Type 6 COM Express® module developed by LinkedHope® based on China local x86 architecture ZX® KX-6000 series Processors. This module pinout is compliant with PICMG COM.0 R3.0 specification. CM22202 contains all kinds of high-speed interfaces such as SATA III, USB 3.0 and PCIe 3.0. CM22202 provides dual-channel SO-DIMM, supporting DDR4-2666 MHz memory and the capacity up to 32GB.CM22202 supports KX-6000 series 4 core processors which TDP from 25W to 55W. CM22202 provides high performance computing with balanced power consumption. CM22202 works well in a wide range temperature environment. It is ideal for the high-bandwidth and processing intensive requirements of industrial and edge computing applications.
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COM Express Type 6
The release of COM Express COM.0 Revision 2.0 brings Computer-on-Modules in line with current and future technology trends by providing for the latest graphics interfaces (DisplayPort/DVI/HDMI), PCI Express Gen 2, and USB 3.0. The newer Type 6 pinout is based on the popular Type 2 pinout, but with legacy functions replaced by Digital Display interfaces (DDI), additional PCI Express lanes, and reserved pins for future technologies.
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COM Express Type 2 Basic Module With Intel® Celeron® Processor J1900/N2807
CEM841
The CEM841 computer on module is based on the ultra-low power Intel® Celeron® processor J1900/N2807 which provides impressive CPU and graphics performance improvements. The CEM841 is equipped with double deck DDR3L SO-DIMM sockets supporting system memory maximum up to 8 GB. Coming with 8 PCI Express lanes, the power efficient system module is designed with all necessary components and offers the most updated bus interfaces targeting at POS and kiosk systems, gaming, medical PCs and HMI and industrial automation controllers.
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COM Express Type 7
The COM Express Type 7 modules deliver powerful server-class performance in a small form factor. Its high-speed interfaces and extreme performance increases the flexibility for building up Industrial IoT applications which are in need of multi-tasking, multi-threading or video rendering. Axiomtek’s COM Express Type 7 modules are well-suited for integration into compute-intensive and space-constrained applications in need of high data and network throughput, such as edge computing, micro server, data transmission device, and other networking fields.
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Multipurpose Debug Board
DB40 Debug Module
The DB40 Debug Card is designed for debugging of COM Express and PC/104 boards. It includes the following features: - Port 80/81 decoding for Power On Self Test (POST) via LPC - Interface to SPI Flash for BIOS update - Interface to Board Management Controller (BMC) for update - Power and Reset buttons and status LEDs The DB40 Debug card can only be used on products that have the appropriate FFC debug connector designed for this purpose. (Includes DB40 Debug Module, two 40-pin FFC cables, and 14-pin cable for SP100 DediProg USB to SPI programmer.)
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COM Express Compact Size Type 6 Module with Next Generation Intel Atom® Processor SoC
cExpress-EL
ADLINK cExpress-EL supports next generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.
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COM Express Compact Size Type 6 Module with Mobile 7th Gen Intel® Core™ and Celeron® Processors (formerly codename: Kaby Lake)
cExpress-KL
The cExpress-KL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module featuring the 64-bit 7th Generation Intel® Core™ i7/i5/i3 and IntelR CeleronR Ultra-Low TDP processors (formerly "Kaby Lake U") with CPU, memory controller, graphics processor and I/O hub on a single chip.
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COM Express Type 6 Compact Module With Intel® Atom® X5 And X7 Processor
CEM312
The CEM312 supports Intel® Atom® x5 and x7 processors in a board size of 95 x 95 mm. It has two 204-pin DDR3L-1600 SO-DIMMs with up to 8GB of system memory and an optional eMMC for a maximum of 64GB memory. The COM Express Type 6 module is integrated with Intel® Gen 9 graphics and supported with DX12.0, OCL 2.0 and OGL 4.3 for immersive graphics and media performance with a resolution up to 4K. Moreover, the industrial grade system on module can operate under wide temperature ranging from -40 to 85°C (-40°F to 185°F). The Intel® Atom®-based computer module also offers diverse comprehensive I/O interfaces to meet requirements for a variety of industrial applications. The CEM312 can serve as an excellent solution for graphics-intensive, industrial IoT applications such as industrial control, medical imaging, digital signage, gaming, military, and networking.
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COM Express Type 6 Application Board With LVDS, VGA, DDI, Dual LANs And Audio
CEB94021
*125 x 95 mini size form factor*2 GbE LANs*SATA-600*LVDS, VGA and DDI*4 USB 2.0 and 2 USB 3.0*2 PCI Express Mini Card slots*3 RS- 232/422/485 and 1 RS-232
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COM Express Basic Size Type 7 Module with Up to 16 Cores Intel Xeon D and Pentium D SoC (formerly codename: Broadwell-DE)
Express-BD7
The Express-BD7 is a COM Express COM.0 R3.0 Basic Size Type 7 module supporting the 64-bit Intel Xeon processor D and Intel Pentium D processor system-on-chip (SoC) (formerly "Broadwell-DE"). The Express-BD7 is specifically designed for customers who need excellent computing performance with balanced power consumption and multiple 10G Ethernet connectivity in a long product life solution.
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COM Express Type 10 Mini Module With Intel® Atom® X5 And X7 Processor
CEM310
The CEM310, a COM Express Type 10 Mini module, supports Intel® Atom® x5 and x7 processors (codename: Apollo Lake) in a board size of 84mm x 55mm. It has 8GB of DDR3L onboard memory and an optional 64GB eMMC memory. The Intel® Atom®-based COM Express Type 10 Mini module comes with a variety of I/O and expansion options including four PCIe x1 lanes, one Gigabit LAN port with Intel® i210IT Ethernet controller, two USB 3.0, eight USB 2.0, two SATA-600, four digital I/O channels, HD Codec audio, one DDI, one LVDS, one LPC, one SPI, two serial TX/RX and one I2C to meet customer requirements. Aside from the rich I/O options, the CEM310 has a wide voltage input range of 4.75V to 20V to meet the varying voltage input requirements for automotive or transportation applications. In addition, it supports an extended operating temperature range from -20ºC to +70ºC or optional -40ºC to +85ºC to ensure stable and reliable operation in harsh environments. The CEM310 supports watchdog timer, hardware monitoring functions, SMBus as well as smart battery (optional).
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COM Express® Type 6 R3.1 Reference Carrier Board In ATX Form Factor
Express-BASE6 R3.1
Express-BASE6 R3.1 is an ATX COM-Express Type 6 Basic / Compact size module reference carrier board based on PICMG COM-Express Revision 3.1. Together with the COM-Express Type 6 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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COM Express® Type 7 Reference Carrier Board in ATX Form Factor
Express-BASE7
The Express-BASE7 is an ATX size COM Express Type 7 reference carrier board. Together with the COM Express Type 7 module of your choice and off the shelf add-on cards, you can quickly emulate the functionality of your desired end product for software development and hardware verification.
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COM Express Type 6 Basic Module With Intel® Xeon® & 8th Gen Intel® Core™ Processors And Intel® CM246/QM370/HM370
CEM520
The CEM520 is a high-performance COM Express Type 6 basic module featuring triple independent displays, industrial operating temperatures and rich expansions. The CEM520 is based on the Intel® Xeon® E-2176M and 8th generation Intel® Core™ i7/i5/i3 processors (codename: Coffee Lake) with the Intel® CM246/QM370/HM370 chipset. The system-on-module is equipped with dual DDR4-2666 SO-DIMM slots for up to 32GB of system memory. Its wide operating temperature range of -40°C to +85°C strengthens the adaptability of harsh operating conditions. Integrated with Intel® Gen 9 graphics, and with the support of DX11/12, OCL 2.0 and OGL 4.3/4.4, the Intel® Xeon® and Core™-based computer-on-module presents excellent graphics performance with a resolution up to 4K. Three independent displays are supported through one LVDS, one VGA and two DDI ports for HDMI, DisplayPort. The CEM520 comes with multiple I/O connectors including four SATA-600 interfaces with RAID 0/1/5/10, one Gigabit LAN port with Intel® i219-LM controller, four USB 3.0 ports, eight USB 2.0 ports, and 4-In/Out DIO port. Also, the system-on-module is expandable with one PCIe x16 slot and eight PCIe x1 slots, as well as LPC and SMB expansion buses. Trusted Platform Module 2.0 (TPM 2.0) is supported to provide efficient hardware-based data protection. This new powerful COM Express Type 6 module is compatible with Windows® 10 and Linux operating systems. It also supports AMS.AXView – Axiomtek’s exclusive software for smart device monitoring and remote management applications.
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COM Express Rev. 3.1 Basic Size Type 7 Module with AMD Embedded Ryzen™ V3000
Express-VR7
ADLINK’s Express-VR7 COM Express Type 7 Basic size module is based on AMD Embedded Ryzen™ V3000 series processor. Offering up to 8 cores and 16 threads at 15W/45W TDP, the module exhibits the best performance per watt in its class, along with 14x PCIe Gen4 lanes with enterprise level reliability and extreme rugged temperature option (-40°C to 85°C).
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COM Express Type 6 evaluation carrier board
ATX-M-CC462-T6
The ATX-M-CC462-T6 is a fully featured COM Express Type 6 evaluation carrier board designed for use with the WINSYSTEMS Intel® Tiger Lake UP3 COM Express and other COM Express Type 6 modules.
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COM Express Type 10 Starter Kit Plus
COM Express Type 10 Starter Kit Plus
The COM Express Type 10 nanoX Starter Kit Plus consists of a COM Express Type 10 core module reference carrier board that provides two PCIe Mini Card slots, 2 RJ-45 LAN ports, 2x USB 3.0, 2x USB 2.0, 1x USB client, 2x DB-9 COM, 1x SD card socket, and Mic/Linein/ Line-out. ADLINK also provides additional development tools including a verified 10.1" LVDS panel (optional), power supply, thermal solution and cabling accessories.
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COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor (formerly codename: Alder Lake-P)
Express-ADP
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express module to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
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COM Express Type 10
The COM Express Type 10 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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COM Express Type 6
The COM Express Type 6 modules are designed with all components necessary and offer the most updated bus interfaces. The COM Express modules satisfy a wide range of vertical embedded applications with features of great computing performance and rich I/O capabilities, and reduce customers' time-to-market and ownership cost.
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COM Express® Type 2 Reference Carrier Board in ATX Form Factor
Express-BASE
The COM Express approach of custom carrier combined with off the shelf system cores is an excellent solution when you need to customize but lack the time or quantity for a complete redesign. It fits most system integration projects with production volumes from 500 to 10,000 pcs per year. The COM Express concept has a great many advantages over full custom designs, it reduces engineering complexity, lowers the threshold for total project quantity and last but not least brings your product to the market in no time. The average time to design a carrier board is less than half the time of a full custom OEM board.
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Single Board Computers
SBC
Our extensive line of compact, rugged SBCs is based on CPUs targeting embedded applications, ranging from the economical AMD LX800 and Vortex86DX to the high performance Intel Core i7 latest generation U series Skylake/Kaby Lake. These products adhere to industry-standard form factors such as PC/104, COM Express, ETX, EPIC, and EBX.
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COM Express Type 7 Basic Size Module with Intel® Xeon® D-1700 Processor (formerly codename: Ice Lake-D)
Express-ID7
ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it provides precise control of hard-real-time workloads across all networked devices.
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COM Express Type 6 Compact Module With Intel® Pentium® Processor N4200 & Celeron® Processor N3350
CEM313
The CEM313, a COM Express® Type 6 compact module, is built with the 14nm Intel® Pentium® N4200 and Celeron® N3350 quad-core/dual-core processors (codename: Apollo Lake). Integrated with Intel® Gen 9 graphics, the COM Express® type 6 module prevails in its excellent graphics performance while supporting DX12.0, OCL 2.0, OGL 4.3 with resolution up to 4K (3840 x 2160 @ 30 Hz). Furthermore, two 204-pin SO-DIMM DDR3L-1600 have been deployed in the CEM313 up to a maximum of 8 GB Overall. With the innovative design of low power consumption, wide temperature range, and seismic resistance, the CEM313 can be served as an excellent solution for graphics-intensive applications over the IIoT, including industrial control, medical imaging, digital signage, gaming machines, military, and networking.
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Computer On Module
ITX-M-CC452-T10
The ITX-M-CC452-T10 is an industrial Mini-ITX small form factor Type 10 reference carrier board designed to fully test WINSYSTEMS’ COMeT10-3900 COM Express Type 10 Mini module. The carrier board adheres to the PICMG COM Express specifications providing compatibility with other COM Express mini type 10 modules.
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Computer On Module
COMET6-DEVKIT-460-I7
The COMET6-DEVKIT-460-I7 is designed for rapid testing and evaluation of WINSYSTEMS’ COM Express Type 6 processor modules. This DevKit ships with WINSYSTEMS’ COMET6-1185GRE-32IL module and 11th Gen Intel® CORE™ i7 UP3-Class embedded processor. The DevKit includes all essential components for quick and easy system setup so you can start programming right out of the box, reduce engineering and software development time, perform rapid product evaluation, design validation, and speed time to market.
